including bonding areas providing primarily mechanical bonding

Industry

CPC
H01L2224/06517

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06517including bonding areas providing primarily mechanical bonding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,009,323
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,002,772
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure, and method for forming thereof
- Patent number 11,996,375
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate, display panel and display device
- Patent number 11,942,443
- Issue date Mar 26, 2024
- HEFEI BOE DISPLAY TECHNOLOGY CO., LTD.
- Chunxu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor testing device, and semiconduct...
- Patent number 11,927,622
- Issue date Mar 12, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masashi Tokunaga
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 11,923,279
- Issue date Mar 5, 2024
- Sony Group Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack and integrated device structure including improved bondin...
- Patent number 11,869,859
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 11,869,853
- Issue date Jan 9, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Ikue Mitsuhashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating integrated circuit device
- Patent number 11,804,458
- Issue date Oct 31, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Qiong Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor device, and semiconductor package...
- Patent number 11,784,168
- Issue date Oct 10, 2023
- Samsung Electronics Co., Ltd.
- Yongwon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of treatment of an electronic circuit for a hybrid molecular...
- Patent number 11,715,710
- Issue date Aug 1, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Emilie Bourjot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package and methods of manufacture thereof
- Patent number 11,664,349
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through semiconductor via and method for...
- Patent number 11,664,364
- Issue date May 30, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for improving bonding reliability
- Patent number 11,658,139
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,626,356
- Issue date Apr 11, 2023
- Sony Group Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure, and method for forming thereof
- Patent number 11,616,034
- Issue date Mar 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,587,857
- Issue date Feb 21, 2023
- Sony Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,569,190
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly employing metal-semiconductor bonding and metal-met...
- Patent number 11,562,975
- Issue date Jan 24, 2023
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
- Patent number 11,502,051
- Issue date Nov 15, 2022
- SK hynix Inc.
- Ho Young Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing apparatus
- Patent number 11,482,564
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Sung Hyun Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,456,263
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bonding pads and method of manufactu...
- Patent number 11,380,638
- Issue date Jul 5, 2022
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor device, and semiconductor package...
- Patent number 11,342,310
- Issue date May 24, 2022
- Samsung Electronics Co., Ltd.
- Yongwon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembly by direct bonding between two elements, each ele...
- Patent number 11,305,372
- Issue date Apr 19, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Lea Di Cioccio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure having pads and conductive wire
- Patent number 11,069,646
- Issue date Jul 20, 2021
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 10,950,568
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,867,952
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package and methods of manufacture thereof
- Patent number 10,840,217
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD
- Publication number 20240355765
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DUAL DAMASCENE AND DUMMY PADS
- Publication number 20240332229
- Publication date Oct 3, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240274554
- Publication date Aug 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE, AND METHOD FOR FORMING THEREOF
- Publication number 20240274560
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240250047
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234342
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20240234340
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE
- Publication number 20240178167
- Publication date May 30, 2024
- Huawei Technologies Co., Ltd
- Ran HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136307
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DUMMY CONDUCTIVE MEMBER AND MANUFACT...
- Publication number 20240096828
- Publication date Mar 21, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DUMMY CONDUCTIVE MEMBER AND MANUFACT...
- Publication number 20240096829
- Publication date Mar 21, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structure with Stress Buffer Zone and Method of Forming Same
- Publication number 20240006352
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- SyuFong LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20240006349
- Publication date Jan 4, 2024
- Sony Semiconductor Solutions Corporation
- Ikue MITSUHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DUMMY PAD
- Publication number 20240006356
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- INHYO HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING HYBRID BONDI...
- Publication number 20230402413
- Publication date Dec 14, 2023
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING HYBRID BONDING PAD
- Publication number 20230402414
- Publication date Dec 14, 2023
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLAMPED SEMICONDUCTOR WAFERS AND SEMICONDUCTOR DEVICES
- Publication number 20230326887
- Publication date Oct 12, 2023
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding Pads and Methods of Forming the Same
- Publication number 20230307392
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230307412
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, WAFER, AND WAFER MANUFACTURING METHOD
- Publication number 20230307396
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Yasunori IWASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20230299023
- Publication date Sep 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...
- Publication number 20230282607
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Ting Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230275053
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260940
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE, AND METHOD FOR FORMING THEREOF
- Publication number 20230197653
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND SEMICONDUCTOR STRUCTURE
- Publication number 20230154867
- Publication date May 18, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230098931
- Publication date Mar 30, 2023
- SONY GROUP CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACK AND INTEGRATED DEVICE STRUCTURE INCLUDING IMPROVED BONDIN...
- Publication number 20230061861
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICE
- Publication number 20230020810
- Publication date Jan 19, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Qiong ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE
- Publication number 20220394207
- Publication date Dec 8, 2022
- Sony Semiconductor Solutions Corporation
- YOSHIAKI TASHIRO
- H01 - BASIC ELECTRIC ELEMENTS

including bonding areas providing primarily mechanical bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device assembly with surface-mount die support struct...

Semiconductor structure

Semiconductor device with composite conductive features and method...

Integrated circuit structure, and method for forming thereof

Array substrate, display panel and display device

Semiconductor device, semiconductor testing device, and semiconduct...

Semiconductor device

Die stack and integrated device structure including improved bondin...

Semiconductor device and electronic device

Method of fabricating integrated circuit device

Semiconductor chip, semiconductor device, and semiconductor package...

Method of treatment of an electronic circuit for a hybrid molecular...

Stacked chip package and methods of manufacture thereof

Semiconductor device with through semiconductor via and method for...

Semiconductor package for improving bonding reliability

Semiconductor device

Integrated circuit structure, and method for forming thereof

Semiconductor device

Semiconductor structure and manufacturing method thereof

Bonded assembly employing metal-semiconductor bonding and metal-met...

Semiconductor chip including through electrode, and semiconductor p...

Image sensing apparatus

Semiconductor structure and method for forming the same

Semiconductor device including bonding pads and method of manufactu...

Semiconductor chip, semiconductor device, and semiconductor package...

Method of assembly by direct bonding between two elements, each ele...

Printed circuit board structure having pads and conductive wire

Semiconductor device assembly with surface-mount die support struct...

Semiconductor structure and manufacturing method thereof

Stacked chip package and methods of manufacture thereof

Patents Applicationslast 30 patents

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD

SEMICONDUCTOR DEVICE WITH DUAL DAMASCENE AND DUMMY PADS

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

INTEGRATED CIRCUIT STRUCTURE, AND METHOD FOR FORMING THEREOF

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGES AND METHODS

CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE HAVING DUMMY CONDUCTIVE MEMBER AND MANUFACT...

SEMICONDUCTOR STRUCTURE HAVING DUMMY CONDUCTIVE MEMBER AND MANUFACT...

Bonding Structure with Stress Buffer Zone and Method of Forming Same

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE INCLUDING DUMMY PAD

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING HYBRID BONDI...

SEMICONDUCTOR STRUCTURE HAVING HYBRID BONDING PAD

CLAMPED SEMICONDUCTOR WAFERS AND SEMICONDUCTOR DEVICES

Die Bonding Pads and Methods of Forming the Same

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, WAFER, AND WAFER MANUFACTURING METHOD

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT STRUCTURE, AND METHOD FOR FORMING THEREOF

CHIP STRUCTURE AND SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE

DIE STACK AND INTEGRATED DEVICE STRUCTURE INCLUDING IMPROVED BONDIN...

METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICE

SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE