including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body

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H01L23/522

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/522including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors in an inter-layer medium on an interconnect...
- Patent number 11,973,019
- Issue date Apr 30, 2024
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor with top contact
- Patent number 11,973,020
- Issue date Apr 30, 2024
- QUALCOMM Incorporated
- John Jianhong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure
- Patent number 11,973,023
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of forming the same
- Patent number 11,973,027
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an upper conductive structure having multilayer...
- Patent number 11,973,050
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method forming the same
- Patent number 11,973,021
- Issue date Apr 30, 2024
- Vanguard International Semiconductor Corporation
- Kai-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including stairless word line conta...
- Patent number 11,973,026
- Issue date Apr 30, 2024
- SanDisk Technologies LLC
- Michiaki Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,973,036
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,973,149
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsing Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,973,022
- Issue date Apr 30, 2024
- SK hynix Inc.
- Sang Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory devices
- Patent number 11,973,025
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Seungmin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded precision resistor for non-planar semiconductor device arc...
- Patent number 11,973,105
- Issue date Apr 30, 2024
- Intel Corporation
- Chieh-Jen Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive via of integrated circuitry, memory array comprising str...
- Patent number 11,972,978
- Issue date Apr 30, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution substrate, method of fabricating the same, and semic...
- Patent number 11,973,028
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods of vertical integrations of semiconductor chips...
- Patent number 11,973,029
- Issue date Apr 30, 2024
- Suzhou Qing Xin Fang Electronics Technology Co., Ltd.
- Jerry Zhijun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip semiconductor-on-insulator transistor layout
- Patent number 11,973,033
- Issue date Apr 30, 2024
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,973,024
- Issue date Apr 30, 2024
- Kioxia Corporation
- Hisashi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having air gap and method for formin...
- Patent number 11,972,975
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned subtractive processes and electronic devices therefrom
- Patent number 11,967,527
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with via extending across adjacent conducti...
- Patent number 11,967,550
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 11,967,553
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for manufacturing the same
- Patent number 11,967,554
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jongjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,967,583
- Issue date Apr 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphous layers for reducing copper diffusion and method forming same
- Patent number 11,967,522
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyh-Nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for fabricating microelectronic devices with contacts to co...
- Patent number 11,967,556
- Issue date Apr 23, 2024
- Biow Hiem Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including conductive structure and shielding...
- Patent number 11,967,565
- Issue date Apr 23, 2024
- Amkor Technology Japan, Inc.
- Takahiro Yada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter block for recessed contacts and methods forming same
- Patent number 11,967,622
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contact having a protruding segment
- Patent number 11,968,817
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jui-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard cell architecture
- Patent number 11,967,551
- Issue date Apr 23, 2024
- ARM Limited
- Ronald Paxton Preston
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DECOUPLING CAPACITANCE IN BACKSIDE INTERCONNECT
- Publication number 20240145376
- Publication date May 2, 2024
- International Business Machines Corporation
- Rajiv Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED RING STRUCTURES
- Publication number 20240145383
- Publication date May 2, 2024
- Intel Corporation
- June Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
- Publication number 20240145384
- Publication date May 2, 2024
- Micron Technology, Inc.
- Akira Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES HAVING IMPROVED CONTACT PLUG STRUCTURES...
- Publication number 20240145388
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Won Kyu Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT AND SEMICONDUCTOR DEVICE
- Publication number 20240145406
- Publication date May 2, 2024
- Rohm Co., Ltd.
- Takatsugu WACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-FIRST SELF-ALIGNED INTERCONNECT FORMATION PROCESS
- Publication number 20240145297
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Tse Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFAC...
- Publication number 20240145327
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20240147720
- Publication date May 2, 2024
- SK HYNIX INC.
- Chang Woo KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240145481
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- POCHUN WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145569
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yee-Chia YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION STRUCTURE FOR MIM TOPOGRAPHY
- Publication number 20240145377
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Liang-Shiuan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA WITH SACRIFICIAL STRESS BARRIER RING
- Publication number 20240145378
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-On-Interposer Assembly Containing A Decoupling Capacitor
- Publication number 20240145528
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cross-Wafer RDLs in Constructed Wafers
- Publication number 20240145257
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE FORMATION IN THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20240145296
- Publication date May 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yu Ting ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTEGRATED WITH PASSIVE DEVICES AND MANUFACTURING METHOD...
- Publication number 20240145321
- Publication date May 2, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Chuncheng CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETOELECTRIC LOGIC WITH MAGNETIC TUNNEL JUNCTIONS
- Publication number 20240147867
- Publication date May 2, 2024
- Intel Corporation
- Punyashloka Debashis
- G11 - INFORMATION STORAGE
Information Patent Application
STACKED VIA STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20240145379
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Kun Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER STRUCTURE ON INTERCONNECT WIRE TO INCREASE PROCESSING WINDO...
- Publication number 20240145380
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A CONTACT PLUG
- Publication number 20240145387
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Jaemoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20240145391
- Publication date May 2, 2024
- Tahoe Research, Ltd.
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME
- Publication number 20240143888
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pochun WANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240145304
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240147707
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Taegyu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20240147727
- Publication date May 2, 2024
- Lodestar Licensing Group LLC
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240147738
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-I Wu
- G11 - INFORMATION STORAGE
Information Patent Application
STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...
- Publication number 20240145299
- Publication date May 2, 2024
- TESSERA LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...
- Publication number 20240145381
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH INDUCTOR EMBEDDED IN BONDED SEMICONDUCTOR SUBSTRATES...
- Publication number 20240145382
- Publication date May 2, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ravi P. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145412
- Publication date May 2, 2024
- UNITED MICROELECTRONICS CORP.
- Shih-Che Huang
- H01 - BASIC ELECTRIC ELEMENTS

including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Self-aligned barrier for metal vias

Deep trench capacitors in an inter-layer medium on an interconnect...

Metal-insulator-metal capacitor with top contact

Stacked via structure

Semiconductor device and methods of forming the same

Method for forming an upper conductive structure having multilayer...

Semiconductor device and method forming the same

Three-dimensional memory device including stairless word line conta...

Semiconductor package structure and method of manufacturing the same

Semiconductor device and method of forming the same

Semiconductor device and manufacturing method of semiconductor device

Three-dimensional semiconductor memory devices

Embedded precision resistor for non-planar semiconductor device arc...

Conductive via of integrated circuitry, memory array comprising str...

Redistribution substrate, method of fabricating the same, and semic...

Devices and methods of vertical integrations of semiconductor chips...

Flip-chip semiconductor-on-insulator transistor layout

Semiconductor memory device

Semiconductor device structure having air gap and method for formin...

Fully aligned subtractive processes and electronic devices therefrom

Semiconductor structure with via extending across adjacent conducti...

Semiconductor package and manufacturing method of the same

Semiconductor devices and methods for manufacturing the same

3D semiconductor device and structure with metal layers

Amorphous layers for reducing copper diffusion and method forming same

Methods for fabricating microelectronic devices with contacts to co...

Semiconductor devices including conductive structure and shielding...

Inter block for recessed contacts and methods forming same

Source/drain contact having a protruding segment

Standard cell architecture

Patents Applicationslast 30 patents

DECOUPLING CAPACITANCE IN BACKSIDE INTERCONNECT

INTEGRATED RING STRUCTURES

SEMICONDUCTOR DEVICE HAVING CONTACT PLUG

INTEGRATED CIRCUIT DEVICES HAVING IMPROVED CONTACT PLUG STRUCTURES...

SEMICONDUCTOR CIRCUIT AND SEMICONDUCTOR DEVICE

VIA-FIRST SELF-ALIGNED INTERCONNECT FORMATION PROCESS

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFAC...

THREE-DIMENSIONAL MEMORY DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PLANARIZATION STRUCTURE FOR MIM TOPOGRAPHY

VIA WITH SACRIFICIAL STRESS BARRIER RING

Chip-On-Interposer Assembly Containing A Decoupling Capacitor

Cross-Wafer RDLs in Constructed Wafers

STAIRCASE FORMATION IN THREE-DIMENSIONAL MEMORY DEVICE

SUBSTRATE INTEGRATED WITH PASSIVE DEVICES AND MANUFACTURING METHOD...

MAGNETOELECTRIC LOGIC WITH MAGNETIC TUNNEL JUNCTIONS

STACKED VIA STRUCTURES AND METHODS FOR FORMING THE SAME

BARRIER STRUCTURE ON INTERCONNECT WIRE TO INCREASE PROCESSING WINDO...

SEMICONDUCTOR DEVICE INCLUDING A CONTACT PLUG

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME

INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR MEMORY DEVICE

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

MEMORY DEVICE AND METHOD OF FORMING THE SAME

STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...

PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...

STRUCTURE WITH INDUCTOR EMBEDDED IN BONDED SEMICONDUCTOR SUBSTRATES...

SEMICONDUCTOR DEVICE