Integrated circuits having a three-dimensional layout

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H01L27/0688

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/0688Integrated circuits having a three-dimensional layout

Industries

Patents Grantslast 30 patents

Information Patent Grant
Cross-coupled gate design for stacked device with separated top-dow...
- Patent number 12,183,738
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor structure
- Patent number 12,176,344
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and method of forming the same
- Patent number 12,176,321
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked FET with independent gate control
- Patent number 12,176,345
- Issue date Dec 24, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device using high stress cleave plane
- Patent number 12,176,326
- Issue date Dec 24, 2024
- Silicon Genesis Corporation
- Theodore E. Fong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device with nanostructure channels
- Patent number 12,170,227
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Te Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,170,265
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-I Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic devices and memory devices including conductive lev...
- Patent number 12,170,250
- Issue date Dec 17, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor package with die-mounted voltage regulator
- Patent number 12,165,981
- Issue date Dec 10, 2024
- Advanced Micro Devices, Inc.
- Gabriel H Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,160,999
- Issue date Dec 3, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Kiyoshi Kato
- G11 - INFORMATION STORAGE
Information Patent Grant
Middle end of line decoupling capacitors for semiconductor devices...
- Patent number 12,159,827
- Issue date Dec 3, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMANY, LTD.
- Chung-Ting Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside interconnect structures for semiconductor devices and meth...
- Patent number 12,159,869
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement gate formation in memory
- Patent number 12,159,919
- Issue date Dec 3, 2024
- Micron Technology, Inc.
- Thomas M. Graettinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit emulating neural system with neuron circuit and...
- Patent number 12,154,017
- Issue date Nov 26, 2024
- Seoul National University R&DBFoundation
- Byung-Gook Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional integrated circuit packages and methods of formin...
- Patent number 12,154,896
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures
- Patent number 12,154,897
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices having a semiconductor material that is semimetal in bulk a...
- Patent number 12,148,816
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jean-Pierre Colinge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising vertically-alternating tiers of insulative...
- Patent number 12,150,318
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Durai Vishak Nirmal Ramaswamy
- G11 - INFORMATION STORAGE
Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having one or more modifying substances distr...
- Patent number 12,144,176
- Issue date Nov 12, 2024
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip with shared clock distribution network
- Patent number 12,142,528
- Issue date Nov 12, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a gate-all-around field effect trans...
- Patent number 12,142,529
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Ming Yu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor memory
- Patent number 12,144,181
- Issue date Nov 12, 2024
- Kioxia Corporation
- Go Oike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 12,136,663
- Issue date Nov 5, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method (and related apparatus) for forming a resistor over a semico...
- Patent number 12,132,075
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,132,047
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kui Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an upper contact in contact with a s...
- Patent number 12,132,044
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor structures
- Patent number 12,131,898
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20250006735
- Publication date Jan 2, 2025
- SOCIONEXT INC.
- Hideyuki KOMURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250008748
- Publication date Jan 2, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Tomoaki ATSUMI
- G11 - INFORMATION STORAGE
Information Patent Application
NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT
- Publication number 20240429099
- Publication date Dec 26, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES COMPRISING VERTICAL TRANSISTORS INCLUDING A CHANNEL REGION...
- Publication number 20240429104
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Kevin J. Torek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240429086
- Publication date Dec 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED INTEGRATED CIRCUITS HAVING FAILURE MANAGEMENT
- Publication number 20240421823
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Tony M. Brewer
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413151
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Jungho DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTORS (FETS) EMPLOYING THERMAL EXPANSION OF WORK...
- Publication number 20240413219
- Publication date Dec 12, 2024
- QUALCOMM Incorporated
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS
- Publication number 20240404960
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- Guan Huei SEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...
- Publication number 20240404866
- Publication date Dec 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
MANUFACTURING METHODS FOR A POWER SEMICONDUCTOR DEVICE
- Publication number 20240395632
- Publication date Nov 28, 2024
- Cambridge GaN Devices Limited
- Florin UDREA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE
- Publication number 20240395670
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED HYBRID TFET AND MOSFET
- Publication number 20240395814
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT INTEGRATION IN COMPLEMENTARY FIELD EFFECT TRANSISTOR (CFET)...
- Publication number 20240395879
- Publication date Nov 28, 2024
- Applied Materials, Inc.
- San-Kuei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20240395624
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Ming YU
- B82 - NANO-TECHNOLOGY
Information Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUIT AND FABRICATION THEREOF
- Publication number 20240395698
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chenming HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
- Publication number 20240395592
- Publication date Nov 28, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY ARRAYS WITH LAYER SELECTOR TRANSISTORS
- Publication number 20240389300
- Publication date Nov 21, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices Having a Semiconductor Material That Is Semimetal in Bulk a...
- Publication number 20240387711
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jean-Pierre Colinge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Interconnect Structures for Semiconductor Devices and Meth...
- Publication number 20240387529
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240387520
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING THREE-DIMENSIONAL TRANSISTORS AND SEAL RI...
- Publication number 20240387535
- Publication date Nov 21, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Kuo-Yang Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING MEMORY ARRAY AND INTEGRATED CIRCUIT
- Publication number 20240387475
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Sheng Yun
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMIN...
- Publication number 20240387519
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT HAVING ESD PROTECTION CIRCUIT
- Publication number 20240387509
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Yu MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...
- Publication number 20240379502
- Publication date Nov 14, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379530
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN REGIONS VERT...
- Publication number 20240379780
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Keumseok PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH CONNECTION PATHS
- Publication number 20240379624
- Publication date Nov 14, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS

Integrated circuits having a three-dimensional layout

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cross-coupled gate design for stacked device with separated top-dow...

Methods of forming semiconductor structure

Semiconductor packages and method of forming the same

Stacked FET with independent gate control

Method of forming semiconductor device using high stress cleave plane

Stacked semiconductor device with nanostructure channels

Semiconductor package

Microelectronic devices and memory devices including conductive lev...

3D semiconductor package with die-mounted voltage regulator

Semiconductor device

Middle end of line decoupling capacitors for semiconductor devices...

Backside interconnect structures for semiconductor devices and meth...

Replacement gate formation in memory

Integrated circuit emulating neural system with neuron circuit and...

Three-dimensional integrated circuit packages and methods of formin...

Package structures

Methods for producing a 3D semiconductor memory device and structure

Devices having a semiconductor material that is semimetal in bulk a...

Memory arrays comprising vertically-alternating tiers of insulative...

Gallium nitride (GAN) three-dimensional integrated circuit technology

Integrated assemblies having one or more modifying substances distr...

3D chip with shared clock distribution network

Semiconductor device including a gate-all-around field effect trans...

Semiconductor memory

Semiconductor device and manufacturing method of semiconductor device

3D semiconductor device and structure with single-crystal layers

Method (and related apparatus) for forming a resistor over a semico...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device including an upper contact in contact with a s...

Bonded semiconductor structures

Patents Applicationslast 30 patents

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

SEMICONDUCTOR DEVICE

NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT

DEVICES COMPRISING VERTICAL TRANSISTORS INCLUDING A CHANNEL REGION...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

3D STACKED INTEGRATED CIRCUITS HAVING FAILURE MANAGEMENT

SEMICONDUCTOR DEVICE

FIELD-EFFECT TRANSISTORS (FETS) EMPLOYING THERMAL EXPANSION OF WORK...

RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...

MANUFACTURING METHODS FOR A POWER SEMICONDUCTOR DEVICE

METHOD OF MAKING SEMICONDUCTOR DEVICE

STACKED HYBRID TFET AND MOSFET

CONTACT INTEGRATION IN COMPLEMENTARY FIELD EFFECT TRANSISTOR (CFET)...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

THREE DIMENSIONAL INTEGRATED CIRCUIT AND FABRICATION THEREOF

METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE

THREE-DIMENSIONAL MEMORY ARRAYS WITH LAYER SELECTOR TRANSISTORS

Devices Having a Semiconductor Material That Is Semimetal in Bulk a...

Backside Interconnect Structures for Semiconductor Devices and Meth...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

INTEGRATED CIRCUIT HAVING THREE-DIMENSIONAL TRANSISTORS AND SEAL RI...

METHODS OF MANUFACTURING MEMORY ARRAY AND INTEGRATED CIRCUIT

THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMIN...

THREE-DIMENSIONAL INTEGRATED CIRCUIT HAVING ESD PROTECTION CIRCUIT

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN REGIONS VERT...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH CONNECTION PATHS