including layer connectors providing primarily thermal dissipation

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CPC
H01L2224/30519

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/30519including layer connectors providing primarily thermal dissipation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and forming method thereof
- Patent number 11,955,441
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip backside mechanical die grounding techniques
- Patent number 11,574,887
- Issue date Feb 7, 2023
- Texas Instruments Incorporated
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device including dummy via anch...
- Patent number 11,302,654
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure
- Patent number 11,276,687
- Issue date Mar 15, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a cooling body with a groove
- Patent number 11,088,045
- Issue date Aug 10, 2021
- Mitsubishi Electric Corporation
- Noboru Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including dummy via anchored to dummy metal layer
- Patent number 10,777,510
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for polymer-assisted chip transfer
- Patent number 10,388,516
- Issue date Aug 20, 2019
- Facebook Technologies, LLC
- Oscar Torrents Abad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 10,256,203
- Issue date Apr 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip assembled on an interposer
- Patent number 9,780,015
- Issue date Oct 3, 2017
- STMicroelectronics S.A.
- Pierre Bar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip assembled on an interposer
- Patent number 9,418,954
- Issue date Aug 16, 2016
- STMicroelectronics S.A.
- Pierre Bar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die package for direct surface mounting
- Patent number 8,470,644
- Issue date Jun 25, 2013
- Texas Instruments Incorporated
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die package for direct surface mounting
- Patent number 8,304,871
- Issue date Nov 6, 2012
- Texas Instruments Incorporated
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240213180
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20230139612
- Publication date May 4, 2023
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20220216165
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20200411452
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Exposed Die Package for Direct Surface Mounting
- Publication number 20130034937
- Publication date Feb 7, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED DIE PACKAGE FOR DIRECT SURFACE MOUNTING
- Publication number 20120256306
- Publication date Oct 11, 2012
- TEXAS INSTRUMENTS INCORPORATED
- FRANK YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120139097
- Publication date Jun 7, 2012
- JEONGGI JIN
- H01 - BASIC ELECTRIC ELEMENTS

including layer connectors providing primarily thermal dissipation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Interconnect structure and forming method thereof

Flip chip backside mechanical die grounding techniques

Method of fabricating semiconductor device including dummy via anch...

3D semiconductor device and structure

Semiconductor device having a cooling body with a groove

Semiconductor device including dummy via anchored to dummy metal layer

Method for polymer-assisted chip transfer

Semiconductor device and semiconductor package

Integrated circuit chip assembled on an interposer

Integrated circuit chip assembled on an interposer

Exposed die package for direct surface mounting

Exposed die package for direct surface mounting

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

Exposed Die Package for Direct Surface Mounting

EXPOSED DIE PACKAGE FOR DIRECT SURFACE MOUNTING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME