TREA

Insulation

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Industry

  • CPC
  • H05K2201/0753
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0753Insulation
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Electronic device and electrically insulating member therefor
    • Patent number 11,369,022
    • Issue date Jun 21, 2022
    • Mitsubishi Electric Corporation
    • Haruyuki Matsuo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Damping arrangement for power electronics applications
    • Patent number 11,197,364
    • Issue date Dec 7, 2021
    • ZF Friedrichshafen AG
    • Ivonne Trenz
    • B60 - VEHICLES IN GENERAL
  • Information Patent Grant

    Circuit assembly
    • Patent number 11,122,689
    • Issue date Sep 14, 2021
    • MBDA UK Limited
    • Adam Armitage
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Carrier for LTCC components
    • Patent number 9,167,690
    • Issue date Oct 20, 2015
    • Scientific Components Corporation
    • Harvey L. Kaylie
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Carrier for LTCC components
    • Patent number 8,749,989
    • Issue date Jun 10, 2014
    • Scientific Components Corporation
    • Harvey L. Kaylie
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents