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H01L2224/06517
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/06517
including bonding areas providing primarily mechanical bonding
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last 30 patents
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Patent Grant
Semiconductor device assembly with surface-mount die support struct...
Patent number
12,087,720
Issue date
Sep 10, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
12,009,323
Issue date
Jun 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Yu Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with composite conductive features and method...
Patent number
12,002,772
Issue date
Jun 4, 2024
NANYA TECHNOLOGY CORPORATION
Teng-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structure, and method for forming thereof
Patent number
11,996,375
Issue date
May 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Chao Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Array substrate, display panel and display device
Patent number
11,942,443
Issue date
Mar 26, 2024
HEFEI BOE DISPLAY TECHNOLOGY CO., LTD.
Chunxu Zhang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device, semiconductor testing device, and semiconduct...
Patent number
11,927,622
Issue date
Mar 12, 2024
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Masashi Tokunaga
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor device
Patent number
11,923,279
Issue date
Mar 5, 2024
Sony Group Corporation
Nobutoshi Fujii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die stack and integrated device structure including improved bondin...
Patent number
11,869,859
Issue date
Jan 9, 2024
Taiwan Semiconductor Manufacturing Company Limited
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and electronic device
Patent number
11,869,853
Issue date
Jan 9, 2024
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Ikue Mitsuhashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating integrated circuit device
Patent number
11,804,458
Issue date
Oct 31, 2023
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
Qiong Zhan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor chip, semiconductor device, and semiconductor package...
Patent number
11,784,168
Issue date
Oct 10, 2023
Samsung Electronics Co., Ltd.
Yongwon Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of treatment of an electronic circuit for a hybrid molecular...
Patent number
11,715,710
Issue date
Aug 1, 2023
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Emilie Bourjot
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked chip package and methods of manufacture thereof
Patent number
11,664,349
Issue date
May 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with through semiconductor via and method for...
Patent number
11,664,364
Issue date
May 30, 2023
NANYA TECHNOLOGY CORPORATION
Hsih-Yang Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package for improving bonding reliability
Patent number
11,658,139
Issue date
May 23, 2023
Samsung Electronics Co., Ltd.
Jaehyung Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,626,356
Issue date
Apr 11, 2023
Sony Group Corporation
Nobutoshi Fujii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structure, and method for forming thereof
Patent number
11,616,034
Issue date
Mar 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Chao Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,587,857
Issue date
Feb 21, 2023
Sony Corporation
Nobutoshi Fujii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,569,190
Issue date
Jan 31, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Chun-Lin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded assembly employing metal-semiconductor bonding and metal-met...
Patent number
11,562,975
Issue date
Jan 24, 2023
SanDisk Technologies LLC
Lin Hou
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
Patent number
11,502,051
Issue date
Nov 15, 2022
SK hynix Inc.
Ho Young Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensing apparatus
Patent number
11,482,564
Issue date
Oct 25, 2022
Samsung Electronics Co., Ltd.
Sung Hyun Yoon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method for forming the same
Patent number
11,456,263
Issue date
Sep 27, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Yu Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including bonding pads and method of manufactu...
Patent number
11,380,638
Issue date
Jul 5, 2022
Kioxia Corporation
Masayoshi Tagami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip, semiconductor device, and semiconductor package...
Patent number
11,342,310
Issue date
May 24, 2022
Samsung Electronics Co., Ltd.
Yongwon Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of assembly by direct bonding between two elements, each ele...
Patent number
11,305,372
Issue date
Apr 19, 2022
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Lea Di Cioccio
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board structure having pads and conductive wire
Patent number
11,069,646
Issue date
Jul 20, 2021
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly with surface-mount die support struct...
Patent number
10,950,568
Issue date
Mar 16, 2021
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
10,867,952
Issue date
Dec 15, 2020
Taiwan Semiconductor Manufacturing Company Ltd.
Chun-Lin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked chip package and methods of manufacture thereof
Patent number
10,840,217
Issue date
Nov 17, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240421011
Publication date
Dec 19, 2024
Samsung Electronics Co., Ltd.
WanSun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20240413104
Publication date
Dec 12, 2024
Samsung Electronics Co., Ltd.
Sang Cheon PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
Publication number
20240395746
Publication date
Nov 28, 2024
SK HYNIX INC.
Jae Jun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD
Publication number
20240355765
Publication date
Oct 24, 2024
OMNIVISION TECHNOLOGIES, INC.
Takayuki Goto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH DUAL DAMASCENE AND DUMMY PADS
Publication number
20240332229
Publication date
Oct 3, 2024
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
Publication number
20240274554
Publication date
Aug 15, 2024
NANYA TECHNOLOGY CORPORATION
Teng-Yen HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURE, AND METHOD FOR FORMING THEREOF
Publication number
20240274560
Publication date
Aug 15, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Chao Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
Publication number
20240250047
Publication date
Jul 25, 2024
NANYA TECHNOLOGY CORPORATION
Teng-Yen HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240234342
Publication date
Jul 11, 2024
Samsung Electronics Co., Ltd.
Geunwoo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
Publication number
20240234340
Publication date
Jul 11, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yi-Che Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE
Publication number
20240178167
Publication date
May 30, 2024
Huawei Technologies Co., Ltd
Ran HE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240136307
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Geunwoo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING DUMMY CONDUCTIVE MEMBER AND MANUFACT...
Publication number
20240096828
Publication date
Mar 21, 2024
NANYA TECHNOLOGY CORPORATION
Yi-Jen LO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING DUMMY CONDUCTIVE MEMBER AND MANUFACT...
Publication number
20240096829
Publication date
Mar 21, 2024
NANYA TECHNOLOGY CORPORATION
Yi-Jen LO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding Structure with Stress Buffer Zone and Method of Forming Same
Publication number
20240006352
Publication date
Jan 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
SyuFong LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
Publication number
20240006349
Publication date
Jan 4, 2024
Sony Semiconductor Solutions Corporation
Ikue MITSUHASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING DUMMY PAD
Publication number
20240006356
Publication date
Jan 4, 2024
Samsung Electronics Co., Ltd.
INHYO HWANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING HYBRID BONDI...
Publication number
20230402413
Publication date
Dec 14, 2023
NANYA TECHNOLOGY CORPORATION
Yi-Jen LO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING HYBRID BONDING PAD
Publication number
20230402414
Publication date
Dec 14, 2023
NANYA TECHNOLOGY CORPORATION
Yi-Jen LO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CLAMPED SEMICONDUCTOR WAFERS AND SEMICONDUCTOR DEVICES
Publication number
20230326887
Publication date
Oct 12, 2023
Western Digital Technologies, Inc.
Kirubakaran Periyannan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die Bonding Pads and Methods of Forming the Same
Publication number
20230307392
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen-Hsiung Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230307412
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jen-Yuan CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, WAFER, AND WAFER MANUFACTURING METHOD
Publication number
20230307396
Publication date
Sep 28, 2023
KIOXIA Corporation
Yasunori IWASHITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
Publication number
20230299023
Publication date
Sep 21, 2023
NANYA TECHNOLOGY CORPORATION
Teng-Yen HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...
Publication number
20230282607
Publication date
Sep 7, 2023
Micron Technology, Inc.
Ting Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230275053
Publication date
Aug 31, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jen-Yuan CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230260940
Publication date
Aug 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURE, AND METHOD FOR FORMING THEREOF
Publication number
20230197653
Publication date
Jun 22, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Chao Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP STRUCTURE AND SEMICONDUCTOR STRUCTURE
Publication number
20230154867
Publication date
May 18, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Ling-Yi Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230098931
Publication date
Mar 30, 2023
SONY GROUP CORPORATION
Nobutoshi Fujii
H01 - BASIC ELECTRIC ELEMENTS