initial plating of through-holes in substrates having a metal pattern

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H05K3/428

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

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H05K3/428initial plating of through-holes in substrates having a metal pattern

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate, method for manufacturing substrate, and electronic device
- Patent number 12,114,433
- Issue date Oct 8, 2024
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Hiroshi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,882,656
- Issue date Jan 23, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board and imaging device
- Patent number 11,627,661
- Issue date Apr 11, 2023
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microcontroller board for the learning and practice of coding
- Patent number 11,545,051
- Issue date Jan 3, 2023
- Hanoi Ju
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Substrate connecting structure
- Patent number 11,284,530
- Issue date Mar 22, 2022
- Kabushiki Kaisha Toyota Jidoshokki
- Tomoyuki Mase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,201,109
- Issue date Dec 14, 2021
- Corning Incorporated
- Mandakini Kanungo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Printed circuit board and manufacturing method for the same
- Patent number 11,166,365
- Issue date Nov 2, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- A-ran Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,152,294
- Issue date Oct 19, 2021
- Corning Incorporated
- Tian Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring substrate
- Patent number 11,122,686
- Issue date Sep 14, 2021
- Ibiden Co., Ltd.
- Yasuki Kimishima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing a high impedance surface (HIS) enhanced by...
- Patent number 11,071,213
- Issue date Jul 20, 2021
- The Boeing Company
- Charles Muwonge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a wired circuit board
- Patent number 11,058,002
- Issue date Jul 6, 2021
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,026,327
- Issue date Jun 1, 2021
- LG Innotek Co., Ltd
- Heun Gun Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,903,577
- Issue date Jan 26, 2021
- Ibiden Co., Ltd.
- Hirotaka Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for production thereof
- Patent number 10,834,810
- Issue date Nov 10, 2020
- Schweizer Electronic AG
- Hubert Trageser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing support structures for lighting devices and...
- Patent number 10,797,211
- Issue date Oct 6, 2020
- Osram GmbH
- Lorenzo Baldo
- F21 - LIGHTING
Information Patent Grant
Method for manufacturing flexible printed circuit board
- Patent number 10,791,625
- Issue date Sep 29, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming conductive vias using a light guide
- Patent number 10,712,664
- Issue date Jul 14, 2020
- International Business Machines Corporation
- Gerald Bartley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming through holes through exposed dielectric material of compon...
- Patent number 10,531,577
- Issue date Jan 7, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gernot Grober
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,420,214
- Issue date Sep 17, 2019
- Ibiden Co., Ltd.
- Toshiaki Hibino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board, printed circuit board structure and...
- Patent number 10,321,561
- Issue date Jun 11, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper interconnect for PTH components assembly
- Patent number 10,231,333
- Issue date Mar 12, 2019
- Flextronics AP, LLC
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming blind vias for printed circuit boards
- Patent number 10,201,085
- Issue date Feb 5, 2019
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board formation using organic substrates
- Patent number 9,760,002
- Issue date Sep 12, 2017
- International Business Machines Corporation
- Hiroyuki Mori
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Fabrication process of stepped circuit board
- Patent number 9,713,261
- Issue date Jul 18, 2017
- SHENZHEN SUNTAK MULTILAYER PCB CO., LTD.
- Jianyuan Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board formation using organic substrates
- Patent number 9,684,237
- Issue date Jun 20, 2017
- International Business Machines Corporation
- Hiroyuki Mori
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Package substrate, semiconductor package and method of manufacturin...
- Patent number 9,640,503
- Issue date May 2, 2017
- Siliconware Precision Industries Co., Ltd.
- Ming-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 9,572,250
- Issue date Feb 14, 2017
- LG Innotek Co., Ltd
- Sang Myung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,554,466
- Issue date Jan 24, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myung-Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive structures for microfeature devices and methods for fabr...
- Patent number 9,313,902
- Issue date Apr 12, 2016
- Micron Technology, Inc.
- Mark S. Johnson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...
- Publication number 20230081618
- Publication date Mar 16, 2023
- INTELLIMICRO MEDICAL CO., LTD.
- Yu-chong Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE, METHOD FOR MANUFACTURING SUBSTRATE, AND ELECTRONIC DEVICE
- Publication number 20220312595
- Publication date Sep 29, 2022
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Hiroshi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-AXIAL VIA STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20220240375
- Publication date Jul 28, 2022
- Unimicron Technology Corp.
- Ching-Sheng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRED CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND IMAGING DEVICE
- Publication number 20210298175
- Publication date Sep 23, 2021
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS WIRING SUBSTRATE AND COMPONENT-MOUNTED GLASS WIRING SUBSTRATE
- Publication number 20210068266
- Publication date Mar 4, 2021
- SONY CORPORATION
- Hiroshi ISOBE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MANUFACTURING A HIGH IMPEDANCE SURFACE (HIS) ENHANCED BY...
- Publication number 20210029836
- Publication date Jan 28, 2021
- The Boeing Company
- Charles Muwonge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRED CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND IMAGING DEVICE
- Publication number 20200288575
- Publication date Sep 10, 2020
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20200205284
- Publication date Jun 25, 2020
- LG Innotek Co., Ltd.
- Heun Gun SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20200178398
- Publication date Jun 4, 2020
- KABUSHIKI KAISHA TOSHIBA
- Kota TOKUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20200170102
- Publication date May 28, 2020
- Samsung Electro-Mechanics Co., Ltd.
- A-ran LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MAKING CIRCUIT BOARD
- Publication number 20200163229
- Publication date May 21, 2020
- Qi Ding Technology Qinhuangdao Co., Ltd.
- SHIH-FU HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROCONTROLLER BOARD FOR THE LEARNING AND PRACTICE OF CODING
- Publication number 20200051461
- Publication date Feb 13, 2020
- Hanol JU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE CONNECTING STRUCTURE
- Publication number 20200037461
- Publication date Jan 30, 2020
- KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Tomoyuki MASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD STRUCTURE AND...
- Publication number 20190254161
- Publication date Aug 15, 2019
- Avary Holding (Shenzhen) Co., Limited.
- XIAN-QIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR PRODUCTION THEREOF
- Publication number 20190223286
- Publication date Jul 18, 2019
- Schweizer Electronic AG
- Hubert Trageser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190104615
- Publication date Apr 4, 2019
- IBIDEN CO., LTD.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING BLIND VIAS FOR PRINTED CIRCUIT BOARDS
- Publication number 20180279473
- Publication date Sep 27, 2018
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20180279474
- Publication date Sep 27, 2018
- IBIDEN CO., LTD.
- Toshiaki HIBINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing support structures for lighting devices and...
- Publication number 20180062054
- Publication date Mar 1, 2018
- OSRAM GMBH
- Lorenzo Baldo
- F21 - LIGHTING
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20150163908
- Publication date Jun 11, 2015
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140069705
- Publication date Mar 13, 2014
- LG Innotek Co., Ltd.
- Sang Myung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BAORD AND METHOD FOR MANUFACTURING SAME
- Publication number 20140054075
- Publication date Feb 27, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- WEN-HUNG HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SUBSTRATE STRUCTURE
- Publication number 20140000109
- Publication date Jan 2, 2014
- SUBTRON TECHNOLOGY CO., LTD.
- Ching-Sheng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20130312901
- Publication date Nov 28, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jae-Seok LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20130212877
- Publication date Aug 22, 2013
- Unimicron Technology Corp.
- Chen-Chuan Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD FOR MANU...
- Publication number 20130199035
- Publication date Aug 8, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Yune Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATION METHOD FOR CARRIER SUBSTRATE, PRINTED CIRCUIT BOARD USI...
- Publication number 20130062112
- Publication date Mar 14, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Suk Won LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
1-Layer Interposer Substrate With Through-Substrate Posts
- Publication number 20130000968
- Publication date Jan 3, 2013
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE STRUCTURES FOR MICROFEATURE DEVICES AND METHODS FOR FABR...
- Publication number 20120302054
- Publication date Nov 29, 2012
- Micron Technology, Inc.
- Mark S. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
- Publication number 20120199389
- Publication date Aug 9, 2012
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

