Insulation

Industry

CPC
H05K2201/0753

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0753Insulation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Heat removal architecture for stack-type component carrier with emb...
- Patent number 12,167,529
- Issue date Dec 10, 2024
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and electrically insulating member therefor
- Patent number 11,369,022
- Issue date Jun 21, 2022
- Mitsubishi Electric Corporation
- Haruyuki Matsuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Damping arrangement for power electronics applications
- Patent number 11,197,364
- Issue date Dec 7, 2021
- ZF Friedrichshafen AG
- Ivonne Trenz
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit assembly
- Patent number 11,122,689
- Issue date Sep 14, 2021
- MBDA UK Limited
- Adam Armitage
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier for LTCC components
- Patent number 9,167,690
- Issue date Oct 20, 2015
- Scientific Components Corporation
- Harvey L. Kaylie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier for LTCC components
- Patent number 8,749,989
- Issue date Jun 10, 2014
- Scientific Components Corporation
- Harvey L. Kaylie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240268034
- Publication date Aug 8, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jesang Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240224413
- Publication date Jul 4, 2024
- Resonac Corporation
- Kosuke URASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BODY, MOUNTING SUBSTRATE, WIRING-EQUIPPED WIRING TRANSFER PL...
- Publication number 20240147617
- Publication date May 2, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Takayoshi NIRENGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND DISK DEVICE
- Publication number 20240040696
- Publication date Feb 1, 2024
- Kabushiki Kaisha Toshiba
- Yoshihiro AMEMIYA
- G11 - INFORMATION STORAGE
Information Patent Application
Heat Removal Architecture for Stack-Type Component Carrier With Emb...
- Publication number 20220272828
- Publication date Aug 25, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND ELECTRICALLY INSULATING MEMBER THEREFOR
- Publication number 20210204407
- Publication date Jul 1, 2021
- Mitsubishi Electric Corporation
- Haruyuki MATSUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DAMPING ARRANGEMENT FOR POWER ELECTRONICS APPLICATIONS
- Publication number 20200383201
- Publication date Dec 3, 2020
- ZF Friedrichshafen AG
- Ivonne TRENZ
- B60 - VEHICLES IN GENERAL
Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20200315020
- Publication date Oct 1, 2020
- MBDA UK LIMITED
- Adam ARMITAGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160066423
- Publication date Mar 3, 2016
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR...
- Publication number 20150201485
- Publication date Jul 16, 2015
- Shinko Electric Industries Co., Ltd.
- Tatsuaki DENDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PANEL
- Publication number 20150053461
- Publication date Feb 26, 2015
- WINTEK CORPORATION
- Ying-Ting Liou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat removal architecture for stack-type component carrier with emb...

Electronic device and electrically insulating member therefor

Damping arrangement for power electronics applications

Circuit assembly

Carrier for LTCC components

Carrier for LTCC components

Patents Applicationslast 30 patents

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

WIRING SUBSTRATE

WIRING BODY, MOUNTING SUBSTRATE, WIRING-EQUIPPED WIRING TRANSFER PL...

PRINTED CIRCUIT BOARD AND DISK DEVICE

Heat Removal Architecture for Stack-Type Component Carrier With Emb...

ELECTRONIC DEVICE AND ELECTRICALLY INSULATING MEMBER THEREFOR

DAMPING ARRANGEMENT FOR POWER ELECTRONICS APPLICATIONS

CIRCUIT ASSEMBLY

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR...

PANEL