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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/9205
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Multilayer light detecting device and electronic apparatus
Patent number
11,948,833
Issue date
Apr 2, 2024
Sony Group Corporation
Masaki Okamoto
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Adhesive for semiconductor device, and high productivity method for...
Patent number
11,608,455
Issue date
Mar 21, 2023
SHOWA DENKO MATERIALS CO., LTD.
Kazutaka Honda
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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Patent Grant
Semiconductor packages and methods of forming same
Patent number
11,342,309
Issue date
May 24, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Method for die and clip attachment
Patent number
11,289,447
Issue date
Mar 29, 2022
Alpha Assembly Solutions, Inc.
Oscar Khaselev
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device, manufacturing method thereof, solid-state ima...
Patent number
11,177,161
Issue date
Nov 16, 2021
Sony Corporation
Masaki Okamoto
H01 - BASIC ELECTRIC ELEMENTS
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Method for electrically contacting a component by galvanic connecti...
Patent number
11,037,862
Issue date
Jun 15, 2021
Siemens Aktiengesellschaft
Hubert Baueregger
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Floating die package
Patent number
10,861,796
Issue date
Dec 8, 2020
Texas Instruments Incorporated
Benjamin Stassen Cook
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Multi-chip fan out package and methods of forming the same
Patent number
10,833,039
Issue date
Nov 10, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor packages and methods of forming same
Patent number
10,714,457
Issue date
Jul 14, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Method for manufacturing semiconductor device including heating and...
Patent number
10,669,454
Issue date
Jun 2, 2020
Hitachi Chemical Company, Ltd.
Kazutaka Honda
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device, manufacturing method thereof, solid-state ima...
Patent number
10,658,229
Issue date
May 19, 2020
Sony Corporation
Masaki Okamoto
H04 - ELECTRIC COMMUNICATION TECHNIQUE
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Patent Grant
Semiconductor packages and methods of forming same
Patent number
10,290,611
Issue date
May 14, 2019
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Electronic device, method for manufacturing the electronic device,...
Patent number
10,283,434
Issue date
May 7, 2019
Fujitsu Limited
Taiji Sakai
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device, manufacturing method thereof, solid-state ima...
Patent number
10,224,234
Issue date
Mar 5, 2019
Sony Corporation
Masaki Okamoto
H04 - ELECTRIC COMMUNICATION TECHNIQUE
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Die attachment for packaged semiconductor device
Patent number
10,217,698
Issue date
Feb 26, 2019
NXP USA, INC.
Akhilesh K. Singh
H01 - BASIC ELECTRIC ELEMENTS
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Method for manufacturing semiconductor device, semiconductor mounti...
Patent number
10,181,460
Issue date
Jan 15, 2019
Toray Engineering Co., Ltd.
Noboru Asahi
B28 - WORKING CEMENT, CLAY, OR STONE
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Patent Grant
Multi-chip fan out package and methods of forming the same
Patent number
10,163,857
Issue date
Dec 25, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Wafer to wafer structure and method of fabricating the same
Patent number
10,153,252
Issue date
Dec 11, 2018
United Microelectronics Corp.
Ming-Tse Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device having gaps within the conductive parts
Patent number
10,090,351
Issue date
Oct 2, 2018
TOSHIBA MEMORY CORPORATION
Hiroaki Ashidate
H01 - BASIC ELECTRIC ELEMENTS
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Method for manufacturing semiconductor device
Patent number
9,905,529
Issue date
Feb 27, 2018
Renesas Electronics Corporation
Kenji Sakata
H01 - BASIC ELECTRIC ELEMENTS
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Adhesive for semiconductor, fluxing agent, manufacturing method for...
Patent number
9,803,111
Issue date
Oct 31, 2017
Hitachi Chemical Company, Ltd.
Kazutaka Honda
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Semiconductor device, manufacturing method thereof, solid-state ima...
Patent number
9,754,990
Issue date
Sep 5, 2017
Sony Corporation
Masaki Okamoto
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Adhesive for mounting flip chip for use in a method for producing a...
Patent number
9,748,195
Issue date
Aug 29, 2017
Sekisui Chemical Co., Ltd.
Sayaka Wakioka
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device having a low-adhesive bond substrate pair
Patent number
9,679,867
Issue date
Jun 13, 2017
Kabushiki Kaisha Toshiba
Hiroaki Ashidate
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Underfill material and method for manufacturing semiconductor devic...
Patent number
9,653,371
Issue date
May 16, 2017
Dexerials Corporation
Hironobu Moriyama
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method and apparatus for chip-to-wafer integration
Patent number
9,613,928
Issue date
Apr 4, 2017
Agency for Science, Technology and Research
Sunil Wickramanayaka
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Die attachment for packaged semiconductor device
Patent number
9,559,077
Issue date
Jan 31, 2017
NXP USA, INC.
Akhilesh K. Singh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Packaging process tools and systems, and packaging methods for semi...
