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Induction heating
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H01L2224/80222
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80222
Induction heating
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Patents Grants
last 30 patents
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Patent Grant
Embedded nanoparticles for on-die thermal enhancement of hybrid bon...
Patent number
12,368,131
Issue date
Jul 22, 2025
Micron Technology, Inc.
Bang-Ning Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Implementation module for stacked connection between isolated circu...
Patent number
11,116,100
Issue date
Sep 7, 2021
SHENZHEN XILONG TOY COMPANY LIMITED
Yipu Zheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Implementation method for stacked connection between isolated circu...
Patent number
10,455,717
Issue date
Oct 22, 2019
SHENZHEN XILONG TOY COMPANY LIMITED
Yipu Zheng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
EMBEDDED NANOPARTICLES FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BON...
Publication number
20240071987
Publication date
Feb 29, 2024
Micron Technology, Inc.
Bang-Ning Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMPLEMENTATION MODULE FOR STACKED CONNECTION BETWEEN ISOLATED CIRCU...
Publication number
20190350100
Publication date
Nov 14, 2019
SHENZHEN XILONG TOY COMPANY LIMITED
YIPU ZHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMPLEMENTATION METHOD FOR STACKED CONNECTION BETWEEN ISOLATED CIRCU...
Publication number
20180124941
Publication date
May 3, 2018
SHENZHEN XILONG TOY COMPANY LIMITED
YIPU ZHENG
H01 - BASIC ELECTRIC ELEMENTS