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Inner thermal coupling elements in heat dissipating housings

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  • H05K7/20436
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

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H05K7/20436Inner thermal coupling elements in heat dissipating housings
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

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    • Patrick Allen Lowe
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    THERMAL CONDUCTIVE DEVICE AND MANUFACTURING METHOD THEREOF, ELECTRI...
    • Publication number 20240147671
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    • DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    • XiaoKai WANG
    • H01 - BASIC ELECTRIC ELEMENTS
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    Easily Recyclable Thermoplastic Housing
    • Publication number 20240107713
    • Publication date Mar 28, 2024
    • COVESTRO DEUTSCHLAND AG
    • Meiying Zhu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    ANNULAR-SHAPED HEAT PIPE
    • Publication number 20240098931
    • Publication date Mar 21, 2024
    • Dell Products L.P.
    • Dominick LOVICOTT
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    MEMORY CARD SOCKET
    • Publication number 20240086653
    • Publication date Mar 14, 2024
    • KIOXIA Corporation
    • Akihiro IIDA
    • G06 - COMPUTING CALCULATING COUNTING
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    COMPLIANT COOLING PLATES
    • Publication number 20240049431
    • Publication date Feb 8, 2024
    • Transport Phenomena Technologies, LLC
    • Georgios KARAMANIS
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    THERMAL MANAGEMENT IN ELECTRICAL BOXES USING PASSIVE COOLING
    • Publication number 20240032237
    • Publication date Jan 25, 2024
    • CRESTRON ELECTRONICS, INC.
    • Albert Pedoeem
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    HEAT SPREADER FOR TRANSFERRING HEAT FROM AN ELECTRONIC HEAT SOURCE...
    • Publication number 20240023281
    • Publication date Jan 18, 2024
    • Huawei Technologies Co., Ltd
    • Fredrik Ohlsson
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    SEMICONDUCTOR DEVICE
    • Publication number 20230411238
    • Publication date Dec 21, 2023
    • Samsung Electronics Co., Ltd.
    • ILHAN YUN
    • H01 - BASIC ELECTRIC ELEMENTS
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    CONNECTOR ASSEMBLY
    • Publication number 20230411897
    • Publication date Dec 21, 2023
    • Molex, LLC
    • Che-Yuan Yang
    • H01 - BASIC ELECTRIC ELEMENTS
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    APPARATUS INCLUDING THERMAL MANAGEMENT MECHANISM AND METHODS OF MAN...
    • Publication number 20230397372
    • Publication date Dec 7, 2023
    • Micron Technology, Inc.
    • Suresh Reddy Yarragunta
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    TERMINAL BLOCK
    • Publication number 20230397373
    • Publication date Dec 7, 2023
    • AUTONETWORKS TECHNOLOGIES, LTD.
    • Yuta KANEMATSU
    • H01 - BASIC ELECTRIC ELEMENTS
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    CONNECTOR
    • Publication number 20230378683
    • Publication date Nov 23, 2023
    • YAZAKI CORPORATION
    • Katsuya Nakano
    • H01 - BASIC ELECTRIC ELEMENTS
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    IMMERSION-TYPE LIQUID COOLING HEAT DISSIPATION STRUCTURE
    • Publication number 20230363111
    • Publication date Nov 9, 2023
    • Amulaire thermal technology, INC.
    • KUO-WEI LEE
    • F28 - HEAT EXCHANGE IN GENERAL
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    HEAT-DISSIPATION HOLDER AND PROTECTIVE CASE FOR ELECTRONIC EQUIPMENT
    • Publication number 20230363114
    • Publication date Nov 9, 2023
    • SHENZHEN BENKS TECHNOLOGY CO., LTD
    • Xiaojiong LIN
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
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    Base Stations For Unmanned Aerial Vehicles (UAVs)
    • Publication number 20230348105
    • Publication date Nov 2, 2023
    • Skydio, Inc.
    • Christopher Brian Grasberger
    • B60 - VEHICLES IN GENERAL
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    HEAT SINK BASE AND HEAT SINK
    • Publication number 20230292462
    • Publication date Sep 14, 2023
    • Beijing Deepcool Industries Co., Ltd.
    • Dangsheng ZHAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20230276598
    • Publication date Aug 31, 2023
    • InnoLux Corporation
    • Yung-Kan CHEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    Power Supply Enclosure, Power Supply Conversion Apparatus, and Elec...
    • Publication number 20230261565
    • Publication date Aug 17, 2023
    • Huawei Digital Power Technologies Co., Ltd.
    • Lin Du
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
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    THREE-DIMENSIONAL FLOW BALANCE FOR POWER MODULE COOLING
    • Publication number 20230260873
    • Publication date Aug 17, 2023
    • George R. Woody
    • H01 - BASIC ELECTRIC ELEMENTS
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    ELECTRONIC DEVICE
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    • Publication date Aug 17, 2023
    • Getac Technology Corporation
    • Wan-Lin HSU
    • G06 - COMPUTING CALCULATING COUNTING
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    CONNECTOR ASSEMBLY
    • Publication number 20230262929
    • Publication date Aug 17, 2023
    • Molex, LLC
    • You-Qian LU
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    Cooling Device For Cooling Components Of A Circuit Board
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    • Nexalus Limited
    • Anthony Robinson
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    CAMERA MODULE
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    • Publication date Jul 27, 2023
    • LG Innotek Co., Ltd.
    • Jong Cheol CHOI
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    COOLING CASE PROVIDING COOLING OF ELECTRONIC CARDS
    • Publication number 20230217627
    • Publication date Jul 6, 2023
    • ASELSAN ELEKTRONIK SANAYI VE TICARET ANONIM SIRKETI
    • Murat PARLAK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    THERMAL CONDUIT FOR ELECTRONIC DEVICE
    • Publication number 20230200019
    • Publication date Jun 22, 2023
    • Meta Platforms Technologies, LLC
    • Michael Nikkhoo
    • G06 - COMPUTING CALCULATING COUNTING
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    IMMERSION-TYPE POROUS HEAT DISSIPATION STRUCTURE
    • Publication number 20230180435
    • Publication date Jun 8, 2023
    • Amulaire thermal technology, INC.
    • CHING-MING YANG
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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    Thermal-Control System Of A Mesh Network Device and Associated Mesh...
    • Publication number 20230139054
    • Publication date May 4, 2023
    • Google LLC
    • Ihab A. Ali
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    POWER MODULE
    • Publication number 20230139725
    • Publication date May 4, 2023
    • LITE-ON SINGAPORE PTE. LTD.
    • Yijun Pan
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INLET MODULE, HOUSING AND ELECTRONIC DEVICE
    • Publication number 20230127994
    • Publication date Apr 27, 2023
    • CHROMA ATE INC.
    • Po-Kai Cheng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR