Integrated circuits having a three-dimensional layout

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H01L27/0688

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/0688Integrated circuits having a three-dimensional layout

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Complementary MOS FETS vertically arranged and including multiple d...
- Patent number 12,300,550
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mark van Dal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for wafer stack processing
- Patent number 12,293,946
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip sharing data bus
- Patent number 12,293,993
- Issue date May 6, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,289,878
- Issue date Apr 29, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Tatsuya Onuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,278,285
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Seungchan Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,278,216
- Issue date Apr 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically controllable integrated switch
- Patent number 12,272,509
- Issue date Apr 8, 2025
- STMicroelectronics (Rousset) SAS
- Christian Rivero
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit package and method
- Patent number 12,266,584
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stacked integrated circuits having functional blocks configured...
- Patent number 12,266,647
- Issue date Apr 1, 2025
- Micron Technology, Inc.
- Tony M. Brewer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pillar select transistor for 3-dimensional cross point memory
- Patent number 12,268,011
- Issue date Apr 1, 2025
- Intel Corporation
- Prashant Majhi
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,266,769
- Issue date Apr 1, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Junpei Momo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mixer and semiconductor device
- Patent number 12,261,570
- Issue date Mar 25, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Kazuaki Ohshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power distribution structure and method
- Patent number 12,255,148
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor memory structure
- Patent number 12,256,551
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Nuo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming fin-on-nanosheet transistor stacks
- Patent number 12,255,099
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Gunho Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic three dimensional integrated circuit
- Patent number 12,255,203
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor structures of integrated circuit devices including stacked...
- Patent number 12,249,603
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC with gap-fill structures and the method of manufacturing the same
- Patent number 12,249,566
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having three-dimensional transistors and seal ri...
- Patent number 12,243,873
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Yang Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure of stacked two-dimensional material layers
- Patent number 12,237,375
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,237,386
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Sun Ki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional field effect device
- Patent number 12,237,325
- Issue date Feb 25, 2025
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture with stacked N and P transistors with a channel struct...
- Patent number 12,237,330
- Issue date Feb 25, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Sylvain Barraud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Body tie optimization for stacked transistor amplifier
- Patent number 12,231,087
- Issue date Feb 18, 2025
- pSemi Corporation
- Simon Edward Willard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interdigitated device stack
- Patent number 12,224,281
- Issue date Feb 11, 2025
- Tokyo Electron Limited
- Lars Liebmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing 3D semiconductor devices and structures with t...
- Patent number 12,225,737
- Issue date Feb 11, 2025
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising wiring layer over driver circuit
- Patent number 12,225,711
- Issue date Feb 11, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked planar capacitors based multi-function linear threshold gat...
- Patent number 12,218,045
- Issue date Feb 4, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring in diffusion breaks in an integrated circuit
- Patent number 12,218,135
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Lars Liebmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked IC structure with orthogonal interconnect layers
- Patent number 12,218,059
- Issue date Feb 4, 2025
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRINTING AN ELECTRICALLY CONDUCTIVE LAYER ON A SURFACE O...
- Publication number 20250070043
- Publication date Feb 27, 2025
- Heraeus Electronics GmbH & Co. KG
- Ming Hung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070094
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-I Wu
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250072100
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250070010
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR
- Publication number 20250070031
- Publication date Feb 27, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel H LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20250070091
- Publication date Feb 27, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250070007
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE FORMATION IN MEMORY
- Publication number 20250072079
- Publication date Feb 27, 2025
- Micron Technology, Inc.
- Thomas M. Graettinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING DEVICE, AND METHOD FOR MANUFACTURING METAL OXI...
- Publication number 20250059645
- Publication date Feb 20, 2025
- Duck Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING DISCHARGING PATH AND METHODS O...
- Publication number 20250063825
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- JAEHONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING WIMPY TRANSISTOR STACK WITH THI...
- Publication number 20250063782
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Panjae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STACK
- Publication number 20250062226
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Ho CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING A DIODE
- Publication number 20250056897
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Duckseoung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Metallization by a Nickel or Cobalt Alloy for the Manufac...
- Publication number 20250051927
- Publication date Feb 13, 2025
- MacDermid Enthone Inc.
- Mikailou THIAM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CROSS-COUPLED GATE DESIGN FOR STACKED DEVICE WITH SEPARATED TOP-DOW...
- Publication number 20250056873
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Seunghyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREFOR
- Publication number 20250054838
- Publication date Feb 13, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Guanhua YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Vertically-Alternating Tiers of Insulative...
- Publication number 20250046358
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Durai Vishak Nirmal Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES
- Publication number 20250040254
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY
- Publication number 20250040231
- Publication date Jan 30, 2025
- Intel Corporation
- Han Wui THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY
- Publication number 20250031378
- Publication date Jan 23, 2025
- KIOXIA Corporation
- Go OIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250031455
- Publication date Jan 23, 2025
- Advantest Corporation
- Shinji SUGATANI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
- Publication number 20250022876
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Sung Min KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND CIRCUITS
- Publication number 20250022775
- Publication date Jan 16, 2025
- Murata Manufacturing Co., Ltd.
- Shishir RAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...
- Publication number 20250022804
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING TH...
- Publication number 20250022875
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Sunjung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20250014615
- Publication date Jan 9, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Jun Koyama
- G11 - INFORMATION STORAGE
Information Patent Application
Three-dimensional integrated system with compatible chip and manufa...
- Publication number 20250014969
- Publication date Jan 9, 2025
- CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO. 44 RESEARCH INSTITUTE
- Xiaodong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20250017013
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Seokcheon BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20250006735
- Publication date Jan 2, 2025
- SOCIONEXT INC.
- Hideyuki KOMURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE

Integrated circuits having a three-dimensional layout

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Complementary MOS FETS vertically arranged and including multiple d...

Techniques for wafer stack processing

3D chip sharing data bus

Semiconductor device and method of manufacturing semiconductor device

Semiconductor devices

3D semiconductor device and structure with metal layers

Electrically controllable integrated switch

Integrated circuit package and method

3D stacked integrated circuits having functional blocks configured...

Pillar select transistor for 3-dimensional cross point memory

Semiconductor device and electronic device

Mixer and semiconductor device

Power distribution structure and method

Method for forming semiconductor memory structure

Methods of forming fin-on-nanosheet transistor stacks

Monolithic three dimensional integrated circuit

Resistor structures of integrated circuit devices including stacked...

3DIC with gap-fill structures and the method of manufacturing the same

Integrated circuit having three-dimensional transistors and seal ri...

Semiconductor structure of stacked two-dimensional material layers

Semiconductor device and method for fabricating the same

Three-dimensional field effect device

Architecture with stacked N and P transistors with a channel struct...

Body tie optimization for stacked transistor amplifier

Interdigitated device stack

Method for producing 3D semiconductor devices and structures with t...

Semiconductor device comprising wiring layer over driver circuit

Stacked planar capacitors based multi-function linear threshold gat...

Wiring in diffusion breaks in an integrated circuit

Stacked IC structure with orthogonal interconnect layers

Patents Applicationslast 30 patents

METHOD FOR PRINTING AN ELECTRICALLY CONDUCTIVE LAYER ON A SURFACE O...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME

3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME

REPLACEMENT GATE FORMATION IN MEMORY

SUBSTRATE PROCESSING DEVICE, AND METHOD FOR MANUFACTURING METAL OXI...

INTEGRATED CIRCUIT DEVICES INCLUDING DISCHARGING PATH AND METHODS O...

INTEGRATED CIRCUIT DEVICE INCLUDING WIMPY TRANSISTOR STACK WITH THI...

THREE-DIMENSIONAL INTEGRATED CIRCUIT STACK

INTEGRATED CIRCUIT DEVICE INCLUDING A DIODE

Method of Metallization by a Nickel or Cobalt Alloy for the Manufac...

CROSS-COUPLED GATE DESIGN FOR STACKED DEVICE WITH SEPARATED TOP-DOW...

THREE-DIMENSIONAL INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREFOR

Memory Arrays Comprising Vertically-Alternating Tiers of Insulative...

PACKAGE STRUCTURES

GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY

SEMICONDUCTOR MEMORY

THREE-DIMENSIONAL DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

3-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND CIRCUITS

FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING TH...

MEMORY DEVICE AND SEMICONDUCTOR DEVICE

Three-dimensional integrated system with compatible chip and manufa...

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...