Intermediate metal

Industry

CPC
H05K2201/0341

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0341Intermediate metal

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Module
- Patent number 12,193,162
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal circuit structure based on FPC and method of making the same
- Patent number 12,089,331
- Issue date Sep 10, 2024
- APLUS SEMICONDUCTOR TECHNOLOGIES CO., LTD.
- Cheng-Neng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 12,010,794
- Issue date Jun 11, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency transmission line with finish plating on conductive...
- Patent number 11,984,423
- Issue date May 14, 2024
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,908,768
- Issue date Feb 20, 2024
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive substrate, electronic device and display device
- Patent number 11,869,834
- Issue date Jan 9, 2024
- TDK Corporation
- Takashi Daitoku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board
- Patent number 11,832,385
- Issue date Nov 28, 2023
- Dongwoo Fine-Chem Co., Ltd.
- Ki Joon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass wiring board
- Patent number 11,516,907
- Issue date Nov 29, 2022
- Toppan Printing Co., Ltd.
- Tetsuyuki Tsuchida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,304,307
- Issue date Apr 12, 2022
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board
- Patent number 11,294,285
- Issue date Apr 5, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,289,400
- Issue date Mar 29, 2022
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector and connector system having plated ground shields
- Patent number 11,183,787
- Issue date Nov 23, 2021
- TE CONNECTIVITY SERVICES GMBH
- John Joseph Consoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive substrate, electronic device and display device
- Patent number 11,031,330
- Issue date Jun 8, 2021
- TDK Corporation
- Takashi Daitoku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Radio frequency transmission line
- Patent number 10,937,759
- Issue date Mar 2, 2021
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive substrate, electronic device and display device
- Patent number 10,867,898
- Issue date Dec 15, 2020
- TDK Corporation
- Takashi Daitoku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of composite substrate
- Patent number 10,743,423
- Issue date Aug 11, 2020
- AZOTEK CO., LTD.
- Hung-Jung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board
- Patent number 10,653,011
- Issue date May 12, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing conductive line
- Patent number 10,615,054
- Issue date Apr 7, 2020
- Unimicron Technology Corp.
- Shih-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional wiring board production method, three-dimensional...
- Patent number 10,537,021
- Issue date Jan 14, 2020
- Meiko Electronics Co., Ltd.
- Shigeru Michiwaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mobile device with radio frequency transmission line
- Patent number 10,529,686
- Issue date Jan 7, 2020
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board
- Patent number 10,405,431
- Issue date Sep 3, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Lei Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional wiring board production method, three-dimensional...
- Patent number 10,244,624
- Issue date Mar 26, 2019
- MEIKO ELECTRONICS CO., LTD.
- Shigeru Michiwaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,940,957
- Issue date Apr 10, 2018
- Nitto Denko Corporation
- Daisuke Yamauchi
- G11 - INFORMATION STORAGE
Information Patent Grant
Wiring substrate for bonding using solder having a low melting poin...
- Patent number 9,883,586
- Issue date Jan 30, 2018
- Toppan Printing Co., Ltd.
- Tetsuyuki Tsuchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cleaning composition and method of manufacturing metal wiring using...
- Patent number 9,869,027
- Issue date Jan 16, 2018
- Samsung Display Co., Ltd.
- Bong-Yeon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 9,847,308
- Issue date Dec 19, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,769,933
- Issue date Sep 19, 2017
- Hitachi Metals, Ltd.
- Hideyuki Sagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board
- Patent number 9,744,624
- Issue date Aug 29, 2017
- Kinsus Interconnect Technology Corp.
- Jaen-Don Lan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting device
- Patent number 9,726,357
- Issue date Aug 8, 2017
- SHARP KABUSHIKI KAISHA
- Masahiro Konishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line for high performance radio frequency applications
- Patent number 9,679,869
- Issue date Jun 13, 2017
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING METAL LAYERS ON GLASS-CONTAINING SUBSTRATE, AND...
- Publication number 20240292523
- Publication date Aug 29, 2024
- Corning Incorporated
- JOON-SOO KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MODULE
- Publication number 20230105809
- Publication date Apr 6, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20220418098
- Publication date Dec 29, 2022
- KYOCERA CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal Circuit Structure Based on FPC and Method of Making the Same
- Publication number 20220361336
- Publication date Nov 10, 2022
- Aplus Semiconductor Technologies Co., Ltd.
- Cheng-Neng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...
- Publication number 20220173010
- Publication date Jun 2, 2022
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE AND DISPLAY DEVICE
- Publication number 20210265256
- Publication date Aug 26, 2021
- TDK Corporation
- Takashi DAITOKU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GLASS WIRING BOARD
- Publication number 20210144847
- Publication date May 13, 2021
- Toppan Printing Co.,Ltd.
- Tetsuyuki TSUCHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20210037660
- Publication date Feb 4, 2021
- IBIDEN CO., LTD.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...
- Publication number 20210028086
- Publication date Jan 28, 2021
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN COPPER FOIL STRUCTURE, ELECTROMAGNETIC INTERFERENCE SHIE...
- Publication number 20210002780
- Publication date Jan 7, 2021
- Nan Ya Plastics Corporation
- SHIH-CHING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLECTOR PLATE
- Publication number 20210002779
- Publication date Jan 7, 2021
- Nan Ya Plastics Corporation
- SHIH-CHING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE AND DISPLAY DEVICE
- Publication number 20200211951
- Publication date Jul 2, 2020
- TDK Corporation
- Takashi DAITOKU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ULTRA-THIN COPPER FOIL STRUCTURE, COLLECTOR PLATE, ELECTROMAGNETIC...
- Publication number 20190382909
- Publication date Dec 19, 2019
- Nan Ya Plastics Corporation
- SHIH-CHING LIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE AND DISPLAY DEVICE
- Publication number 20190035719
- Publication date Jan 31, 2019
- TDK Corporation
- Takashi DAITOKU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE SENSOR
- Publication number 20180004318
- Publication date Jan 4, 2018
- Khaled Ahmed
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RADIO FREQUENCY TRANSMISSION LINE WITH FINISH PLATING ON CONDUCTIVE...
- Publication number 20170301647
- Publication date Oct 19, 2017
- SKYWORKS SOLUTIONS, INC.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FOR RADIO FREQUENCY TRANSMISSION LINE
- Publication number 20170271303
- Publication date Sep 21, 2017
- SKYWORKS SOLUTIONS, INC.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY TRANSMISSION LINE
- Publication number 20170271301
- Publication date Sep 21, 2017
- SKYWORKS SOLUTIONS, INC.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOBILE DEVICE WITH RADIO FREQUENCY TRANSMISSION LINE
- Publication number 20170271302
- Publication date Sep 21, 2017
- SKYWORKS SOLUTIONS, INC.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150334828
- Publication date Nov 19, 2015
- Toppan Printing Co., Ltd.
- Tetsuyuki TSUCHIDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION
- Publication number 20140339699
- Publication date Nov 20, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL MATERIAL FOR ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURIN...
- Publication number 20140329107
- Publication date Nov 6, 2014
- JX NIPPON MINING & METALS CORPORATION
- Yoshitaka Shibuya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ATTACHMENT OF MICROELECTRONIC COMPONENTS
- Publication number 20140210110
- Publication date Jul 31, 2014
- SEAGATE TECHNOLOGY LLC
- Ralph Kevin Smith
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED BODY AND METHOD OF MANUFACTURING LAMINATED BODY
- Publication number 20140134448
- Publication date May 15, 2014
- NHK Spring Co., Ltd.
- Yuichiro Yamauchi
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140069705
- Publication date Mar 13, 2014
- LG Innotek Co., Ltd.
- Sang Myung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140060896
- Publication date Mar 6, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Gil Yong SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140027161
- Publication date Jan 30, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kiwon Lee
- B82 - NANO-TECHNOLOGY
Information Patent Application
LIGHT EMITTING DEVICES AND SUBSTRATES WITH IMPROVED PLATING
- Publication number 20130328070
- Publication date Dec 12, 2013
- Christopher P. Hussell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZED SUBSTRATE, METAL PASTE COMPOSITION, AND METHOD FOR MANUF...
- Publication number 20130256014
- Publication date Oct 3, 2013
- Tokuyama Corporation
- Naoto Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE TREATMENT STRUCTURE OF CIRCUIT PATTERN
- Publication number 20130233602
- Publication date Sep 12, 2013
- Ting-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS

Intermediate metal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Module

Metal circuit structure based on FPC and method of making the same

Printed wiring board and method for manufacturing the same

Radio frequency transmission line with finish plating on conductive...

Method of manufacturing bonded body for insulation circuit substrat...

Electroconductive substrate, electronic device and display device

Circuit board

Glass wiring board

Printed wiring board and method for manufacturing printed wiring board

Method for manufacturing circuit board

Method of manufacturing bonded body for insulation circuit substrat...

Electrical connector and connector system having plated ground shields

Electroconductive substrate, electronic device and display device

Radio frequency transmission line

Electroconductive substrate, electronic device and display device

Manufacturing method of composite substrate

Method for manufacturing circuit board

Method for manufacturing conductive line

Three-dimensional wiring board production method, three-dimensional...

Mobile device with radio frequency transmission line

Flexible printed circuit board

Three-dimensional wiring board production method, three-dimensional...

Printed circuit board and method of manufacturing the same

Wiring substrate for bonding using solder having a low melting poin...

Cleaning composition and method of manufacturing metal wiring using...

Magnetic intermetallic compound interconnect

Printed circuit board and method of manufacturing the same

Method for manufacturing circuit board

Light-emitting device

Transmission line for high performance radio frequency applications

Patents Applicationslast 30 patents

METHOD FOR FORMING METAL LAYERS ON GLASS-CONTAINING SUBSTRATE, AND...

MODULE

WIRING BOARD

Metal Circuit Structure Based on FPC and Method of Making the Same

METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...

ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE AND DISPLAY DEVICE

GLASS WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...

ULTRA-THIN COPPER FOIL STRUCTURE, ELECTROMAGNETIC INTERFERENCE SHIE...

COLLECTOR PLATE

ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE AND DISPLAY DEVICE

ULTRA-THIN COPPER FOIL STRUCTURE, COLLECTOR PLATE, ELECTROMAGNETIC...

ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE AND DISPLAY DEVICE

FLEXIBLE SENSOR

RADIO FREQUENCY TRANSMISSION LINE WITH FINISH PLATING ON CONDUCTIVE...

DIFFUSION BARRIER LAYER FOR RADIO FREQUENCY TRANSMISSION LINE

RADIO FREQUENCY TRANSMISSION LINE

MOBILE DEVICE WITH RADIO FREQUENCY TRANSMISSION LINE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME

UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION

METAL MATERIAL FOR ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURIN...

ATTACHMENT OF MICROELECTRONIC COMPONENTS

LAMINATED BODY AND METHOD OF MANUFACTURING LAMINATED BODY

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

LIGHT EMITTING DEVICES AND SUBSTRATES WITH IMPROVED PLATING

METALLIZED SUBSTRATE, METAL PASTE COMPOSITION, AND METHOD FOR MANUF...

SURFACE TREATMENT STRUCTURE OF CIRCUIT PATTERN