initial plating of through-holes in substrates without metal

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CPC
H05K3/426

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/426initial plating of through-holes in substrates without metal

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Laminated film structure and method for manufacturing laminated fil...
- Patent number 12,069,809
- Issue date Aug 20, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuya Shimada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and process for creating high-performance coax sockets
- Patent number 12,052,830
- Issue date Jul 30, 2024
- Advantest America, Inc
- Donald Eric Thompson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate with gradiated dielectric for reducing impedance mismatch
- Patent number 11,837,458
- Issue date Dec 5, 2023
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated film structure and method for manufacturing laminated fil...
- Patent number 11,825,608
- Issue date Nov 21, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuya Shimada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless and electrolytic deposition process for forming traces...
- Patent number 11,653,453
- Issue date May 16, 2023
- CATLAM, LLC
- Kenneth S Bahl
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wiring board
- Patent number 11,647,589
- Issue date May 9, 2023
- Shinko Electric Industries Co., Ltd.
- Shuhei Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass wiring board, method for manufacturing the same, and semicond...
- Patent number 11,406,025
- Issue date Aug 2, 2022
- Toppan Printing Co., Ltd.
- Takashi Fujita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded interconnect device
- Patent number 11,357,112
- Issue date Jun 7, 2022
- Molex, LLC
- Tsuey Choo Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing printed wire boards
- Patent number 11,337,309
- Issue date May 17, 2022
- Rohm and Haas Electronic Materials LLC
- Tina Aoude
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with glass sheet, resin layer and through-glass via
- Patent number 11,276,584
- Issue date Mar 15, 2022
- Nippon Sheet Glass Company, Limited
- Keiji Tsunetomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,266,027
- Issue date Mar 1, 2022
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board deformable in both length and width
- Patent number 11,246,212
- Issue date Feb 8, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Xiang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double-sided circuit board and method for preparing the same
- Patent number 11,134,574
- Issue date Sep 28, 2021
- Taiwan Green Point Enterprises Co., Ltd.
- I-Lin Tseng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for plating printed circuit board and printed circuit board...
- Patent number 11,096,291
- Issue date Aug 17, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong Chan Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, method of manufacturing circuit board, and electroni...
- Patent number 11,057,996
- Issue date Jul 6, 2021
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Toshiki Iwai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,032,915
- Issue date Jun 8, 2021
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Array-type electrode, digital printing mold and method for manufact...
- Patent number 10,913,301
- Issue date Feb 9, 2021
- Industrial Technology Research Institute
- Wei-Yuan Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Process for forming traces on a catalytic laminate
- Patent number 10,849,233
- Issue date Nov 24, 2020
- CATLAM, LLC
- Kenneth S Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 10,757,820
- Issue date Aug 25, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing through wiring substrate and method for ma...
- Patent number 10,667,392
- Issue date May 26, 2020
- Canon Kabushiki Kaisha
- Shinan Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,600,728
- Issue date Mar 24, 2020
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, and manufacturing method
- Patent number 10,593,606
- Issue date Mar 17, 2020
- Sony Corporation
- Kousuke Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra thin multi-die fac...
- Patent number 10,573,600
- Issue date Feb 25, 2020
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional wiring board production method, three-dimensional...
- Patent number 10,537,021
- Issue date Jan 14, 2020
- Meiko Electronics Co., Ltd.
- Shigeru Michiwaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compositions including a high molecular weight acid suitable for co...
- Patent number 10,508,207
- Issue date Dec 17, 2019
- MacDermid Enthone Inc.
- Christian Rietmann
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Length- and width-deformable printed circuit board and method for m...
- Patent number 10,499,496
- Issue date Dec 3, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Xiang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor and capacitor integrated on a substrate
- Patent number 10,470,309
- Issue date Nov 5, 2019
- QUALCOMM Incorporated
- Mete Erturk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing glass substrate and glass sheet
- Patent number 10,418,256
- Issue date Sep 17, 2019
- Nippon Sheet Glass Company, Limited
- Keiji Tsunetomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring circuit component, mold for manufac...
- Patent number 10,390,437
- Issue date Aug 20, 2019
- KOTO ENGRAVING CO., LTD.
- Takumi Kudou
