including layer connectors providing primarily mechanical support

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H01L2224/33517

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/33517including layer connectors providing primarily mechanical support

Industries

Patents Grantslast 30 patents

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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Warpage control in package-on-package structures
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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- Christoph Wilbertz
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Warpage Control in Package-on-Package Structures
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Multichip modules and methods of fabrication
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR...
- Publication number 20160126205
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- Takuya KADOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
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Warpage Control in Package-on-Package Structures
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SEMICONDUCTOR CHIP DEVICE WITH THERMAL INTERFACE MATERIAL FRAME
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- H01 - BASIC ELECTRIC ELEMENTS

including layer connectors providing primarily mechanical support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device including connection pad part and electronic compone...

Electronic device and display device using the same

Semiconductor structure and method of forming the same

Micro LED display and manufacturing method with conductive film

Tiled light emitting diode display panel having different resistanc...

Warpage control in package-on-package structures

Multichip modules and methods of fabrication

Warpage control in package-on-package structures

Multichip modules and methods of fabrication

Warpage control in package-on-package structures

Semiconductor device and manufacturing method for the semiconductor...

Warpage control in package-on-package structures

Land grid array package capable of decreasing a height difference b...

Semiconductor gas sensor

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING SEMICONDUC...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

LIGHTING ELEMENT ALIGNMENT

DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF

DISPLAY DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

MICRO LED DISPLAY AND MANUFACTURING METHOD THEREOF

Warpage Control in Package-on-Package Structures

MULTICHIP MODULES AND METHODS OF FABRICATION

Warpage Control in Package-on-Package Structures

Multichip modules and methods of fabrication

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR...

Warpage Control in Package-on-Package Structures

METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...

SEMICONDUCTOR GAS SENSOR

SEMICONDUCTOR CHIP DEVICE WITH THERMAL INTERFACE MATERIAL FRAME

LAND GRID ARRAY PACKAGE CAPABLE OF DECREASING A HEIGHT DIFFERENCE B...