including bonding areas providing primarily mechanical support

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H01L2224/09517

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/09517including bonding areas providing primarily mechanical support

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure
- Patent number 12,009,323
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 11,996,399
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,923,279
- Issue date Mar 5, 2024
- Sony Group Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package and methods of manufacture thereof
- Patent number 11,664,349
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,626,356
- Issue date Apr 11, 2023
- Sony Group Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,587,857
- Issue date Feb 21, 2023
- Sony Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,569,190
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing apparatus
- Patent number 11,482,564
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Sung Hyun Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,456,263
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,393,781
- Issue date Jul 19, 2022
- Kioxia Corporation
- Takashi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 11,289,467
- Issue date Mar 29, 2022
- Samsung Electronics Co., Ltd.
- Taehong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 11,257,805
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, manufacturing method thereof, and communicati...
- Patent number 11,137,560
- Issue date Oct 5, 2021
- Renesas Electronics Corporation
- Tetsuya Iida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid wafer-to-wafer bonding and methods of surface preparation fo...
- Patent number 10,886,249
- Issue date Jan 5, 2021
- ams International AG
- Jens Hofrichter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,867,952
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package and methods of manufacture thereof
- Patent number 10,840,217
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including multiple semiconductor chips and me...
- Patent number 10,784,244
- Issue date Sep 22, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking structure
- Patent number 10,777,534
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Peter Yu Fei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing apparatus and manufacturing method thereof
- Patent number 10,741,607
- Issue date Aug 11, 2020
- Samsung Electronics Co., Ltd.
- Sung Hyun Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 10,692,826
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 10,692,832
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,008,467
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,355,982
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array package capable of decreasing a height difference b...
- Patent number 9,041,181
- Issue date May 26, 2015
- Samsung Electronics Co., Ltd.
- Hee-chul Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
HYBRID BONDING WITH UNIFORM PATTERN DENSITY
- Publication number 20240266341
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240170449
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- HYOUNGJOO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...
- Publication number 20240170350
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230098931
- Publication date Mar 30, 2023
- SONY GROUP CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220367391
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220246498
- Publication date Aug 4, 2022
- SONY GROUP CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding with Uniform Pattern Density
- Publication number 20220173092
- Publication date Jun 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...
- Publication number 20210305303
- Publication date Sep 30, 2021
- Canon Kabushiki Kaisha
- Yusuke Onuki
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210280545
- Publication date Sep 9, 2021
- Kioxia Corporation
- Takashi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210091031
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20210066281
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Taehong KWON
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200321294
- Publication date Oct 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200286846
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, MANUFACTURING METHOD THEREOF, AND COMMUNICATI...
- Publication number 20190372676
- Publication date Dec 5, 2019
- RENESAS ELECTRONICS CORPORATION
- Tetsuya IIDA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20190259742
- Publication date Aug 22, 2019
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A RESIN LAYER AND METHOD OF MANUFACTURING...
- Publication number 20170133344
- Publication date May 11, 2017
- Kabushiki Kaisha Toshiba
- Satoru TAKAKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-Spring Chip Attachment Using Solder-Based Interconnect Struct...
- Publication number 20140374912
- Publication date Dec 25, 2014
- John C. Knights
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND GRID ARRAY PACKAGE CAPABLE OF DECREASING A HEIGHT DIFFERENCE B...
- Publication number 20110198744
- Publication date Aug 18, 2011
- Hee-chul Lee
- H01 - BASIC ELECTRIC ELEMENTS

including bonding areas providing primarily mechanical support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure

Hybrid bonding with uniform pattern density

Semiconductor device

Stacked chip package and methods of manufacture thereof

Semiconductor device

Semiconductor device

Semiconductor structure and manufacturing method thereof

Image sensing apparatus

Semiconductor structure and method for forming the same

Semiconductor device and manufacturing method thereof

Memory device

Hybrid bonding with uniform pattern density

Semiconductor module, manufacturing method thereof, and communicati...

Hybrid wafer-to-wafer bonding and methods of surface preparation fo...

Semiconductor structure and manufacturing method thereof

Stacked chip package and methods of manufacture thereof

Semiconductor package including multiple semiconductor chips and me...

Three-dimensional stacking structure

Image sensing apparatus and manufacturing method thereof

Semiconductor structure and method for forming the same

Manufacturing method of semiconductor structure

Semiconductor structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Land grid array package capable of decreasing a height difference b...

Patents Applicationslast 30 patents

HYBRID BONDING WITH UNIFORM PATTERN DENSITY

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE

Hybrid Bonding with Uniform Pattern Density

PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MEMORY DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MODULE, MANUFACTURING METHOD THEREOF, AND COMMUNICATI...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE WITH A RESIN LAYER AND METHOD OF MANUFACTURING...

Micro-Spring Chip Attachment Using Solder-Based Interconnect Struct...

LAND GRID ARRAY PACKAGE CAPABLE OF DECREASING A HEIGHT DIFFERENCE B...