Inorganic insulating substrates

Industry

CPC
H05K1/0306

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0306Inorganic insulating substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonded body including titanium alloy at bonding boundary
- Patent number 12,347,744
- Issue date Jul 1, 2025
- Kabushiki Kaisha Toshiba
- Seiichi Suenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitors in through glass vias
- Patent number 12,349,282
- Issue date Jul 1, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 12,349,269
- Issue date Jul 1, 2025
- Toray Industries, Inc.
- Ryutaro Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, lens driving device, and camera module including the...
- Patent number 12,336,092
- Issue date Jun 17, 2025
- LG Innotek Co., Ltd
- Na Kyung Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic capacitor and board having the same
- Patent number 12,334,262
- Issue date Jun 17, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Moon Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for selective metallisation of inorganic dielectrics or semi...
- Patent number 12,336,114
- Issue date Jun 17, 2025
- Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Karolis Ratautas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit packages having electrical and optical connectiv...
- Patent number 12,326,604
- Issue date Jun 10, 2025
- Corning Incorporated
- Lars Martin Otfried Brusberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact thin film surface mountable coupler having wide-band perfor...
- Patent number 12,327,903
- Issue date Jun 10, 2025
- KYOCERA AVX Components Corporation
- Michael Marek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass core wiring substrate incorporating high-frequency filter, hi...
- Patent number 12,317,411
- Issue date May 27, 2025
- TOPPAN INC.
- Susumu Maniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact ceramic package with rear cavities
- Patent number 12,295,097
- Issue date May 6, 2025
- Waymo LLC
- Shashank Sharma
- G01 - MEASURING TESTING
Information Patent Grant
Component carrier with partially metallized hole using anti-plating...
- Patent number 12,295,108
- Issue date May 6, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Jiangfeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stray inductance busbar structure for power module
- Patent number 12,294,312
- Issue date May 6, 2025
- ZHENGHAI GROUP CO., LTD.
- Xianye Mao
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed board and electronic device
- Patent number 12,289,827
- Issue date Apr 29, 2025
- Kioxia Corporation
- Yuta Tsubouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass cloth, prepreg, and printed wiring board
- Patent number 12,286,731
- Issue date Apr 29, 2025
- Nitto Boseki Co., LTD
- Hiroyuki Kawanishi
- D03 - WEAVING
Information Patent Grant
Ceramic-cladded copper plate and method for manufacturing ceramic-c...
- Patent number 12,284,766
- Issue date Apr 22, 2025
- BYD Company Limited
- Wei Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board and display device
- Patent number 12,279,378
- Issue date Apr 15, 2025
- Kyocera Corporation
- Nobuyuki Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module
- Patent number 12,273,995
- Issue date Apr 8, 2025
- AMOSENSE CO., LTD.
- Taejung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate module with filter function
- Patent number 12,273,994
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Noriaki Okuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and manufacturing method thereof
- Patent number 12,267,958
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Hiromitsu Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg, laminate, and production methods therefor, as well as prin...
- Patent number 12,256,490
- Issue date Mar 18, 2025
- Resonac Corporation
- Mari Shimizu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Bonded substrate and bonded substrate manufacturing method
- Patent number 12,249,547
- Issue date Mar 11, 2025
- NGK Insulators, Ltd.
- Takashi Ebigase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and cutting method thereof
- Patent number 12,250,776
- Issue date Mar 11, 2025
- Unimicron Technology Corp.
- Jeng-Ting Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency electronic component and module
- Patent number 12,245,365
- Issue date Mar 4, 2025
- Murata Manufacturing Co., Ltd.
- Hirofumi Oie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and method of forming the same
- Patent number 12,243,813
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,238,852
- Issue date Feb 25, 2025
- Avary Holding (Shenzhen) Co., Limited.
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carriers connected by staggered interconnect elements
- Patent number 12,232,263
- Issue date Feb 18, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,232,255
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and method for producing electronic component
- Patent number 12,224,097
- Issue date Feb 11, 2025
- Murata Manufacturing Co., Ltd.
- Kouhei Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Motor vehicle lighting module comprising a ceramic substrate
- Patent number 12,225,662
- Issue date Feb 11, 2025
- Valeo Vision
- Alexandre Val
- F21 - LIGHTING

