including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body

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H01L23/522

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/522including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Fan out package with integrated peripheral devices and methods
- Patent number 12,362,251
- Issue date Jul 15, 2025
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
- Patent number 12,362,281
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,362,282
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled dielectric on metal rie lines to increase reliability
- Patent number 12,362,231
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scaled 2T DRAM
- Patent number 12,362,004
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures
- Patent number 12,362,229
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM structure
- Patent number 12,362,271
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun huan Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,362,272
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structures and methods of fabrication thereof
- Patent number 12,362,273
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jun-Nan Nian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,362,274
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and data storage systems including the same
- Patent number 12,363,899
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Yonghoon Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving profile of interconnect structure
- Patent number 12,362,227
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Neng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 12,362,234
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure including a plurality of an...
- Patent number 12,362,275
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconducting devices, back end of line portions for semiconductin...
- Patent number 12,362,279
- Issue date Jul 15, 2025
- The Research Foundation for the State University of New York
- Patrick Lenahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor fuse structure for high voltage breakdown def...
- Patent number 12,364,019
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,362,277
- Issue date Jul 15, 2025
- Kioxia Corporation
- Takuya Inatsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double seal ring and electrical connection of multiple chiplets
- Patent number 12,362,293
- Issue date Jul 15, 2025
- MARVELL ASIA PTE. LTD.
- Lijuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and etching method
- Patent number 12,362,098
- Issue date Jul 15, 2025
- Kabushiki Kaisha Toshiba
- Kazuhito Higuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure including probe marked test pads
- Patent number 12,354,921
- Issue date Jul 8, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer-type on-chip inductor structure
- Patent number 12,354,947
- Issue date Jul 8, 2025
- VIA LABS, INC.
- Sheng-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits (ICs) employing multi-pattern metallization to...
- Patent number 12,354,952
- Issue date Jul 8, 2025
- QUALCOMM Incorporated
- Bed Raj Kandel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structures
- Patent number 12,354,953
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 12,354,956
- Issue date Jul 8, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hyperchip
- Patent number 12,355,002
- Issue date Jul 8, 2025
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing thereof
- Patent number 12,355,006
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-layer alloy liner for interconnect metallization and methods of...
- Patent number 12,354,910
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu3Sn via metallization in electrical devices for low-temperature 3...
- Patent number 12,354,911
- Issue date Jul 8, 2025
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,354,943
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Eui Bok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delamination control of dielectric layers of integrated circuit chips
- Patent number 12,354,946
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Through Via Power Delivery Structure for Stacked Chips
- Publication number 20250233054
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chieh CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250233016
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- JHENG-HONG JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CONTACT STRUCTURE OVER ACTIVE GATE AND METHOD TO FABRICATE SAME
- Publication number 20250233020
- Publication date Jul 17, 2025
- Intel Corporation
- Abhijit Jayant PETHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVE BOTTOM WIDENING OF HIGH ASPECT RATIO OPENINGS T...
- Publication number 20250234553
- Publication date Jul 17, 2025
- SANDISK TECHNOLOGIES LLC
- Bing ZHOU
- G11 - INFORMATION STORAGE
Information Patent Application
CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE
- Publication number 20250233018
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPACKAGING IC CHIP FOR FAULT IDENTIFICATION
- Publication number 20250231233
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER ALIGNMENT MARK STRUCTURE
- Publication number 20250233078
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250233113
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME
- Publication number 20250233014
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENTIONAL SEMICONDUCTOR DEVICE
- Publication number 20250233065
- Publication date Jul 17, 2025
- SK HYNIX INC.
- Sung Lae OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, WIRING STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20250233068
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SELECTIVE METAL CAP FORMATION
- Publication number 20250233074
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BONDING STRUCTURE AND METHOD FOR MANUF...
- Publication number 20250234593
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Jong Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...
- Publication number 20250232796
- Publication date Jul 17, 2025
- SK HYNIX INC.
- Nam Jae LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250233026
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hui LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20250233035
- Publication date Jul 17, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyeong Tae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CAPACITOR SHEET, INTERPOSER, AND SEMICONDUCTOR ELEMENT
- Publication number 20250233064
- Publication date Jul 17, 2025
- MURATA MANUFACTURING CO., LTD.
- Tomoyuki ASHIMINE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH ULTRA THICK METAL AND MANUFACTURING ME...
- Publication number 20250233069
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jyun-Min Syu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250233084
- Publication date Jul 17, 2025
- KIOXIA Corporation
- Kyosuke NANAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250233111
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250226314
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- JEEWOONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT INTER-DIGITATED VIAS AND LEADS
- Publication number 20250226318
- Publication date Jul 10, 2025
- Micron Technology, Inc.
- Christopher F. Kinney
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE, MEMORY STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250228146
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hai-Dang Trinh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING DISCHARGE STRUCTURES AND METHOD F...
- Publication number 20250226231
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- YAO-JEN TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Delivering electrical power and data signals from the backside of i...
- Publication number 20250226309
- Publication date Jul 10, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20250226312
- Publication date Jul 10, 2025
- Siliconware Precision Industries Co., Ltd.
- Hsing-Yu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226278
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20250226310
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ting CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20250226311
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Taehun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250226010
- Publication date Jul 10, 2025
- STMicroelectronics International N.V.
- Olivier WEBER
- G11 - INFORMATION STORAGE

