Intermediate bonding steps

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H01L2224/9205

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/9205Intermediate bonding steps

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer light detecting device and electronic apparatus
- Patent number 11,948,833
- Issue date Apr 2, 2024
- Sony Group Corporation
- Masaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor device, and high productivity method for...
- Patent number 11,608,455
- Issue date Mar 21, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,342,309
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for die and clip attachment
- Patent number 11,289,447
- Issue date Mar 29, 2022
- Alpha Assembly Solutions, Inc.
- Oscar Khaselev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof, solid-state ima...
- Patent number 11,177,161
- Issue date Nov 16, 2021
- Sony Corporation
- Masaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Floating die package
- Patent number 10,861,796
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip fan out package and methods of forming the same
- Patent number 10,833,039
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 10,714,457
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including heating and...
- Patent number 10,669,454
- Issue date Jun 2, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof, solid-state ima...
- Patent number 10,658,229
- Issue date May 19, 2020
- Sony Corporation
- Masaki Okamoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 10,290,611
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, method for manufacturing the electronic device,...
- Patent number 10,283,434
- Issue date May 7, 2019
- Fujitsu Limited
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof, solid-state ima...
- Patent number 10,224,234
- Issue date Mar 5, 2019
- Sony Corporation
- Masaki Okamoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Die attachment for packaged semiconductor device
- Patent number 10,217,698
- Issue date Feb 26, 2019
- NXP USA, INC.
- Akhilesh K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device, semiconductor mounti...
- Patent number 10,181,460
- Issue date Jan 15, 2019
- Toray Engineering Co., Ltd.
- Noboru Asahi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Multi-chip fan out package and methods of forming the same
- Patent number 10,163,857
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer structure and method of fabricating the same
- Patent number 10,153,252
- Issue date Dec 11, 2018
- United Microelectronics Corp.
- Ming-Tse Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having gaps within the conductive parts
- Patent number 10,090,351
- Issue date Oct 2, 2018
- TOSHIBA MEMORY CORPORATION
- Hiroaki Ashidate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,905,529
- Issue date Feb 27, 2018
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor, fluxing agent, manufacturing method for...
- Patent number 9,803,111
- Issue date Oct 31, 2017
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, manufacturing method thereof, solid-state ima...
- Patent number 9,754,990
- Issue date Sep 5, 2017
- Sony Corporation
- Masaki Okamoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Adhesive for mounting flip chip for use in a method for producing a...
- Patent number 9,748,195
- Issue date Aug 29, 2017
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a low-adhesive bond substrate pair
- Patent number 9,679,867
- Issue date Jun 13, 2017
- Kabushiki Kaisha Toshiba
- Hiroaki Ashidate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,653,371
- Issue date May 16, 2017
- Dexerials Corporation
- Hironobu Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for chip-to-wafer integration
- Patent number 9,613,928
- Issue date Apr 4, 2017
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attachment for packaged semiconductor device
- Patent number 9,559,077
- Issue date Jan 31, 2017
- NXP USA, INC.
- Akhilesh K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging process tools and systems, and packaging methods for semi...
- Patent number 9,543,185
- Issue date Jan 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof, solid-state ima...
- Patent number 9,431,448
- Issue date Aug 30, 2016
- Sony Corporation
- Masaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 9,324,683
- Issue date Apr 26, 2016
- Samsung Electronics Co., Ltd.
- Tae-Hong Min
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...
- Publication number 20240178057
- Publication date May 30, 2024
- SONY GROUP CORPORATION
- Masaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20240038705
- Publication date Feb 1, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yunzhi LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20220285323
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...
- Publication number 20220044962
- Publication date Feb 10, 2022
- SONY GROUP CORPORATION
- Masaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210313294
- Publication date Oct 7, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOATING DIE PACKAGE
- Publication number 20210091012
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20200343224
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...
- Publication number 20200273745
- Publication date Aug 27, 2020
- SONY CORPORATION
- Masaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20200095481
- Publication date Mar 26, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20190267354
- Publication date Aug 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...
- Publication number 20190198387
- Publication date Jun 27, 2019
- SONY CORPORATION
- Masaki Okamoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Multi-Chip Fan Out Package and Methods of Forming the Same
- Publication number 20190109118
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER FILM FOR MULTI-CHIP PACKAGING
- Publication number 20140248477
- Publication date Sep 4, 2014
- DEXERIALS CORPORATION
- Akira Ishigami
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140239508
- Publication date Aug 28, 2014
- Shinko Electric Industries Co., LTD.
- Sumihiro Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140231492
- Publication date Aug 21, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING FILM WITH PROTECTING FILM
- Publication number 20140106106
- Publication date Apr 17, 2014
- Nitto Denko Corporation
- Yuichiro Shishido
- B32 - LAYERED PRODUCTS
Information Patent Application
Pre-Sintered Semiconductor Die Structure
- Publication number 20140061909
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID ATTACH PROCESS
- Publication number 20130309814
- Publication date Nov 21, 2013
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20130280861
- Publication date Oct 24, 2013
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR INTEGRATION OF THROUGH SUBSTRATE VIAS
- Publication number 20130270711
- Publication date Oct 17, 2013
- THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
- Jeremiah HEBDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION BONDING OF SEMICONDUCTOR CHIPS
- Publication number 20130270230
- Publication date Oct 17, 2013
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROWN CARBON NANOTUBE DIE ATTACH STRUCTURES, ARTICLES, DEVICES, AND...
- Publication number 20130234313
- Publication date Sep 12, 2013
- TEXAS INSTRUMENTS INCORPORATED
- James Cooper Wainerdi
- B82 - NANO-TECHNOLOGY
Information Patent Application
Packaging Process Tools and Systems, and Packaging Methods for Semi...
- Publication number 20130143361
- Publication date Jun 6, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Stacking Devices and Structure Thereof
- Publication number 20130127049
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER FILM FOR MULTI-CHIP PACKAGING
- Publication number 20130092310
- Publication date Apr 18, 2013
- DEXERIALS CORPORATION
- Akira Ishigami
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...
- Publication number 20120267740
- Publication date Oct 25, 2012
- SONY CORPORATION
- Masaki Okamoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DIE-BONDING FILM AND USE THEREOF
- Publication number 20120231583
- Publication date Sep 13, 2012
- Kenji ONISHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF MANUFACTURING FILM FOR SEMICONDUCTOR DEVICE
- Publication number 20120231557
- Publication date Sep 13, 2012
- Koichi INOUE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING FILM WITH PROTECTING FILM
- Publication number 20120231236
- Publication date Sep 13, 2012
- Yuichiro SHISHIDO
- B32 - LAYERED PRODUCTS
Information Patent Application
HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION
- Publication number 20110270341
- Publication date Nov 3, 2011
- Medtronic, Inc.
- David A. Ruben
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Intermediate bonding steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayer light detecting device and electronic apparatus

Adhesive for semiconductor device, and high productivity method for...

Semiconductor packages and methods of forming same

Method for die and clip attachment

Semiconductor device, manufacturing method thereof, solid-state ima...

Method for electrically contacting a component by galvanic connecti...

Floating die package

Multi-chip fan out package and methods of forming the same

Semiconductor packages and methods of forming same

Method for manufacturing semiconductor device including heating and...

Semiconductor device, manufacturing method thereof, solid-state ima...

Semiconductor packages and methods of forming same

Electronic device, method for manufacturing the electronic device,...

Semiconductor device, manufacturing method thereof, solid-state ima...

Die attachment for packaged semiconductor device

Method for manufacturing semiconductor device, semiconductor mounti...

Multi-chip fan out package and methods of forming the same

Wafer to wafer structure and method of fabricating the same

Semiconductor device having gaps within the conductive parts

Method for manufacturing semiconductor device

Adhesive for semiconductor, fluxing agent, manufacturing method for...

Semiconductor device, manufacturing method thereof, solid-state ima...

Adhesive for mounting flip chip for use in a method for producing a...

Semiconductor device having a low-adhesive bond substrate pair

Underfill material and method for manufacturing semiconductor devic...

Method and apparatus for chip-to-wafer integration

Die attachment for packaged semiconductor device

Packaging process tools and systems, and packaging methods for semi...

Semiconductor device, manufacturing method thereof, solid-state ima...

Semiconductor package and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...

SUBSTRATE BONDING METHOD

Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

FLOATING DIE PACKAGE

Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...

ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...

Multi-Chip Fan Out Package and Methods of Forming the Same

BUFFER FILM FOR MULTI-CHIP PACKAGING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

DICING FILM WITH PROTECTING FILM

Pre-Sintered Semiconductor Die Structure

LID ATTACH PROCESS

METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES

APPARATUS AND METHOD FOR INTEGRATION OF THROUGH SUBSTRATE VIAS

THERMAL COMPRESSION BONDING OF SEMICONDUCTOR CHIPS

GROWN CARBON NANOTUBE DIE ATTACH STRUCTURES, ARTICLES, DEVICES, AND...

Packaging Process Tools and Systems, and Packaging Methods for Semi...

Method for Stacking Devices and Structure Thereof

BUFFER FILM FOR MULTI-CHIP PACKAGING

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...

DIE-BONDING FILM AND USE THEREOF

METHOD OF MANUFACTURING FILM FOR SEMICONDUCTOR DEVICE

DICING FILM WITH PROTECTING FILM

HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION