including layer connectors providing primarily mechanical support

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H01L2224/33517

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/33517including layer connectors providing primarily mechanical support

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Patents Grantslast 30 patents

Information Patent Grant
Display device including connection pad part and electronic compone...
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- Jungyun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and display device using the same
- Patent number 12,021,056
- Issue date Jun 25, 2024
- LG Display Co., Ltd.
- Chang Hyun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,742,323
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED display and manufacturing method with conductive film
- Patent number 11,417,627
- Issue date Aug 16, 2022
- Samsung Electronics Co., Ltd.
- Jamyeong Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiled light emitting diode display panel having different resistanc...
- Patent number 11,355,473
- Issue date Jun 7, 2022
- A.U. VISTA, INC.
- Fang-Chen Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in package-on-package structures
- Patent number 10,535,616
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip modules and methods of fabrication
- Patent number 10,490,520
- Issue date Nov 26, 2019
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Warpage control in package-on-package structures
- Patent number 10,170,434
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip modules and methods of fabrication
- Patent number 10,163,833
- Issue date Dec 25, 2018
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Warpage control in package-on-package structures
- Patent number 9,941,221
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the semiconductor...
- Patent number 9,847,311
- Issue date Dec 19, 2017
- Toyota Jidosha Kabushiki Kaisha
- Takuya Kadoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in package-on-package structures
- Patent number 9,559,064
- Issue date Jan 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array package capable of decreasing a height difference b...
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- Issue date May 26, 2015
- Samsung Electronics Co., Ltd.
- Hee-chul Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor gas sensor
- Patent number 8,592,875
- Issue date Nov 26, 2013
- Micronas GmbH
- Christoph Wilbertz
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING SEMICONDUC...
- Publication number 20240055408
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- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kaimin LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230378130
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING ELEMENT ALIGNMENT
- Publication number 20230268457
- Publication date Aug 24, 2023
- Lumileds LLC
- Michael DECKERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF
- Publication number 20230053037
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230020955
- Publication date Jan 19, 2023
- SHARP KABUSHIKI KAISHA
- JUN SAKUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220344304
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20220216177
- Publication date Jul 7, 2022
- JUNGYUN JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20210398933
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED DISPLAY AND MANUFACTURING METHOD THEREOF
- Publication number 20210050336
- Publication date Feb 18, 2021
- Samsung Electronics Co., Ltd.
- Jamyeong KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Control in Package-on-Package Structures
- Publication number 20190131254
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP MODULES AND METHODS OF FABRICATION
- Publication number 20190088607
- Publication date Mar 21, 2019
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Warpage Control in Package-on-Package Structures
- Publication number 20180226363
- Publication date Aug 9, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip modules and methods of fabrication
- Publication number 20170236794
- Publication date Aug 17, 2017
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR...
- Publication number 20160126205
- Publication date May 5, 2016
- Toyota Jidosha Kabushiki Kaisha
- Takuya KADOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Control in Package-on-Package Structures
- Publication number 20150155243
- Publication date Jun 4, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...
- Publication number 20140035167
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR GAS SENSOR
- Publication number 20130126947
- Publication date May 23, 2013
- Micronas GmbH
- Christoph WILBERTZ
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH THERMAL INTERFACE MATERIAL FRAME
- Publication number 20130105975
- Publication date May 2, 2013
- Rafiqul Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND GRID ARRAY PACKAGE CAPABLE OF DECREASING A HEIGHT DIFFERENCE B...
- Publication number 20110198744
- Publication date Aug 18, 2011
- Hee-chul Lee
- H01 - BASIC ELECTRIC ELEMENTS

including layer connectors providing primarily mechanical support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device including connection pad part and electronic compone...

Electronic device and display device using the same

Semiconductor structure and method of forming the same

Micro LED display and manufacturing method with conductive film

Tiled light emitting diode display panel having different resistanc...

Warpage control in package-on-package structures

Multichip modules and methods of fabrication

Warpage control in package-on-package structures

Multichip modules and methods of fabrication

Warpage control in package-on-package structures

Semiconductor device and manufacturing method for the semiconductor...

Warpage control in package-on-package structures

Land grid array package capable of decreasing a height difference b...

Semiconductor gas sensor

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING SEMICONDUC...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

LIGHTING ELEMENT ALIGNMENT

DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF

DISPLAY DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

MICRO LED DISPLAY AND MANUFACTURING METHOD THEREOF

Warpage Control in Package-on-Package Structures

MULTICHIP MODULES AND METHODS OF FABRICATION

Warpage Control in Package-on-Package Structures

Multichip modules and methods of fabrication

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR...

Warpage Control in Package-on-Package Structures

METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...

SEMICONDUCTOR GAS SENSOR

SEMICONDUCTOR CHIP DEVICE WITH THERMAL INTERFACE MATERIAL FRAME

LAND GRID ARRAY PACKAGE CAPABLE OF DECREASING A HEIGHT DIFFERENCE B...