Indium nitride [InN]

Industry

CPC
H01L2924/10334

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10334Indium nitride [InN]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for permanently bonding wafers
- Patent number 10,825,793
- Issue date Nov 3, 2020
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating a semiconductor package with conductive carr...
- Patent number 9,673,109
- Issue date Jun 6, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 9,627,349
- Issue date Apr 18, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package for III-nitride transistor stacked with diode
- Patent number 9,530,774
- Issue date Dec 27, 2016
- Infineon Technologies Americas Corp.
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive clips
- Patent number 9,520,341
- Issue date Dec 13, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chromium/titanium/aluminum-based semiconductor device contact fabri...
- Patent number 9,514,947
- Issue date Dec 6, 2016
- Sensor Electronic Technology, Inc.
- Remigijus Gaska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride device and FET in a package
- Patent number 9,312,245
- Issue date Apr 12, 2016
- Infineon Technologies Americas Corp.
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package with conductive carr...
- Patent number 9,269,655
- Issue date Feb 23, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating a chromium/titanium/aluminum-based semicondu...
- Patent number 9,064,845
- Issue date Jun 23, 2015
- Sensor Electronic Technology, Inc.
- Remigijus Gaska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride transistor stacked with diode in a package
- Patent number 8,963,338
- Issue date Feb 24, 2015
- International Rectifier Corporation
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride transistor stacked with FET in a package
- Patent number 8,847,408
- Issue date Sep 30, 2014
- International Rectifier Corporation
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power semiconductor package with conductive clip and flip chip...
- Patent number 8,749,034
- Issue date Jun 10, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power semiconductor package with multiple conductive clips
- Patent number 8,664,754
- Issue date Mar 4, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method
- Patent number 8,641,859
- Issue date Feb 4, 2014
- Thin Materials AG
- Franz Richter
- B32 - LAYERED PRODUCTS
Information Patent Grant
High power semiconductor package with conductive clips and flip chi...
- Patent number 8,497,574
- Issue date Jul 30, 2013
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power semiconductor package with conductive clip on multiple t...
- Patent number 8,497,573
- Issue date Jul 30, 2013
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS
- Publication number 20170229423
- Publication date Aug 10, 2017
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20160190092
- Publication date Jun 30, 2016
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Fabricating a Semiconductor Package with Conductive Carr...
- Publication number 20150348887
- Publication date Dec 3, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Heat Spreader
- Publication number 20150348888
- Publication date Dec 3, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING S...
- Publication number 20150200265
- Publication date Jul 16, 2015
- Sumitomo Electric Industries, Ltd.
- Tetsuya Kumano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Conductive Clips
- Publication number 20150194369
- Publication date Jul 9, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chromium/Titanium/Aluminum-based Semiconductor Device Contact
- Publication number 20140308766
- Publication date Oct 16, 2014
- SENSOR ELECTRONIC TECHNOLOGY, INC.
- Remigijus Gaska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Multiple Conductive Clips
- Publication number 20140175630
- Publication date Jun 26, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Conductive Carrier Integrated Heat Spreader
- Publication number 20140110796
- Publication date Apr 24, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-Nitride Transistor Stacked with Diode in a Package
- Publication number 20120223322
- Publication date Sep 6, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-Nitride Transistor Stacked with FET in a Package
- Publication number 20120223321
- Publication date Sep 6, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Conductive Clip
- Publication number 20120168922
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Conductive Clip on Multiple T...
- Publication number 20120168923
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Conductive Clips and Flip Chi...
- Publication number 20120168925
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Conductive Clip and Flip Chip...
- Publication number 20120168926
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Multiple Conductive Clips
- Publication number 20120168924
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD
- Publication number 20110272092
- Publication date Nov 10, 2011
- THIN MATERIALS AG
- Franz Richter
- B32 - LAYERED PRODUCTS

Indium nitride [InN]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for permanently bonding wafers

Method for applying a bonding layer

Method for fabricating a semiconductor package with conductive carr...

Method for applying a bonding layer

Semiconductor package for III-nitride transistor stacked with diode

Semiconductor package with conductive clips

Chromium/titanium/aluminum-based semiconductor device contact fabri...

III-nitride device and FET in a package

Method for fabricating a semiconductor package with conductive carr...

Methods of fabricating a chromium/titanium/aluminum-based semicondu...

III-nitride transistor stacked with diode in a package

III-nitride transistor stacked with FET in a package

High power semiconductor package with conductive clip and flip chip...

High power semiconductor package with multiple conductive clips

Bonding method

High power semiconductor package with conductive clips and flip chi...

High power semiconductor package with conductive clip on multiple t...

Patents Applicationslast 30 patents

METHOD FOR PERMANENTLY BONDING WAFERS

METHOD FOR APPLYING A BONDING LAYER

Method for Fabricating a Semiconductor Package with Conductive Carr...

Semiconductor Package with Integrated Heat Spreader

SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING S...

Semiconductor Package with Conductive Clips

Chromium/Titanium/Aluminum-based Semiconductor Device Contact

Semiconductor Package with Multiple Conductive Clips

Semiconductor Package with Conductive Carrier Integrated Heat Spreader

III-Nitride Transistor Stacked with Diode in a Package

III-Nitride Transistor Stacked with FET in a Package

High Power Semiconductor Package with Conductive Clip

High Power Semiconductor Package with Conductive Clip on Multiple T...

High Power Semiconductor Package with Conductive Clips and Flip Chi...

High Power Semiconductor Package with Conductive Clip and Flip Chip...

High Power Semiconductor Package with Multiple Conductive Clips

BONDING METHOD