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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L2924/01049
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Patents Grants
last 30 patents
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Patent Grant
Methods for low temperature bonding using nanoparticles
Patent number
11,973,056
Issue date
Apr 30, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having improved thermal interface between sem...
Patent number
11,967,570
Issue date
Apr 23, 2024
Mediatek Inc.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having silver-indium transient liquid phase...
Patent number
11,894,284
Issue date
Feb 6, 2024
LMDJ MANAGEMENT LLC
Yongjun Huo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder material and method for die attachment
Patent number
11,842,974
Issue date
Dec 12, 2023
Alpha Assembly Solutions Inc.
Angelo Gulino
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
Patent number
11,830,845
Issue date
Nov 28, 2023
TESSERA LLC
Hiroaki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for fabricating a semiconductor device
Patent number
11,817,417
Issue date
Nov 14, 2023
Infineon Technologies Austria AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
BGA STIM package architecture for high performance systems
Patent number
11,817,364
Issue date
Nov 14, 2023
Intel Corporation
Rajasekaran Swaminathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Diffusion soldering preform with varying surface profile
Patent number
11,764,185
Issue date
Sep 19, 2023
Infineon Technologies Austria AG
Kirill Trunov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package assembly with wire bond vias
Patent number
11,735,563
Issue date
Aug 22, 2023
Invensas LLC
Ellis Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for production of semiconductor device
Patent number
11,715,752
Issue date
Aug 1, 2023
Sony Group Corporation
Atsushi Okuyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structures and methods for low temperature bonding using nanoparticles
Patent number
11,710,718
Issue date
Jul 25, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having improved thermal interface between sem...
Patent number
11,705,413
Issue date
Jul 18, 2023
Mediatek Inc.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming interposer with opening...
Patent number
11,688,612
Issue date
Jun 27, 2023
STATS ChipPAC Pte. Ltd.
Reza A. Pagaila
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Preform diffusion soldering
Patent number
11,605,608
Issue date
Mar 14, 2023
Infineon Technologies Austria AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Superconducting bump bonds for quantum computing systems
Patent number
11,600,588
Issue date
Mar 7, 2023
Google LLC
Zhimin Jamie Yao
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Ultrasonic-assisted solder transfer
Patent number
11,541,472
Issue date
Jan 3, 2023
International Business Machines Corporation
Jae-Woong Nah
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
3D IC method and device
Patent number
11,515,202
Issue date
Nov 29, 2022
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded structure and bonding material
Patent number
11,515,281
Issue date
Nov 29, 2022
Panasonic Holdings Corporation
Akio Furusawa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic device
Patent number
11,502,233
Issue date
Nov 15, 2022
Ultra Display Technology Corp.
Hsien-Te Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alignment features for hybridized image sensor
Patent number
11,495,562
Issue date
Nov 8, 2022
Attollo Engineering, LLC
Michael MacDougal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stretchable form of single crystal silicon for high performance ele...
Patent number
11,456,258
Issue date
Sep 27, 2022
The Board of Trustees of the University of Illinois
John A. Rogers
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Straight wirebonding of silicon dies
Patent number
11,456,272
Issue date
Sep 27, 2022
Western Digital Technologies, Inc.
Kirubakaran Periyannan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
Patent number
11,424,211
Issue date
Aug 23, 2022
TESSERA LLC
Hiroaki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
Patent number
11,413,709
Issue date
Aug 16, 2022
Indium Corporation
Weiping Liu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Direct attachment of capacitors to flip chip dies
Patent number
11,404,365
Issue date
Aug 2, 2022
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silver-indium transient liquid phase method of bonding semiconducto...
Patent number
11,373,925
Issue date
Jun 28, 2022
LIGHT-MED (USA), INC.
Yongjun Huo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having improved thermal interface between sem...
Patent number
11,302,657
Issue date
Apr 12, 2022
Mediatek Inc.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D IC method and device
Patent number
11,289,372
Issue date
Mar 29, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for permanent connection of two metal surfaces
Patent number
11,282,801
Issue date
Mar 22, 2022
EV Group E. Thallner GmbH
Viorel Dragoi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
Patent number
11,257,714
Issue date
Feb 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chien Ling Hwang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
Publication number
20240065002
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Dongkyu Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method for Fabricating a Semiconductor Device
Publication number
20240038714
Publication date
Feb 1, 2024
Infineon Technologies Austria AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS
Publication number
20240030086
Publication date
Jan 25, 2024
Intel Corporation
Rajasekaran SWAMINATHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
Publication number
20230335531
Publication date
Oct 19, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Superconducting Bump Bonds for Quantum Computing Systems
Publication number
20230207507
Publication date
Jun 29, 2023
Google LLC
Zhimin Jamie Yao
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
Publication number
20230197679
Publication date
Jun 22, 2023
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD
Publication number
20230187337
Publication date
Jun 15, 2023
Karumbu Meyyappan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
Publication number
20230132060
Publication date
Apr 27, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING A SOLDERED JOINT WITH ONE OR MORE INTER...
Publication number
20230130092
Publication date
Apr 27, 2023
Infineon Technologies Austria AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIFFUSION SOLDERING PREFORM WITH VARYING SURFACE PROFILE
Publication number
20230065738
Publication date
Mar 2, 2023
Kirill Trunov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20230018430
Publication date
Jan 19, 2023
NIPPON MICROMETAL CORPORATION
Daizo ODA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230005866
Publication date
Jan 5, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Ling-Yi Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...
Publication number
20220415853
Publication date
Dec 29, 2022
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
Publication number
20220331913
Publication date
Oct 20, 2022
Indium Corporation
Weiping Liu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
Publication number
20220285297
Publication date
Sep 8, 2022
MEDIATEK INC.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
JOINING MATERIAL FOR BONDING OVERLAPPING COMPONENTS OF POWER ELECTR...
Publication number
20220230984
Publication date
Jul 21, 2022
GM GLOBAL TECHNOLOGY OPERATIONS LLC
Ming Liu
B22 - CASTING POWDER METALLURGY
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
Publication number
20220102297
Publication date
Mar 31, 2022
MEDIATEK INC.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
Publication number
20220102603
Publication date
Mar 31, 2022
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Kwang-Seong CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...
Publication number
20220093549
Publication date
Mar 24, 2022
Samsung Electronics Co., Ltd.
Kunmo CHU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING SILVER-INDIUM TRANSIENT LIQUID PHASE...
Publication number
20220084903
Publication date
Mar 17, 2022
LIGHT-MED (USA), INC.
Yongjun HUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRAIGHT WIREBONDING OF SILICON DIES
Publication number
20220084979
Publication date
Mar 17, 2022
Western Digital Technologies, Inc.
Kirubakaran Periyannan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISI...
Publication number
20220077099
Publication date
Mar 10, 2022
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Gwang-Mun CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILVER-INDIUM TRANSIENT LIQUID PHASE METHOD OF BONDING SEMICONDUCTO...
Publication number
20220005744
Publication date
Jan 6, 2022
LIGHT-MED (USA), INC.
Yongjun HUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCTION OF SEMICONDUCTOR DEVICE
Publication number
20210366975
Publication date
Nov 25, 2021
SONY GROUP CORPORATION
Atsushi Okuyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D IC METHOD AND DEVICE
Publication number
20210313225
Publication date
Oct 7, 2021
INVENSAS BONDING TECHNOLOGIES, INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D IC METHOD AND DEVICE
Publication number
20210280461
Publication date
Sep 9, 2021
INVENSAS BONDING TECHNOLOGIES, INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRASONIC-ASSISTED SOLDER TRANSFER
Publication number
20210229203
Publication date
Jul 29, 2021
International Business Machines Corporation
Jae-Woong Nah
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
Publication number
20210225801
Publication date
Jul 22, 2021
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ALIGNMENT FEATURES FOR HYBRIDIZED IMAGE SENSOR
Publication number
20210202420
Publication date
Jul 1, 2021
Attollo Engineering, LLC
Michael MacDougal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20210202814
Publication date
Jul 1, 2021
ULTRA DISPLAY TECHNOLOGY CORP.
Hsien-Te CHEN
H01 - BASIC ELECTRIC ELEMENTS