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
HIGH ASPECT RATIO VIAS FILLED WITH LIQUID METAL FILL
- Publication number 20240196540
- Publication date Jun 13, 2024
- SAMTEC, INC.
- Christopher David BOHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...
- Publication number 20230389189
- Publication date Nov 30, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Kazuya SHIMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND PROCESS FOR CREATING HIGH-PERFORMANCE COAX SOCKETS
- Publication number 20230180397
- Publication date Jun 8, 2023
- R&D Circuits
- Donald Eric Thompson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...
- Publication number 20230156924
- Publication date May 18, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Kazuya SHIMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COAXIAL VIA SHIELDED INTERPOSER
- Publication number 20230063808
- Publication date Mar 2, 2023
- Apple Inc.
- Nima Shahidi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A MOLDED INTERCONNECT DEVICE
- Publication number 20220279656
- Publication date Sep 1, 2022
- Molex, LLC
- Tsuey Choo CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20220039260
- Publication date Feb 3, 2022
- Shinko Electric Industries Co., Ltd.
- Shuhei MOMOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PLATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD...
- Publication number 20210329794
- Publication date Oct 21, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Jong Chan CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CONDUCTIVE MEMBER
- Publication number 20210251086
- Publication date Aug 12, 2021
- NOK Corporation
- Yasushi SUGIYAMA
- G01 - MEASURING TESTING
Information Patent Application
Process For Forming Traces on a Catalytic Laminate
- Publication number 20210051804
- Publication date Feb 18, 2021
- CATLAM, LLC
- Kenneth S. BAHL
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PLATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD...
- Publication number 20200413548
- Publication date Dec 31, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jong Chan CHOI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRE BOARDS, METHODS OF MANUFACTURE THEREOF AND ARTICLES CO...
- Publication number 20200296837
- Publication date Sep 17, 2020
- Rohm and Haas Electronic Materials L.L.C.
- Tina Aoude
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS WIRING BOARD, METHOD FOR MANUFACTURING THE SAME, AND SEMICOND...
- Publication number 20200275558
- Publication date Aug 27, 2020
- Toppan Printing Co.,Ltd.
- Takashi FUJITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PLATING METHOD THEREOF
- Publication number 20200128680
- Publication date Apr 23, 2020
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE WITH GLASS SHEET, RESIN LAYER AND THROUGH-GLASS VIA
- Publication number 20190362987
- Publication date Nov 28, 2019
- Nippon Sheet Glass Company, Limited
- Keiji TSUNETOMO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD DEFORMABLE IN BOTH LENGTH AND WIDTH
- Publication number 20190306974
- Publication date Oct 3, 2019
- Avary Holding (Shenzhen) Co., Limited.
- WEI-XIANG LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...
- Publication number 20190289715
- Publication date Sep 19, 2019
- Fujitsu Limited
- Toshiki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compositions Including a High Molecular Weight Acid Suitable for Co...
- Publication number 20190177556
- Publication date Jun 13, 2019
- MacDermid Enthone Inc.
- Christian Rietmann
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MOLDED INTERCONNECT DEVICE AND METHOD OF MAKING SAME
- Publication number 20190166698
- Publication date May 30, 2019
- Molex, LLC
- Tsuey Choo CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL...
- Publication number 20190124763
- Publication date Apr 25, 2019
- MEIKO ELECTRONICS CO., LTD.
- Shigeru MICHIWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE-SIDED CIRCUIT BOARD AND METHOD FOR PREPARING THE SAME
- Publication number 20190045638
- Publication date Feb 7, 2019
- TAIWAN GREEN POINT ENTERPRISES CO., LTD.
- I Lin Tseng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20180277471
- Publication date Sep 27, 2018
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND PRINTED CIRCUIT BOAR...
- Publication number 20180206346
- Publication date Jul 19, 2018
- Kuo-Ping YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, AND MANUFACTURING METHOD
- Publication number 20180145004
- Publication date May 24, 2018
- SONY CORPORATION
- Kousuke SEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compositions Including a High Molecular Weight Acid Suitable for Co...
- Publication number 20180002541
- Publication date Jan 4, 2018
- MacDermid Enthone Inc.
- Christian Rietmann
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...
- Publication number 20170309572
- Publication date Oct 26, 2017
- STATS ChipPAC Pte Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA IN A PRINTED CIRCUIT BOARD
- Publication number 20160295708
- Publication date Oct 6, 2016
- SIERRA CIRCUITS, INC.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD PRECURSOR
- Publication number 20160255721
- Publication date Sep 1, 2016
- ICHIA TECHNOLOGIES,INC.
- CHIEN-HWA CHIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160192490
- Publication date Jun 30, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD
- Publication number 20150351257
- Publication date Dec 3, 2015
- KYOCERA Circuit Solutions, Inc.
- Kohichi OHSUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

initial plating of through-holes in substrates without metal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laminated film structure and method for manufacturing laminated fil...

Method and process for creating high-performance coax sockets

Single-layer circuit board, multi-layer circuit board, and manufact...

Substrate with gradiated dielectric for reducing impedance mismatch

Laminated film structure and method for manufacturing laminated fil...

Electroless and electrolytic deposition process for forming traces...

Wiring board

Glass wiring board, method for manufacturing the same, and semicond...

Molded interconnect device

Methods of manufacturing printed wire boards

Substrate with glass sheet, resin layer and through-glass via

Single-layer circuit board, multi-layer circuit board, and manufact...

Printed circuit board deformable in both length and width

Double-sided circuit board and method for preparing the same

Method for plating printed circuit board and printed circuit board...

Circuit board, method of manufacturing circuit board, and electroni...

Single-layer circuit board, multi-layer circuit board, and manufact...

Array-type electrode, digital printing mold and method for manufact...

Process for forming traces on a catalytic laminate

Single-layer circuit board, multi-layer circuit board, and manufact...

Method for manufacturing through wiring substrate and method for ma...

Through-hole electrode substrate

Wiring board, and manufacturing method

Semiconductor device and method of forming ultra thin multi-die fac...

Three-dimensional wiring board production method, three-dimensional...

Compositions including a high molecular weight acid suitable for co...

Length- and width-deformable printed circuit board and method for m...

Inductor and capacitor integrated on a substrate

Method for producing glass substrate and glass sheet

Method for manufacturing wiring circuit component, mold for manufac...

Patents Applicationslast 30 patents

HIGH ASPECT RATIO VIAS FILLED WITH LIQUID METAL FILL

LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...

METHOD AND PROCESS FOR CREATING HIGH-PERFORMANCE COAX SOCKETS

LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...

COAXIAL VIA SHIELDED INTERPOSER

METHOD OF MAKING A MOLDED INTERCONNECT DEVICE

WIRING BOARD

METHOD FOR PLATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD...

MANUFACTURING METHOD OF CONDUCTIVE MEMBER

Process For Forming Traces on a Catalytic Laminate

METHOD FOR PLATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD...

PRINTED WIRE BOARDS, METHODS OF MANUFACTURE THEREOF AND ARTICLES CO...

GLASS WIRING BOARD, METHOD FOR MANUFACTURING THE SAME, AND SEMICOND...

CIRCUIT BOARD AND PLATING METHOD THEREOF

SUBSTRATE WITH GLASS SHEET, RESIN LAYER AND THROUGH-GLASS VIA

PRINTED CIRCUIT BOARD DEFORMABLE IN BOTH LENGTH AND WIDTH

CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...

Compositions Including a High Molecular Weight Acid Suitable for Co...

MOLDED INTERCONNECT DEVICE AND METHOD OF MAKING SAME

THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL...

DOUBLE-SIDED CIRCUIT BOARD AND METHOD FOR PREPARING THE SAME

THROUGH-HOLE ELECTRODE SUBSTRATE

PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND PRINTED CIRCUIT BOAR...

WIRING BOARD, AND MANUFACTURING METHOD

Compositions Including a High Molecular Weight Acid Suitable for Co...

Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...

VIA IN A PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD PRECURSOR

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

METHOD FOR PRODUCING WIRING BOARD