including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fan out package with integrated peripheral devices and methods

Partial barrier free vias for cobalt-based interconnects and method...

Semiconductor structure and manufacturing method thereof

Self-assembled dielectric on metal rie lines to increase reliability

Scaled 2T DRAM

Semiconductor device structures

MIM structure

Semiconductor structure and manufacturing method thereof

Conductive structures and methods of fabrication thereof

Package structure and method of forming the same

Semiconductor devices and data storage systems including the same

Method for improving profile of interconnect structure

Contact structure for semiconductor device

Method of fabricating package structure including a plurality of an...

Semiconducting devices, back end of line portions for semiconductin...

Deep trench capacitor fuse structure for high voltage breakdown def...

Semiconductor device

Double seal ring and electrical connection of multiple chiplets

Capacitor and etching method

Wafer structure including probe marked test pads

Multilayer-type on-chip inductor structure

Integrated circuits (ICs) employing multi-pattern metallization to...

Via structures

Cobalt based interconnects and methods of fabrication thereof

Hyperchip

Semiconductor packages and methods of manufacturing thereof

Bi-layer alloy liner for interconnect metallization and methods of...

Cu3Sn via metallization in electrical devices for low-temperature 3...

Semiconductor device

Delamination control of dielectric layers of integrated circuit chips

Patents Applicationslast 30 patents

Through Via Power Delivery Structure for Stacked Chips

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

GATE CONTACT STRUCTURE OVER ACTIVE GATE AND METHOD TO FABRICATE SAME

METHOD OF SELECTIVE BOTTOM WIDENING OF HIGH ASPECT RATIO OPENINGS T...

CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE

REPACKAGING IC CHIP FOR FAULT IDENTIFICATION

MULTI-LAYER ALIGNMENT MARK STRUCTURE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME

THREE-DIMENTIONAL SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, WIRING STRUCTURE AND MANUFACTURING METHOD THE...

METHODS FOR SELECTIVE METAL CAP FORMATION

SEMICONDUCTOR STRUCTURE WITH BONDING STRUCTURE AND METHOD FOR MANUF...

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

INTEGRATED CAPACITOR SHEET, INTERPOSER, AND SEMICONDUCTOR ELEMENT

SEMICONDUCTOR STRUCTURE WITH ULTRA THICK METAL AND MANUFACTURING ME...

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

COMPONENT INTER-DIGITATED VIAS AND LEADS

SEMICONDUCTOR DEVICE, MEMORY STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE INCLUDING DISCHARGE STRUCTURES AND METHOD F...

Delivering electrical power and data signals from the backside of i...

CIRCUIT STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

POWER SEMICONDUCTOR DEVICES

ELECTRONIC DEVICE