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including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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last 30 patents
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Fan out package with integrated peripheral devices and methods
Patent number
12,362,251
Issue date
Jul 15, 2025
Intel Corporation
Lizabeth Keser
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
Patent number
12,362,281
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Tsung-Ling Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor structure and manufacturing method thereof
Patent number
12,362,282
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
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Scaled 2T DRAM
Patent number
12,362,004
Issue date
Jul 15, 2025
International Business Machines Corporation
Min Gyu Sung
H01 - BASIC ELECTRIC ELEMENTS
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Self-assembled dielectric on metal rie lines to increase reliability
Patent number
12,362,231
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Hao Liao
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor devices and data storage systems including the same
Patent number
12,363,899
Issue date
Jul 15, 2025
Samsung Electronics Co., Ltd.
Yonghoon Son
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device structures
Patent number
12,362,229
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Hsin-Che Chiang
H01 - BASIC ELECTRIC ELEMENTS
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MIM structure
Patent number
12,362,271
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chun huan Wei
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor structure and manufacturing method thereof
Patent number
12,362,272
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Tung-Jiun Wu
H01 - BASIC ELECTRIC ELEMENTS
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Conductive structures and methods of fabrication thereof
Patent number
12,362,273
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jun-Nan Nian
H01 - BASIC ELECTRIC ELEMENTS
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Package structure and method of forming the same
Patent number
12,362,274
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
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Method for improving profile of interconnect structure
Patent number
12,362,227
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chun-Neng Lin
H01 - BASIC ELECTRIC ELEMENTS
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Contact structure for semiconductor device
Patent number
12,362,234
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hsu-Kai Chang
H01 - BASIC ELECTRIC ELEMENTS
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Method of fabricating package structure including a plurality of an...
Patent number
12,362,275
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Sen-Kuei Hsu
H01 - BASIC ELECTRIC ELEMENTS
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Semiconducting devices, back end of line portions for semiconductin...
Patent number
12,362,279
Issue date
Jul 15, 2025
The Research Foundation for the State University of New York
Patrick Lenahan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Deep trench capacitor fuse structure for high voltage breakdown def...
Patent number
12,364,019
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company Limited
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device
Patent number
12,362,277
Issue date
Jul 15, 2025
Kioxia Corporation
Takuya Inatsuka
H01 - BASIC ELECTRIC ELEMENTS
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Double seal ring and electrical connection of multiple chiplets
Patent number
12,362,293
Issue date
Jul 15, 2025
MARVELL ASIA PTE. LTD.
Lijuan Zhang
H01 - BASIC ELECTRIC ELEMENTS
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Capacitor and etching method
Patent number
12,362,098
Issue date
Jul 15, 2025
Kabushiki Kaisha Toshiba
Kazuhito Higuchi
H01 - BASIC ELECTRIC ELEMENTS
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Wafer structure including probe marked test pads
Patent number
12,354,921
Issue date
Jul 8, 2025
Powerchip Semiconductor Manufacturing Corporation
Chun-Lin Lu
H01 - BASIC ELECTRIC ELEMENTS
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Multilayer-type on-chip inductor structure
Patent number
12,354,947
Issue date
Jul 8, 2025
VIA LABS, INC.
Sheng-Yuan Lee
H01 - BASIC ELECTRIC ELEMENTS
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Integrated circuits (ICs) employing multi-pattern metallization to...
Patent number
12,354,952
Issue date
Jul 8, 2025
QUALCOMM Incorporated
Bed Raj Kandel
H01 - BASIC ELECTRIC ELEMENTS
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Via structures
Patent number
12,354,953
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company Limited
Jhon Jhy Liaw
H01 - BASIC ELECTRIC ELEMENTS
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Cobalt based interconnects and methods of fabrication thereof
Patent number
12,354,956
Issue date
Jul 8, 2025
Tahoe Research, LTD.
Christopher J. Jezewski
H01 - BASIC ELECTRIC ELEMENTS
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Hyperchip
Patent number
12,355,002
Issue date
Jul 8, 2025
Intel Corporation
Mark T. Bohr
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor packages and methods of manufacturing thereof
Patent number
12,355,006
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Shenggao Li
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor structure and method of manufacture
Patent number
12,356,867
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company Limited
Chia-Hua Lin
G11 - INFORMATION STORAGE
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Semiconductor devices and method of forming the same
Patent number
12,356,633
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hsiang-Ku Shen
H01 - BASIC ELECTRIC ELEMENTS
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Word line structures for three-dimensional memory arrays
Patent number
12,354,707
Issue date
Jul 8, 2025
Micron Technology, Inc.
Stephen W. Russell
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Bi-layer alloy liner for interconnect metallization and methods of...
Patent number
12,354,910
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Huei-Wen Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Through Via Power Delivery Structure for Stacked Chips
Publication number
20250233054
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Chieh CHANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250233016
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing company Ltd.
JHENG-HONG JIANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
GATE CONTACT STRUCTURE OVER ACTIVE GATE AND METHOD TO FABRICATE SAME
Publication number
20250233020
Publication date
Jul 17, 2025
Intel Corporation
Abhijit Jayant PETHE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF SELECTIVE BOTTOM WIDENING OF HIGH ASPECT RATIO OPENINGS T...
Publication number
20250234553
Publication date
Jul 17, 2025
SANDISK TECHNOLOGIES LLC
Bing ZHOU
G11 - INFORMATION STORAGE
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Patent Application
CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE
Publication number
20250233018
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., LTD
Chun-Yuan Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MULTI-LAYER ALIGNMENT MARK STRUCTURE
Publication number
20250233078
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Tzu-Wei YU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20250233113
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Ting CHEN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
REPACKAGING IC CHIP FOR FAULT IDENTIFICATION
Publication number
20250231233
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME
Publication number
20250233014
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Jheng-Hong Jiang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
THREE-DIMENTIONAL SEMICONDUCTOR DEVICE
Publication number
20250233065
Publication date
Jul 17, 2025
SK HYNIX INC.
Sung Lae OH
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE, WIRING STRUCTURE AND MANUFACTURING METHOD THE...
Publication number
20250233068
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chi-Fan Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHODS FOR SELECTIVE METAL CAP FORMATION
Publication number
20250233074
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...
Publication number
20250232796
Publication date
Jul 17, 2025
SK HYNIX INC.
Nam Jae LEE
G11 - INFORMATION STORAGE
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20250233026
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chi-Hui LAI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
Publication number
20250233035
Publication date
Jul 17, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Kyeong Tae Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTEGRATED CAPACITOR SHEET, INTERPOSER, AND SEMICONDUCTOR ELEMENT
Publication number
20250233064
Publication date
Jul 17, 2025
MURATA MANUFACTURING CO., LTD.
Tomoyuki ASHIMINE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE WITH ULTRA THICK METAL AND MANUFACTURING ME...
Publication number
20250233069
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Jyun-Min Syu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250233084
Publication date
Jul 17, 2025
KIOXIA Corporation
Kyosuke NANAMI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
Publication number
20250233111
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Shiuan Wong
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE WITH BONDING STRUCTURE AND METHOD FOR MANUF...
Publication number
20250234593
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Han-Jong Chia
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE, MEMORY STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20250228146
Publication date
Jul 10, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hai-Dang Trinh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20250226314
Publication date
Jul 10, 2025
Samsung Electronics Co., Ltd.
JEEWOONG KIM
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
COMPONENT INTER-DIGITATED VIAS AND LEADS
Publication number
20250226318
Publication date
Jul 10, 2025
Micron Technology, Inc.
Christopher F. Kinney
G11 - INFORMATION STORAGE
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Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING DISCHARGE STRUCTURES AND METHOD F...
Publication number
20250226231
Publication date
Jul 10, 2025
Taiwan Semiconductor Manufacturing company Ltd.
YAO-JEN TSAI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Delivering electrical power and data signals from the backside of i...
Publication number
20250226309
Publication date
Jul 10, 2025
Marvell Asia Pte Ltd.
Runzi Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CIRCUIT STRUCTURE
Publication number
20250226312
Publication date
Jul 10, 2025
Siliconware Precision Industries Co., Ltd.
Hsing-Yu LIU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING IMAGE SENSOR AND MRAM DEVICE
Publication number
20250228027
Publication date
Jul 10, 2025
Taiwan Semiconductor Manufacturing company Ltd.
YU-FANG CHIU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE HAVING INTEGRATED TURN-ON AND TURN-OFF RESISTO...
Publication number
20250227984
Publication date
Jul 10, 2025
RENESAS ELECTRONICS CORPORATION
Takehiro UEDA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRONIC DEVICE
Publication number
20250226010
Publication date
Jul 10, 2025
STMicroelectronics International N.V.
Olivier WEBER
G11 - INFORMATION STORAGE
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Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20250226278
Publication date
Jul 10, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Hsien Lin
H01 - BASIC ELECTRIC ELEMENTS