Insulation

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CIRCUIT BOARD AND DISPLAY APPARATUS

    • Publication number 20250240872
    • Publication date Jul 24, 2025
    • CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    • Shuang LEI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STRETCHABLE DEVICE

    • Publication number 20250203765
    • Publication date Jun 19, 2025
    • Murata Manufacturing Co., Ltd.
    • Yui NAKAMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE CAPABLE OF ELIMINATING BUBBLE FORMATION

    • Publication number 20250120008
    • Publication date Apr 10, 2025
    • PANJIT INTERNATIONAL INC.
    • CHUNG-HSIUNG HO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

    • Publication number 20240268034
    • Publication date Aug 8, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jesang Park
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE

    • Publication number 20240224413
    • Publication date Jul 4, 2024
    • Resonac Corporation
    • Kosuke URASHIMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BODY, MOUNTING SUBSTRATE, WIRING-EQUIPPED WIRING TRANSFER PL...

    • Publication number 20240147617
    • Publication date May 2, 2024
    • Panasonic Intellectual Property Management Co., Ltd.
    • Takayoshi NIRENGI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND DISK DEVICE

    • Publication number 20240040696
    • Publication date Feb 1, 2024
    • Kabushiki Kaisha Toshiba
    • Yoshihiro AMEMIYA
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    Heat Removal Architecture for Stack-Type Component Carrier With Emb...

    • Publication number 20220272828
    • Publication date Aug 25, 2022
    • AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Abderrazzaq Ifis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE AND ELECTRICALLY INSULATING MEMBER THEREFOR

    • Publication number 20210204407
    • Publication date Jul 1, 2021
    • Mitsubishi Electric Corporation
    • Haruyuki MATSUO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DAMPING ARRANGEMENT FOR POWER ELECTRONICS APPLICATIONS

    • Publication number 20200383201
    • Publication date Dec 3, 2020
    • ZF Friedrichshafen AG
    • Ivonne TRENZ
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    CIRCUIT ASSEMBLY

    • Publication number 20200315020
    • Publication date Oct 1, 2020
    • MBDA UK LIMITED
    • Adam ARMITAGE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

    • Publication number 20160066423
    • Publication date Mar 3, 2016
    • IBIDEN CO., LTD.
    • Hajime SAKAMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR...

    • Publication number 20150201485
    • Publication date Jul 16, 2015
    • Shinko Electric Industries Co., Ltd.
    • Tatsuaki DENDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PANEL

    • Publication number 20150053461
    • Publication date Feb 26, 2015
    • WINTEK CORPORATION
    • Ying-Ting Liou
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR