Indium (In) as principal constituent

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CPC
H01L2224/45609

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45609Indium (In) as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,929,343
- Issue date Mar 12, 2024
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,672,733
- Issue date Jun 2, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,497,663
- Issue date Dec 3, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,461,055
- Issue date Oct 29, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,236,272
- Issue date Mar 19, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,032,741
- Issue date Jul 24, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable wire method
- Patent number 9,245,670
- Issue date Jan 26, 2016
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reliable wire structure and method
- Patent number 8,692,118
- Issue date Apr 8, 2014
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
3006067
- Patent number 3,006,067
- Issue date Oct 31, 1961
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240297142
- Publication date Sep 5, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230387066
- Publication date Nov 30, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230245995
- Publication date Aug 3, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230148306
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Motoki ETO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20200013747
- Publication date Jan 9, 2020
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20190164927
- Publication date May 30, 2019
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170365576
- Publication date Dec 21, 2017
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Tetsuya OYAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170323864
- Publication date Nov 9, 2017
- Nippon Micrometal Corporation
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170117244
- Publication date Apr 27, 2017
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20140157592
- Publication date Jun 12, 2014
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20120325517
- Publication date Dec 27, 2012
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDIUM-SOLDER-COATED COPPER FOIL RIBBON CONDUCTOR AND METHOD OF CON...
- Publication number 20090044966
- Publication date Feb 19, 2009
- SHOWA SHELL SEKIYU K.K.
- Kenichi Tazawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Indium (In) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor devices

Bonding wire for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Bonding wire for semiconductor device

Reliable wire method

Reliable wire structure and method

3006067

Patents Applicationslast 30 patents

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

RELIABLE WIRE STRUCTURE AND METHOD

RELIABLE WIRE STRUCTURE AND METHOD

INDIUM-SOLDER-COATED COPPER FOIL RIBBON CONDUCTOR AND METHOD OF CON...