including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body

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H01L23/522

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/522including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including spacer layer contacting bit line bot...
- Patent number 12,315,766
- Issue date May 27, 2025
- SK hynix Inc.
- Kyung Min Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene barrier layer for reduced contact resistance
- Patent number 12,315,811
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and electronic device
- Patent number 12,317,417
- Issue date May 27, 2025
- Innolux Corporation
- Mei-Hsiu Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including a stair step structure adjacent a substantially p...
- Patent number 12,317,489
- Issue date May 27, 2025
- Micron Technology, Inc.
- Troy R. Sorensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device with increased proces...
- Patent number 12,317,492
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Chang-Sup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 12,317,494
- Issue date May 27, 2025
- Kioxia Corporation
- Yasuhito Yoshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor device and manufacturing method therefor
- Patent number 12,317,521
- Issue date May 27, 2025
- AP Memory Technology Corp.
- Masaru Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via configurable edge-combiner with duty cycle correction
- Patent number 12,316,328
- Issue date May 27, 2025
- Altera Corporation
- Chooi Pei Lim
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,315,784
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,315,792
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Jongmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution plugs
- Patent number 12,315,793
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with composite passivatio...
- Patent number 12,315,796
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with guard ring
- Patent number 12,315,798
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiao-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and fabrication method thereof
- Patent number 12,315,802
- Issue date May 27, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, memory devices, and electronic systems
- Patent number 12,315,803
- Issue date May 27, 2025
- Lodestar Licensing Group LLC
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array
- Patent number 12,317,510
- Issue date May 27, 2025
- United Microelectronics Corp.
- Hui-Lin Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor substrate structure and method of manufacturing the same
- Patent number 12,315,797
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, and related electronic systems and methods
- Patent number 12,315,801
- Issue date May 27, 2025
- Micron Technology, Inc.
- Indra V. Chary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with liner structure
- Patent number 12,315,808
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and methods of forming the structure
- Patent number 12,315,683
- Issue date May 27, 2025
- Tae Heui Kwong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and manufacturing method thereof
- Patent number 12,315,761
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the semiconductor...
- Patent number 12,317,486
- Issue date May 27, 2025
- SK hynix Inc.
- Nam Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor within metallization structure
- Patent number 12,315,791
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,317,501
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Sejie Takaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and methods of formation
- Patent number 12,317,517
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structures with barriers and liners of varying thicknesses
- Patent number 12,315,764
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skip level vias in metallization layers for integrated circuit devices
- Patent number 12,315,794
- Issue date May 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,315,795
- Issue date May 27, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side signal routing in a circuit with a relay cell
- Patent number 12,315,804
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,315,815
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...
- Publication number 20250167043
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Keun Wook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE VIA STRUCTURE
- Publication number 20250167103
- Publication date May 22, 2025
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167104
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING METAL LINES HAVING DIFFERENT METAL...
- Publication number 20250167106
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- JAEMYUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250167115
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jimo GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20250167123
- Publication date May 22, 2025
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Removal of an Etching Stop Layer for Improving Overlay Sh...
- Publication number 20250167002
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A BACKSIDE PACKAGE ARCHITECTURE
- Publication number 20250167193
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE INDUCTOR AND METHODS OF MANUFACTURE
- Publication number 20250166895
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE AND TRANSISTOR
- Publication number 20250169114
- Publication date May 22, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CRACK-RESISTANT BACKSIDE...
- Publication number 20250166703
- Publication date May 22, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Kota FUNAYAMA
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME
- Publication number 20250169189
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Ching CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING FIN STRUCTURE
- Publication number 20250169190
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- SHUN-LI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS WITH SELECTED GRAIN DISTRIBUTION
- Publication number 20250167046
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...
- Publication number 20250167078
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF MANUFACTURING MEMORY DEVICE
- Publication number 20250167112
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jungwon Choe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND RELATED METHODS
- Publication number 20250167102
- Publication date May 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250167105
- Publication date May 22, 2025
- Chun-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA
- Publication number 20250167107
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Hyungeun Choi
- G11 - INFORMATION STORAGE
Information Patent Application
MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL
- Publication number 20250167108
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Hung SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR STRUCTURES INCLUDING A PASSIVE DEVICE
- Publication number 20250167109
- Publication date May 22, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- ANTHONY JEREMY VILLALON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MEMORY SYSTEM
- Publication number 20250167114
- Publication date May 22, 2025
- KIOXIA Corporation
- Yuta TSUBOUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE LINE STRUCTURES AND METHOD OF FORMING SAME
- Publication number 20250167120
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hiranmay BISWAS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METAL-OXIDE-METAL DEVICE AND METHOD
- Publication number 20250167122
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chieh YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250167147
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jaesic Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCLUDING A STAIRCASE STRUCTURE ADJACENT A SUBSTANTIALLY PL...
- Publication number 20250169069
- Publication date May 22, 2025
- Micron Technology, Inc.
- Troy R. Sorensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250169179
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- POCHUN WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND RELATED METHODS
- Publication number 20250167101
- Publication date May 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT VIA FORMATION
- Publication number 20250167117
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lin-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHARED VOLTAGE REFERENCE MEMORY CIRCUIT
- Publication number 20250169188
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jacklyn CHANG
- G06 - COMPUTING CALCULATING COUNTING

including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device including spacer layer contacting bit line bot...

Graphene barrier layer for reduced contact resistance

Connection structure and electronic device

Devices including a stair step structure adjacent a substantially p...

Three-dimensional semiconductor memory device with increased proces...

Semiconductor storage device

Capacitor device and manufacturing method therefor

Via configurable edge-combiner with duty cycle correction

Semiconductor package and manufacturing method thereof

Semiconductor device

Semiconductor device with redistribution plugs

Method for preparing semiconductor device with composite passivatio...

Integrated circuit with guard ring

Memory device and fabrication method thereof

Microelectronic devices, memory devices, and electronic systems

Memory array

Semiconductor substrate structure and method of manufacturing the same

Microelectronic devices, and related electronic systems and methods

Semiconductor device with liner structure

Structure and methods of forming the structure

Interconnection structure and manufacturing method thereof

Semiconductor device and manufacturing method of the semiconductor...

Metal-insulator-metal capacitor within metallization structure

Semiconductor device

Semiconductor die package and methods of formation

Conductive structures with barriers and liners of varying thicknesses

Skip level vias in metallization layers for integrated circuit devices

Semiconductor structure and manufacturing method thereof

Back side signal routing in a circuit with a relay cell

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...

LOW RESISTANCE VIA STRUCTURE

SEMICONDUCTOR PACKAGE

INTERCONNECT STRUCTURE INCLUDING METAL LINES HAVING DIFFERENT METAL...

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

Selective Removal of an Etching Stop Layer for Improving Overlay Sh...

SYSTEM AND METHODS FOR A BACKSIDE PACKAGE ARCHITECTURE

PROGRAMMABLE INDUCTOR AND METHODS OF MANUFACTURE

COMPOSITE AND TRANSISTOR

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CRACK-RESISTANT BACKSIDE...

INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME

METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING FIN STRUCTURE

VIAS WITH SELECTED GRAIN DISTRIBUTION

SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...

MEMORY DEVICE AND METHOD OF MANUFACTURING MEMORY DEVICE

SOI SUBSTRATE AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA

MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL

STACKED SEMICONDUCTOR STRUCTURES INCLUDING A PASSIVE DEVICE

SEMICONDUCTOR DEVICE AND MEMORY SYSTEM

CONDUCTIVE LINE STRUCTURES AND METHOD OF FORMING SAME

METAL-OXIDE-METAL DEVICE AND METHOD

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

DEVICES INCLUDING A STAIRCASE STRUCTURE ADJACENT A SUBSTANTIALLY PL...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SOI SUBSTRATE AND RELATED METHODS

CONTACT VIA FORMATION

SHARED VOLTAGE REFERENCE MEMORY CIRCUIT