Indium [In] as principal constituent

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H01L2224/29309

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29309Indium [In] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material, an integrated circuit formed therewith,...
- Patent number 12,027,442
- Issue date Jul 2, 2024
- ARIECA INC.
- Jeffrey Gelorme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 11,450,639
- Issue date Sep 20, 2022
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser bonding method
- Patent number 11,107,790
- Issue date Aug 31, 2021
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,910,335
- Issue date Feb 2, 2021
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,867,878
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curing a heat-curable material in an embedded curing zone
- Patent number 10,717,236
- Issue date Jul 21, 2020
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen van den Brand
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electrically conductive composition
- Patent number 10,689,550
- Issue date Jun 23, 2020
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,622,325
- Issue date Apr 14, 2020
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,600,761
- Issue date Mar 24, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods for semiconductor devices
- Patent number 10,510,687
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material with ion scavenger
- Patent number 10,428,257
- Issue date Oct 1, 2019
- Honeywell International Inc.
- Ya Qun Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,170,440
- Issue date Jan 1, 2019
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods for semiconductor devices
- Patent number 10,163,821
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material with ion scavenger
- Patent number 10,155,894
- Issue date Dec 18, 2018
- Honeywell International Inc.
- Ya Qun Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Apparatuses and methods for heat transfer from packaged semiconduct...
- Patent number 10,068,875
- Issue date Sep 4, 2018
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,020,236
- Issue date Jul 10, 2018
- Taiwan Semiconductar Manufacturing Campany
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods for semiconductor devices
- Patent number 9,893,021
- Issue date Feb 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste for joining components of electronic modules, system and meth...
- Patent number 9,815,146
- Issue date Nov 14, 2017
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hermann Oppermann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packaging containing sintering die-attach material
- Patent number 9,583,453
- Issue date Feb 28, 2017
- Ormet Circuits, Inc.
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint material, and jointed body
- Patent number 9,543,265
- Issue date Jan 10, 2017
- Hitachi, Ltd.
- Motomune Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods for semiconductor devices
- Patent number 9,287,194
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a component comprising cutting a carrier
- Patent number 9,123,764
- Issue date Sep 1, 2015
- Infineon Technologies AG
- Thomas Behrens
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor package device
- Patent number 9,029,998
- Issue date May 12, 2015
- Samsung Electronics Co., Ltd.
- Eon Soo Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a solder joint
- Patent number 8,925,793
- Issue date Jan 6, 2015
- DunAn Microstaq, Inc.
- Parthiban Arunasalam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of fabricating an electronic device
- Patent number 8,872,315
- Issue date Oct 28, 2014
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240347012
- Publication date Oct 17, 2024
- SAMSUNG DISPLAY CO., LTD.
- SUJEONG KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL IN...
- Publication number 20240243033
- Publication date Jul 18, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
- Publication number 20230290751
- Publication date Sep 14, 2023
- SAMSUNG DISPLAY CO., LTD.
- Joo Nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS
- Publication number 20230197565
- Publication date Jun 22, 2023
- Jerrod P. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL
- Publication number 20220399317
- Publication date Dec 15, 2022
- Seoul Semiconductor Co., Ltd.
- Woo Gun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL THERMAL INTERFACE
- Publication number 20220375817
- Publication date Nov 24, 2022
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING METHOD AND A SEMICONDUCTOR PACKAGE INCLUDING A BONDIN...
- Publication number 20210358885
- Publication date Nov 18, 2021
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED DISPLAY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210066243
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Byunghoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD OF THE DISPLAY PANEL
- Publication number 20210013169
- Publication date Jan 14, 2021
- SAKAI DISPLAY PRODUCTS CORPORATION
- SHINICHI SUGIMOTO
- G02 - OPTICS
Information Patent Application
MULTILAYERED TRANSIENT LIQUID PHASE BONDING
- Publication number 20200146155
- Publication date May 7, 2020
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LASER BONDING METHOD
- Publication number 20200075535
- Publication date Mar 5, 2020
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Devices and Methods for Semiconductor Devices
- Publication number 20190122999
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20190109111
- Publication date Apr 11, 2019
- EPISTAR CORPORATION
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL WITH ION SCAVENGER
- Publication number 20190048245
- Publication date Feb 14, 2019
- HONEYWELL INTERNATIONAL INC.
- Ya Qun Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Dam for Three-Dimensional Integrated Circuit
- Publication number 20180323118
- Publication date Nov 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Devices and Methods for Semiconductor Devices
- Publication number 20180174984
- Publication date Jun 21, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER PARTICLES FOR BOND LINE THICKNESS CONTROL IN SINTERING PASTES
- Publication number 20170271294
- Publication date Sep 21, 2017
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BASE AND SEMICO...
- Publication number 20170229415
- Publication date Aug 10, 2017
- KABUSHIKI KAISHA TOSHIBA
- Yuchen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20140339708
- Publication date Nov 20, 2014
- Eon Soo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...
- Publication number 20140291834
- Publication date Oct 2, 2014
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joint Material, and Jointed Body
- Publication number 20140287227
- Publication date Sep 25, 2014
- Hitachi, Ltd
- Motomune KODAMA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
ELECTRONIC COMPONENT BONDING METHOD
- Publication number 20140263581
- Publication date Sep 18, 2014
- ALPHA DESIGN CO., LTD.
- Toshiyuki SHIRATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Devices and Methods for Semiconductor Devices
- Publication number 20140252634
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL
- Publication number 20140131898
- Publication date May 15, 2014
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FILM ADHESIVE
- Publication number 20140120356
- Publication date May 1, 2014
- ORMET CIRCUITS, INC.
- Catherine Shearer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PASTE FOR JOINING COMPONENTS OF ELECTRONIC MODULES, SYSTEM AND METH...
- Publication number 20140079472
- Publication date Mar 20, 2014
- Fraunhofer Gesellschaft zur Foederung der Angewandten Forschung e.V.
- Hermann Oppermann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing a Component Comprising Cutting a Carrier
- Publication number 20140057396
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method of Fabricating an Electronic Device
- Publication number 20140042603
- Publication date Feb 13, 2014
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SOLDER ON PAD ON FINE PITCH PCB AND METHOD OF FLI...
- Publication number 20130334291
- Publication date Dec 19, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- H01 - BASIC ELECTRIC ELEMENTS

Indium [In] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a method of manufacturing thereof

Thermal interface material, an integrated circuit formed therewith,...

Multilayered transient liquid phase bonding

Semiconductor device and a method of manufacturing thereof

Alternative compositions for high temperature soldering applications

Laser bonding method

Semiconductor device and a method of manufacturing thereof

Dam for three-dimensional integrated circuit

Curing a heat-curable material in an embedded curing zone

Electrically conductive composition

Low-temperature bonding with spaced nanorods and eutectic alloys

Semiconductor device and a method of manufacturing thereof

Nanoscale interconnect array for stacked dies

Packaging devices and methods for semiconductor devices

Thermal interface material with ion scavenger

Conductive connecting member and manufacturing method of same

Semiconductor device and a method of manufacturing thereof

Packaging devices and methods for semiconductor devices

Thermal interface material with ion scavenger

Apparatuses and methods for heat transfer from packaged semiconduct...

Dam for three-dimensional integrated circuit

Packaging devices and methods for semiconductor devices

Paste for joining components of electronic modules, system and meth...

Semiconductor packaging containing sintering die-attach material

Joint material, and jointed body

Packaging devices and methods for semiconductor devices

Method of manufacturing a component comprising cutting a carrier

Semiconductor package device

Method for making a solder joint

Electronic device and method of fabricating an electronic device

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL IN...

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME

REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS

METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL

LIQUID METAL THERMAL INTERFACE

LASER BONDING METHOD AND A SEMICONDUCTOR PACKAGE INCLUDING A BONDIN...

MICRO LED DISPLAY AND METHOD FOR MANUFACTURING THE SAME

DISPLAY PANEL AND MANUFACTURING METHOD OF THE DISPLAY PANEL

MULTILAYERED TRANSIENT LIQUID PHASE BONDING

LASER BONDING METHOD

Packaging Devices and Methods for Semiconductor Devices

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

THERMAL INTERFACE MATERIAL WITH ION SCAVENGER

Dam for Three-Dimensional Integrated Circuit

Packaging Devices and Methods for Semiconductor Devices

SPACER PARTICLES FOR BOND LINE THICKNESS CONTROL IN SINTERING PASTES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BASE AND SEMICO...

SEMICONDUCTOR PACKAGE DEVICE

SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...

Joint Material, and Jointed Body

ELECTRONIC COMPONENT BONDING METHOD

Packaging Devices and Methods for Semiconductor Devices

SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL

CONDUCTIVE FILM ADHESIVE

PASTE FOR JOINING COMPONENTS OF ELECTRONIC MODULES, SYSTEM AND METH...

Method of Manufacturing a Component Comprising Cutting a Carrier

Electronic Device and Method of Fabricating an Electronic Device

METHOD OF FORMING SOLDER ON PAD ON FINE PITCH PCB AND METHOD OF FLI...