Patents Applicationslast 30 patents

Information Patent Application
METAL-CERAMIC SUBSTRATE WITH CONTACT AREA
- Publication number 20250240884
- Publication date Jul 24, 2025
- Heraeus Electronics GmbH & Co. KG
- Richard WACKER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250240887
- Publication date Jul 24, 2025
- Unimicron Technology Corp.
- Chin-Sheng WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, LAMINATE, AND PRODUCTION METHODS THEREFOR, AS WELL AS PRIN...
- Publication number 20250234456
- Publication date Jul 17, 2025
- Resonac Corporation
- Mari SHIMIZU
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METAL-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, A...
- Publication number 20250234458
- Publication date Jul 17, 2025
- Resonac Corporation
- Takayo KITAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227841
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227842
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wearable Device for Sports Headwear
- Publication number 20250227839
- Publication date Jul 10, 2025
- HEAD IMPACT TRAUMA LIMITED
- David Euan Murray BOWEN
- A42 - HEADWEAR
Information Patent Application
WIRING BOARD
- Publication number 20250220813
- Publication date Jul 3, 2025
- KYOCERA CORPORATION
- Hiroaki SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250212321
- Publication date Jun 26, 2025
- Dyi-Chung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250212324
- Publication date Jun 26, 2025
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20250203768
- Publication date Jun 19, 2025
- KYOCERA CORPORATION
- Makoto YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250203785
- Publication date Jun 19, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHUNG-HO WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20250203751
- Publication date Jun 19, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS
- Publication number 20250203772
- Publication date Jun 19, 2025
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Louis Diamond
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VOLTAGE-ISOLATED IC PACKAGES WITH EXTENSIONS FOR CORE PLACEMENT
- Publication number 20250201466
- Publication date Jun 19, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Vijay Mangtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND ME...
- Publication number 20250203752
- Publication date Jun 19, 2025
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250203769
- Publication date Jun 19, 2025
- Nichia Corporation.
- Atsushi HOSOKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
- Publication number 20250203773
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME
- Publication number 20250191841
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Moon Soo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250194001
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Moon JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250194004
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Mi Sun Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250185162
- Publication date Jun 5, 2025
- KYOCERA CORPORATION
- Hiroaki SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...
- Publication number 20250185156
- Publication date Jun 5, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CLOTH TREATMENT LIQUID AND SURFACE TREATED GLASS CLOTH
- Publication number 20250178955
- Publication date Jun 5, 2025
- Shin-Etsu Chemical Co., Ltd.
- Shigeki YASUDA
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Metal-ceramic substrate and method of manufacturing a metal-ceramic...
- Publication number 20250185166
- Publication date Jun 5, 2025
- Rogers Germany GmbH
- Tilo Welker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEXIBLE PCB, POWER MODULE INCLUDING THE PCB, AND MANUFACTURI...
- Publication number 20250176113
- Publication date May 29, 2025
- STMicroelectronics International N.V.
- Luciano ZIZZA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
- Publication number 20250174537
- Publication date May 29, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250176099
- Publication date May 29, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20250168988
- Publication date May 22, 2025
- Unimicron Technology Corp.
- Jeng-Ting LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...
- Publication number 20250168977
- Publication date May 22, 2025
- The Trustees of the University of Pennsylvania
- Alan T. Johnson
- H01 - BASIC ELECTRIC ELEMENTS

Inorganic insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded body including titanium alloy at bonding boundary

Capacitors in through glass vias

Wiring board

Circuit board, lens driving device, and camera module including the...

Multilayer ceramic capacitor and board having the same

Method for selective metallisation of inorganic dielectrics or semi...

Integrated circuit packages having electrical and optical connectiv...

Compact thin film surface mountable coupler having wide-band perfor...

Glass core wiring substrate incorporating high-frequency filter, hi...

Compact ceramic package with rear cavities

Component carrier with partially metallized hole using anti-plating...

Low stray inductance busbar structure for power module

Printed board and electronic device

Glass cloth, prepreg, and printed wiring board

Ceramic-cladded copper plate and method for manufacturing ceramic-c...

Wiring board and display device

Power module

Multilayer substrate module with filter function

Electronic component and manufacturing method thereof

Prepreg, laminate, and production methods therefor, as well as prin...

Bonded substrate and bonded substrate manufacturing method

Substrate structure and cutting method thereof

High-frequency electronic component and module

Connection structure and method of forming the same

Circuit board with bridge chiplets

Circuit board and method for manufacturing the same

Component carriers connected by staggered interconnect elements

Circuit board

Electronic component and method for producing electronic component

Motor vehicle lighting module comprising a ceramic substrate

Patents Applicationslast 30 patents

METAL-CERAMIC SUBSTRATE WITH CONTACT AREA

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PREPREG, LAMINATE, AND PRODUCTION METHODS THEREFOR, AS WELL AS PRIN...

METAL-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, A...

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

Wearable Device for Sports Headwear

WIRING BOARD

SUBSTRATE AND MANUFACTURING METHOD THEREOF

WIRING BOARD

CERAMIC WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME

TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS

VOLTAGE-ISOLATED IC PACKAGES WITH EXTENSIONS FOR CORE PLACEMENT

PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND ME...

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

WIRING BOARD

METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...

GLASS CLOTH TREATMENT LIQUID AND SURFACE TREATED GLASS CLOTH

Metal-ceramic substrate and method of manufacturing a metal-ceramic...

RIGID-FLEXIBLE PCB, POWER MODULE INCLUDING THE PCB, AND MANUFACTURI...

PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME

PRINTED CIRCUIT BOARD

SUBSTRATE STRUCTURE

Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...