Patent number
9,543,185
Issue date
Jan 10, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, manufacturing method thereof, solid-state ima...
Patent number
9,431,448
Issue date
Aug 30, 2016
Sony Corporation
Masaki Okamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
9,324,683
Issue date
Apr 26, 2016
Samsung Electronics Co., Ltd.
Tae-Hong Min
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...
Publication number
20240178057
Publication date
May 30, 2024
SONY GROUP CORPORATION
Masaki Okamoto
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SUBSTRATE BONDING METHOD
Publication number
20240038705
Publication date
Feb 1, 2024
Institute of Semiconductors, Guangdong Academy of Sciences
Yunzhi LING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods of Forming Same
Publication number
20220285323
Publication date
Sep 8, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...
Publication number
20220044962
Publication date
Feb 10, 2022
SONY GROUP CORPORATION
Masaki Okamoto
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
Publication number
20210313294
Publication date
Oct 7, 2021
Chau Fatt Chiang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
FLOATING DIE PACKAGE
Publication number
20210091012
Publication date
Mar 25, 2021
TEXAS INSTRUMENTS INCORPORATED
Benjamin Stassen Cook
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods of Forming Same
Publication number
20200343224
Publication date
Oct 29, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...
Publication number
20200273745
Publication date
Aug 27, 2020
SONY CORPORATION
Masaki Okamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
Publication number
20200095481
Publication date
Mar 26, 2020
Hitachi Chemical Company, Ltd.
Kazutaka HONDA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Semiconductor Packages and Methods of Forming Same
Publication number
20190267354
Publication date
Aug 29, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...
Publication number
20190198387
Publication date
Jun 27, 2019
SONY CORPORATION
Masaki Okamoto
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Multi-Chip Fan Out Package and Methods of Forming the Same
Publication number
20190109118
Publication date
Apr 11, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
BUFFER FILM FOR MULTI-CHIP PACKAGING
Publication number
20140248477
Publication date
Sep 4, 2014
DEXERIALS CORPORATION
Akira Ishigami
B32 - LAYERED PRODUCTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20140239508
Publication date
Aug 28, 2014
Shinko Electric Industries Co., LTD.
Sumihiro Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
Publication number
20140231492
Publication date
Aug 21, 2014
PANASONIC CORPORATION
Tsubasa Saeki
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DICING FILM WITH PROTECTING FILM
Publication number
20140106106
Publication date
Apr 17, 2014
Nitto Denko Corporation
Yuichiro Shishido
B32 - LAYERED PRODUCTS
Information
Patent Application
Pre-Sintered Semiconductor Die Structure
Publication number
20140061909
Publication date
Mar 6, 2014
INFINEON TECHNOLOGIES AG
Roland Speckels
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LID ATTACH PROCESS
Publication number
20130309814
Publication date
Nov 21, 2013
Seah Sun Too
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES
Publication number
20130280861
Publication date
Oct 24, 2013
Micron Technology, Inc.
Zhaohui Ma
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
APPARATUS AND METHOD FOR INTEGRATION OF THROUGH SUBSTRATE VIAS
Publication number
20130270711
Publication date
Oct 17, 2013
THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
Jeremiah HEBDING
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
THERMAL COMPRESSION BONDING OF SEMICONDUCTOR CHIPS
Publication number
20130270230
Publication date
Oct 17, 2013
Yiu Ming CHEUNG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
GROWN CARBON NANOTUBE DIE ATTACH STRUCTURES, ARTICLES, DEVICES, AND...
Publication number
20130234313
Publication date
Sep 12, 2013
TEXAS INSTRUMENTS INCORPORATED
James Cooper Wainerdi
B82 - NANO-TECHNOLOGY
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Patent Application
Packaging Process Tools and Systems, and Packaging Methods for Semi...
Publication number
20130143361
Publication date
Jun 6, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Method for Stacking Devices and Structure Thereof
Publication number
20130127049
Publication date
May 23, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Dean Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUFFER FILM FOR MULTI-CHIP PACKAGING
Publication number
20130092310
Publication date
Apr 18, 2013
DEXERIALS CORPORATION
Akira Ishigami
B32 - LAYERED PRODUCTS
Information
Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...
Publication number
20120267740
Publication date
Oct 25, 2012
SONY CORPORATION
Masaki Okamoto
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
DIE-BONDING FILM AND USE THEREOF
Publication number
20120231583
Publication date
Sep 13, 2012
Kenji ONISHI
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Patent Application
METHOD OF MANUFACTURING FILM FOR SEMICONDUCTOR DEVICE
Publication number
20120231557
Publication date
Sep 13, 2012
Koichi INOUE
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
DICING FILM WITH PROTECTING FILM
Publication number
20120231236
Publication date
Sep 13, 2012
Yuichiro SHISHIDO
B32 - LAYERED PRODUCTS
Information
Patent Application
HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION
Publication number
20110270341
Publication date
Nov 3, 2011
Medtronic, Inc.
David A. Ruben
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE