Integrated circuits having a three-dimensional layout

Industry

CPC
H01L27/0688

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/0688Integrated circuits having a three-dimensional layout

Industries

Patents Grantslast 30 patents

Information Patent Grant
Devices having a semiconductor material that is semimetal in bulk a...
- Patent number 12,148,816
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jean-Pierre Colinge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising vertically-alternating tiers of insulative...
- Patent number 12,150,318
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Durai Vishak Nirmal Ramaswamy
- G11 - INFORMATION STORAGE
Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having one or more modifying substances distr...
- Patent number 12,144,176
- Issue date Nov 12, 2024
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory
- Patent number 12,144,181
- Issue date Nov 12, 2024
- Kioxia Corporation
- Go Oike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip with shared clock distribution network
- Patent number 12,142,528
- Issue date Nov 12, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a gate-all-around field effect trans...
- Patent number 12,142,529
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Ming Yu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 12,136,663
- Issue date Nov 5, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method (and related apparatus) for forming a resistor over a semico...
- Patent number 12,132,075
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,132,047
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kui Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an upper contact in contact with a s...
- Patent number 12,132,044
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor structures
- Patent number 12,131,898
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package including package seal ring and methods for f...
- Patent number 12,125,761
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 12,119,349
- Issue date Oct 15, 2024
- SOCIONEXT INC.
- Hideyuki Komuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and data storage systems including the same
- Patent number 12,120,876
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Seokcheon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including vertical routing structure and metho...
- Patent number 12,113,063
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory arrays with layer selector transistors
- Patent number 12,114,479
- Issue date Oct 8, 2024
- Intel Corporation
- Wilfred Gomes
- G11 - INFORMATION STORAGE
Information Patent Grant
Front end of line interconnect structures and associated systems an...
- Patent number 12,107,050
- Issue date Oct 1, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for stacked multi-gate device
- Patent number 12,107,169
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zhi-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line structures for three-dimensional integrated circu...
- Patent number 12,100,675
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Ying Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,100,646
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,100,611
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods of forming transistors and methods of forming devices compr...
- Patent number 12,100,629
- Issue date Sep 24, 2024
- Micron Technology, Inc.
- Kevin J. Torek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,101,945
- Issue date Sep 24, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Tomoaki Atsumi
- G11 - INFORMATION STORAGE
Information Patent Grant
Deep trench via for three-dimensional integrated circuit
- Patent number 12,100,705
- Issue date Sep 24, 2024
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact circuit devices using ceramic-copper layers based packaging
- Patent number 12,095,368
- Issue date Sep 17, 2024
- Hamilton Sundstrand Corporation
- Suman Dwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 12,094,874
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale-aligned three-dimensional stacked integrated circuit
- Patent number 12,094,775
- Issue date Sep 17, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Backside Interconnect Structures for Semiconductor Devices and Meth...
- Publication number 20240387529
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices Having a Semiconductor Material That Is Semimetal in Bulk a...
- Publication number 20240387711
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jean-Pierre Colinge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY ARRAYS WITH LAYER SELECTOR TRANSISTORS
- Publication number 20240389300
- Publication date Nov 21, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240387520
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING THREE-DIMENSIONAL TRANSISTORS AND SEAL RI...
- Publication number 20240387535
- Publication date Nov 21, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Kuo-Yang Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING MEMORY ARRAY AND INTEGRATED CIRCUIT
- Publication number 20240387475
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Sheng Yun
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMIN...
- Publication number 20240387519
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT HAVING ESD PROTECTION CIRCUIT
- Publication number 20240387509
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Yu MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH CONNECTION PATHS
- Publication number 20240379624
- Publication date Nov 14, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...
- Publication number 20240379502
- Publication date Nov 14, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN REGIONS VERT...
- Publication number 20240379780
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Keumseok PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379530
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND SYSTEMS INCLUDING CAPACITORS
- Publication number 20240381631
- Publication date Nov 14, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transmission Line Structures for Three-Dimensional Integrated Circu...
- Publication number 20240379592
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Ying Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR STACKED MULTI-GATE DEVICE
- Publication number 20240379855
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zhi-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL ROUTING STRUCTURE AND METHO...
- Publication number 20240371861
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD (AND RELATED APPARATUS) FOR FORMING A RESISTOR OVER A SEMICO...
- Publication number 20240371918
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240371748
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ting Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240371919
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsueh-Han LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240363483
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TING-YU YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...
- Publication number 20240363578
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20240363385
- Publication date Oct 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
DISPLAY DEVICE
- Publication number 20240365588
- Publication date Oct 31, 2024
- Japan Display Inc.
- Satoshi MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...
- Publication number 20240363604
- Publication date Oct 31, 2024
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH A LOGIC DEVICE AND A MEMORY DEVICE BEI...
- Publication number 20240357829
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- BO-FENG YOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUIT WITH POLYCRYSTALLINE STRUCTURE
- Publication number 20240355816
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chenming HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING STACKED GATE STRUCTURES WITH D...
- Publication number 20240355824
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTORS
- Publication number 20240332403
- Publication date Oct 3, 2024
- Intel Corporation
- Patrick MORROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING STACKED TRANSISTORS AND METHOD...
- Publication number 20240332131
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- JINTAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE COMPRISING STAIRCASE PORTION
- Publication number 20240324251
- Publication date Sep 26, 2024
- Kioxia Corporation
- Sota Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS

Integrated circuits having a three-dimensional layout

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Devices having a semiconductor material that is semimetal in bulk a...

Memory arrays comprising vertically-alternating tiers of insulative...

Gallium nitride (GAN) three-dimensional integrated circuit technology

Integrated assemblies having one or more modifying substances distr...

Semiconductor memory

3D chip with shared clock distribution network

Semiconductor device including a gate-all-around field effect trans...

Semiconductor device and manufacturing method of semiconductor device

3D semiconductor device and structure with single-crystal layers

Method (and related apparatus) for forming a resistor over a semico...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device including an upper contact in contact with a s...

Bonded semiconductor structures

3D semiconductor device and structure with metal layers and memory...

Semiconductor package including package seal ring and methods for f...

Semiconductor integrated circuit device

Semiconductor devices and data storage systems including the same

Semiconductor device including vertical routing structure and metho...

Three-dimensional memory arrays with layer selector transistors

Front end of line interconnect structures and associated systems an...

Contact structure for stacked multi-gate device

Transmission line structures for three-dimensional integrated circu...

3D semiconductor device and structure with metal layers

Methods for producing a 3D semiconductor device and structure with...

Methods of forming transistors and methods of forming devices compr...

Semiconductor device

Deep trench via for three-dimensional integrated circuit

Compact circuit devices using ceramic-copper layers based packaging

Semiconductor devices and methods of manufacturing thereof

Nanoscale-aligned three-dimensional stacked integrated circuit

Patents Applicationslast 30 patents

Backside Interconnect Structures for Semiconductor Devices and Meth...

Devices Having a Semiconductor Material That Is Semimetal in Bulk a...

THREE-DIMENSIONAL MEMORY ARRAYS WITH LAYER SELECTOR TRANSISTORS

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

INTEGRATED CIRCUIT HAVING THREE-DIMENSIONAL TRANSISTORS AND SEAL RI...

METHODS OF MANUFACTURING MEMORY ARRAY AND INTEGRATED CIRCUIT

THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMIN...

THREE-DIMENSIONAL INTEGRATED CIRCUIT HAVING ESD PROTECTION CIRCUIT

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH CONNECTION PATHS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...

3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN REGIONS VERT...

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

ELECTRONIC DEVICES AND SYSTEMS INCLUDING CAPACITORS

Transmission Line Structures for Three-Dimensional Integrated Circu...

CONTACT STRUCTURE FOR STACKED MULTI-GATE DEVICE

SEMICONDUCTOR DEVICE INCLUDING VERTICAL ROUTING STRUCTURE AND METHO...

METHOD (AND RELATED APPARATUS) FOR FORMING A RESISTOR OVER A SEMICO...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

DISPLAY DEVICE

MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...

SEMICONDUCTOR STRUCTURE WITH A LOGIC DEVICE AND A MEMORY DEVICE BEI...

THREE DIMENSIONAL INTEGRATED CIRCUIT WITH POLYCRYSTALLINE STRUCTURE

INTEGRATED CIRCUIT DEVICES INCLUDING STACKED GATE STRUCTURES WITH D...

STACKED TRANSISTORS

INTEGRATED CIRCUIT DEVICES INCLUDING STACKED TRANSISTORS AND METHOD...

SEMICONDUCTOR STORAGE DEVICE COMPRISING STAIRCASE PORTION