Indium [In] as principal constituent

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H01L2224/81409

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81409Indium [In] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 11,955,465
- Issue date Apr 9, 2024
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 11,569,205
- Issue date Jan 31, 2023
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,450
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,451
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 10,978,425
- Issue date Apr 13, 2021
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 10,546,836
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 10,497,853
- Issue date Dec 3, 2019
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 10,468,579
- Issue date Nov 5, 2019
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,312,216
- Issue date Jun 4, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,297,568
- Issue date May 21, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-transfer printing with volatile adhesive layer
- Patent number 10,157,880
- Issue date Dec 18, 2018
- X-CELEPRINT LIMITED
- Salvatore Bonafede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 9,847,308
- Issue date Dec 19, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,633,981
- Issue date Apr 25, 2017
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control for flexible substrates
- Patent number 9,502,271
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder on trace technology for interconnect attachment
- Patent number 9,461,008
- Issue date Oct 4, 2016
- QUALCOMM Incorporated
- Rajneesh Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector
- Patent number 9,397,021
- Issue date Jul 19, 2016
- Lotes Co., Ltd.
- Ted Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,362,247
- Issue date Jun 7, 2016
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip hybridisation of two microelectronic components using a U...
- Patent number 9,318,453
- Issue date Apr 19, 2016
- Commissariat a l'Energie Atomique et aux Energies Alternatives
- Abdelkader Aliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip hybridization of microelectronic components using suspend...
- Patent number 9,165,915
- Issue date Oct 20, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Abdelkader Aliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip hybridization of microelectronic components by local heat...
- Patent number 9,111,924
- Issue date Aug 18, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Abdelkader Aliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit component and method of making the same
- Patent number 9,019,714
- Issue date Apr 28, 2015
- Hitachi Chemical Company, Ltd.
- Kazuya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component device, method of manufacturing the same and w...
- Patent number 8,878,357
- Issue date Nov 4, 2014
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit device having die bonded to the polymer side of...
- Patent number 8,456,021
- Issue date Jun 4, 2013
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,258,625
- Issue date Sep 4, 2012
- Hitachi, Ltd.
- Shinichi Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder composition for electronic devices
- Patent number 8,022,551
- Issue date Sep 20, 2011
- Renesas Electronics Corporation
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device with lead-free solder
- Patent number 7,259,465
- Issue date Aug 21, 2007
- Hitachi, Ltd.
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electronic device
- Patent number 7,075,183
- Issue date Jul 11, 2006
- Hitachi, Ltd.
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Flip chip assembly structure for semiconductor device and method of...
- Patent number 6,798,072
- Issue date Sep 28, 2004
- Hitachi, Ltd.
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIQUID METAL BASED FIRST LEVEL INTERCONNECTS
- Publication number 20240006400
- Publication date Jan 4, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING LOSS IN STACKED QUANTUM DEVICES
- Publication number 20230178519
- Publication date Jun 8, 2023
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Temporary Chip Assembly, Display Panel, and Manufacturing Methods o...
- Publication number 20230005878
- Publication date Jan 5, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING LOSS IN STACKED QUANTUM DEVICES
- Publication number 20210233896
- Publication date Jul 29, 2021
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20200126951
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20180082982
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180026006
- Publication date Jan 25, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Control for Flexible Substrates
- Publication number 20140302642
- Publication date Oct 9, 2014
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS USING SUSPEND...
- Publication number 20140220737
- Publication date Aug 7, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Abdelkader ALIANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...
- Publication number 20140210076
- Publication date Jul 31, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Abdelkader ALIANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Control for Flexible Substrates
- Publication number 20140131897
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODES AND METHODS OF FABRICATING THE SAME
- Publication number 20140124799
- Publication date May 8, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Doo Hyeb YOUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER ON TRACE TECHNOLOGY FOR INTERCONNECT ATTACHMENT
- Publication number 20140048931
- Publication date Feb 20, 2014
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME
- Publication number 20130120948
- Publication date May 16, 2013
- HITACHI CHEMICAL CO., Ltd.
- Kazuya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...
- Publication number 20120126418
- Publication date May 24, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT DEVICE, METHOD OF MANUFACTURING THE SAME AND W...
- Publication number 20120086116
- Publication date Apr 12, 2012
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080251914
- Publication date Oct 16, 2008
- Shinichi Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder composition for electronic devices
- Publication number 20070031279
- Publication date Feb 8, 2007
- Renesas Technology Corporation
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electronic device
- Publication number 20020171157
- Publication date Nov 21, 2002
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electronic device
- Publication number 20020114726
- Publication date Aug 22, 2002
- Hitachi, Ltd
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electronic device
- Publication number 20020100986
- Publication date Aug 1, 2002
- Hitachi, Ltd
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Flip chip assembly structure for semiconductor device and method of...
- Publication number 20020056906
- Publication date May 16, 2002
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS

Indium [In] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reducing loss in stacked quantum devices

Reducing loss in stacked quantum devices

Wafer level integration including design/co-design, structure proce...

Superconducting bump bonds

Superconducting bump bonds

Reducing loss in stacked quantum devices

Wafer level integration including design/co-design, structure proce...

Superconducting bump bonds

Superconducting bump bonds

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Micro-transfer printing with volatile adhesive layer

Bonding structure for semiconductor package and method of manufactu...

Magnetic intermetallic compound interconnect

Systems and methods for bonding semiconductor elements

Warpage control for flexible substrates

Solder on trace technology for interconnect attachment

Electrical connector

Systems and methods for bonding semiconductor elements

Flip-chip hybridisation of two microelectronic components using a U...

Flip-chip hybridization of microelectronic components using suspend...

Flip-chip hybridization of microelectronic components by local heat...

Circuit component and method of making the same

Electronic component device, method of manufacturing the same and w...

Integrated circuit device having die bonded to the polymer side of...

Semiconductor device

Solder composition for electronic devices

Semiconductor device with lead-free solder

Electronic device

Flip chip assembly structure for semiconductor device and method of...

Patents Applicationslast 30 patents

LIQUID METAL BASED FIRST LEVEL INTERCONNECTS

REDUCING LOSS IN STACKED QUANTUM DEVICES

Temporary Chip Assembly, Display Panel, and Manufacturing Methods o...

REDUCING LOSS IN STACKED QUANTUM DEVICES

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

Warpage Control for Flexible Substrates

FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS USING SUSPEND...

FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...

Warpage Control for Flexible Substrates

LIGHT EMITTING DIODES AND METHODS OF FABRICATING THE SAME

SOLDER ON TRACE TECHNOLOGY FOR INTERCONNECT ATTACHMENT

CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME

INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...

ELECTRONIC COMPONENT DEVICE, METHOD OF MANUFACTURING THE SAME AND W...

SEMICONDUCTOR DEVICE

Solder composition for electronic devices

Electronic device

Electronic device

Electronic device

Flip chip assembly structure for semiconductor device and method of...