Induction heating

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CPC
H01L2224/80222

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80222Induction heating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Implementation module for stacked connection between isolated circu...
- Patent number 11,116,100
- Issue date Sep 7, 2021
- SHENZHEN XILONG TOY COMPANY LIMITED
- Yipu Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementation method for stacked connection between isolated circu...
- Patent number 10,455,717
- Issue date Oct 22, 2019
- SHENZHEN XILONG TOY COMPANY LIMITED
- Yipu Zheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED NANOPARTICLES FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BON...
- Publication number 20240071987
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Bang-Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTATION MODULE FOR STACKED CONNECTION BETWEEN ISOLATED CIRCU...
- Publication number 20190350100
- Publication date Nov 14, 2019
- SHENZHEN XILONG TOY COMPANY LIMITED
- YIPU ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTATION METHOD FOR STACKED CONNECTION BETWEEN ISOLATED CIRCU...
- Publication number 20180124941
- Publication date May 3, 2018
- SHENZHEN XILONG TOY COMPANY LIMITED
- YIPU ZHENG
- H01 - BASIC ELECTRIC ELEMENTS