Integrated circuits having a three-dimensional layout

Industry

CPC
H01L27/0688

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/0688Integrated circuits having a three-dimensional layout

Industries

Patents Grantslast 30 patents

Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,967,583
- Issue date Apr 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,963,374
- Issue date Apr 16, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,961,827
- Issue date Apr 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity printed circuit board for three-dimensional IC package
- Patent number 11,963,296
- Issue date Apr 16, 2024
- Google LLC
- Yuan Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device with nanostructure channels and manufa...
- Patent number 11,955,384
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Te Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with transistors
- Patent number 11,956,976
- Issue date Apr 9, 2024
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,948,883
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Seonghun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method
- Patent number 11,943,939
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Kai Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power and temperature management for functional blocks implemented...
- Patent number 11,935,869
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Tony M. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-silicon N-type and P-type stacked transistors for integrated ci...
- Patent number 11,935,891
- Issue date Mar 19, 2024
- Intel Corporation
- Gilbert Dewey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,923,406
- Issue date Mar 5, 2024
- SK hynix Inc.
- Dae Sung Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,923,357
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,923,372
- Issue date Mar 5, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,923,230
- Issue date Mar 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies and methods forming integrated assemblies
- Patent number 11,915,777
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Che-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,917,838
- Issue date Feb 27, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a wrap-around contact to connect a source or drain epitaxia...
- Patent number 11,915,984
- Issue date Feb 27, 2024
- Synopsys, Inc.
- Xi-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices and methods for managing error regions
- Patent number 11,915,774
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Joe M. Jeddeloh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,916,045
- Issue date Feb 27, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor deck selection in a memory device
- Patent number 11,917,809
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Daniele Vimercati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked complementary field effect transistors
- Patent number 11,916,073
- Issue date Feb 27, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer power, converter with devices having reduced lateral cur...
- Patent number 11,908,844
- Issue date Feb 20, 2024
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having merged epitaxial features with arc-like...
- Patent number 11,908,742
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Jing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with memory
- Patent number 11,901,210
- Issue date Feb 13, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reading data of a first memory cell transistor of a nonv...
- Patent number 11,903,205
- Issue date Feb 13, 2024
- Kioxia Corporation
- Masaru Kito
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for writing data of a first memory cell transistor of a nonv...
- Patent number 11,903,207
- Issue date Feb 13, 2024
- Kioxia Corporation
- Masaru Kito
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional semiconductor devices
- Patent number 11,901,356
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Seungha Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive line contact regions having multiple multi-direction con...
- Patent number 11,903,183
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Byung Yoon Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 11,894,287
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices
- Patent number 11,889,692
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Chang-Min Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING MULTI-DIMENSION THROUGH SILICON VIA...
- Publication number 20240145435
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION STRUCTURE FOR MIM TOPOGRAPHY
- Publication number 20240145377
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Liang-Shiuan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
- Publication number 20240145289
- Publication date May 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE LINE CONTACT REGIONS HAVING MULTIPLE MULTI-DIRECTION CON...
- Publication number 20240147693
- Publication date May 2, 2024
- Micron Technology, Inc.
- Byung Yoon Kim
- G11 - INFORMATION STORAGE
Information Patent Application
NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD TH...
- Publication number 20240138150
- Publication date Apr 25, 2024
- KIOXIA Corporation
- Masaru KITO
- G11 - INFORMATION STORAGE
Information Patent Application
FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...
- Publication number 20240136295
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20240128237
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240128116
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
- Publication number 20240128165
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III-N BASED SEMICONDUCTOR THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20240120333
- Publication date Apr 11, 2024
- National Yang Ming Chiao Tung University
- TIAN-LI WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING...
- Publication number 20240120276
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Jae Seung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240120332
- Publication date Apr 11, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFIED MICRO SYSTEM WITH MEMORY INTEGRATED CIRCUIT AND LOGIC INTEG...
- Publication number 20240114678
- Publication date Apr 4, 2024
- ETRON TECHNOLOGY, INC.
- Chao-Chun Lu
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240112942
- Publication date Apr 4, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20240113346
- Publication date Apr 4, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Junpei MOMO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240105490
- Publication date Mar 28, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SUPER-STEEP SWITCHING DEVICE AND INVERTER DEVICE USING THE SAME
- Publication number 20240096888
- Publication date Mar 21, 2024
- Research & Business Foundation Sungkyunkwan University
- Hae Ju CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20240087962
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MAN-HO KWAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Via With Improved Gap Filling Performance
- Publication number 20240071813
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CREATING INTERCONNECTS BETWEEN DIES USING A CROSS-OVER DIE AND THRO...
- Publication number 20240071940
- Publication date Feb 29, 2024
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED LONG CHANNEL TRANSISTOR
- Publication number 20240063189
- Publication date Feb 22, 2024
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING
- Publication number 20240055291
- Publication date Feb 15, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUIT WITH MONOLITHIC INTER-TIER VIA...
- Publication number 20240055348
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240049449
- Publication date Feb 8, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G11 - INFORMATION STORAGE
Information Patent Application
MONOLITHIC THREE-DIMENSIONAL (3D) COMPLEMENTARY FIELD EFFECT TRANSI...
- Publication number 20240047455
- Publication date Feb 8, 2024
- QUALCOMM Incorporated
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE NOR FLASH THIN-FILM TRANSISTOR STRINGS ARRANGED IN STACK...
- Publication number 20240029803
- Publication date Jan 25, 2024
- Sunrise Memory Corporation
- Eli Harari
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240021730
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- SOOJIN JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240021479
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
- Publication number 20240021533
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Integrated circuits having a three-dimensional layout

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D semiconductor device and structure with metal layers

Semiconductor device

3D semiconductor device and structure with metal layers

Cavity printed circuit board for three-dimensional IC package

Stacked semiconductor device with nanostructure channels and manufa...

3D semiconductor devices and structures with transistors

Semiconductor device

Integrated circuit device and method

Power and temperature management for functional blocks implemented...

Non-silicon N-type and P-type stacked transistors for integrated ci...

Semiconductor device

Semiconductor device structure and methods of forming the same

Semiconductor device

3D semiconductor device and structure with bonding

Integrated assemblies and methods forming integrated assemblies

Semiconductor device

Forming a wrap-around contact to connect a source or drain epitaxia...

Memory devices and methods for managing error regions

3D semiconductor device and structure with metal layers

Thin film transistor deck selection in a memory device

Stacked complementary field effect transistors

Multilayer power, converter with devices having reduced lateral cur...

Semiconductor device having merged epitaxial features with arc-like...

3D semiconductor device and structure with memory

Method for reading data of a first memory cell transistor of a nonv...

Method for writing data of a first memory cell transistor of a nonv...

Three-dimensional semiconductor devices

Conductive line contact regions having multiple multi-direction con...

Adhesive and thermal interface material on a plurality of dies cove...

Vertical memory devices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING MULTI-DIMENSION THROUGH SILICON VIA...

PLANARIZATION STRUCTURE FOR MIM TOPOGRAPHY

METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...

SEMICONDUCTOR DEVICE

CONDUCTIVE LINE CONTACT REGIONS HAVING MULTIPLE MULTI-DIRECTION CON...

NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD TH...

FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...

GROUP III-N BASED SEMICONDUCTOR THREE-DIMENSIONAL INTEGRATED CIRCUIT

THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING...

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

UNIFIED MICRO SYSTEM WITH MEMORY INTEGRATED CIRCUIT AND LOGIC INTEG...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

SUPER-STEEP SWITCHING DEVICE AND INVERTER DEVICE USING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF

Conductive Via With Improved Gap Filling Performance

CREATING INTERCONNECTS BETWEEN DIES USING A CROSS-OVER DIE AND THRO...

STACKED LONG CHANNEL TRANSISTOR

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING

THREE DIMENSIONAL INTEGRATED CIRCUIT WITH MONOLITHIC INTER-TIER VIA...

SEMICONDUCTOR MEMORY DEVICE

MONOLITHIC THREE-DIMENSIONAL (3D) COMPLEMENTARY FIELD EFFECT TRANSI...

MULTI-GATE NOR FLASH THIN-FILM TRANSISTOR STRINGS ARRANGED IN STACK...

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...