initial plating of through-holes in substrates having a metal pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hermetic metallized via with improved reliability

Substrate, method for manufacturing substrate, and electronic device

Wiring substrate and method for manufacturing wiring substrate

Wired circuit board and imaging device

Microcontroller board for the learning and practice of coding

Substrate connecting structure

Hermetic metallized via with improved reliability

Printed circuit board and manufacturing method for the same

Hermetic metallized via with improved reliability

Wiring substrate

Methods of manufacturing a high impedance surface (HIS) enhanced by...

Method of producing a wired circuit board

Printed circuit board

Printed wiring board

Circuit board and method for production thereof

Method of manufacturing support structures for lighting devices and...

Method for manufacturing flexible printed circuit board

Forming conductive vias using a light guide

Forming through holes through exposed dielectric material of compon...

Printed wiring board

Flexible printed circuit board, printed circuit board structure and...

Copper interconnect for PTH components assembly

Methods of forming blind vias for printed circuit boards

Circuit board formation using organic substrates

Fabrication process of stepped circuit board

Circuit board formation using organic substrates

Package substrate, semiconductor package and method of manufacturin...

Printed circuit board and method for manufacturing the same

Printed circuit board and method of manufacturing the same

Conductive structures for microfeature devices and methods for fabr...

Patents Applicationslast 30 patents

CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...

SUBSTRATE, METHOD FOR MANUFACTURING SUBSTRATE, AND ELECTRONIC DEVICE

CO-AXIAL VIA STRUCTURE AND MANUFACTURING METHOD OF THE SAME

WIRED CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND IMAGING DEVICE

GLASS WIRING SUBSTRATE AND COMPONENT-MOUNTED GLASS WIRING SUBSTRATE

METHODS OF MANUFACTURING A HIGH IMPEDANCE SURFACE (HIS) ENHANCED BY...

WIRED CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND IMAGING DEVICE

PRINTED CIRCUIT BOARD

WIRING BOARD

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

CIRCUIT BOARD AND METHOD OF MAKING CIRCUIT BOARD

MICROCONTROLLER BOARD FOR THE LEARNING AND PRACTICE OF CODING

SUBSTRATE CONNECTING STRUCTURE

FLEXIBLE PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD STRUCTURE AND...

CIRCUIT BOARD AND METHOD FOR PRODUCTION THEREOF

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

METHODS OF FORMING BLIND VIAS FOR PRINTED CIRCUIT BOARDS

PRINTED WIRING BOARD

Method of manufacturing support structures for lighting devices and...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BAORD AND METHOD FOR MANUFACTURING SAME

MANUFACTURING METHOD OF SUBSTRATE STRUCTURE

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF CIRCUIT BOARD

CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD FOR MANU...

FABRICATION METHOD FOR CARRIER SUBSTRATE, PRINTED CIRCUIT BOARD USI...

1-Layer Interposer Substrate With Through-Substrate Posts

CONDUCTIVE STRUCTURES FOR MICROFEATURE DEVICES AND METHODS FOR FABR...

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD