Internal circuit aspects

Industry

CPC
G01R31/2856

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R31/00Arrangements for testing electric properties Arrangements for locating electric faults Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

Current Industry

G01R31/2856Internal circuit aspects

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Circuitry for electrical redundancy in bonded structures
- Patent number 12,308,332
- Issue date May 20, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLACruz
- G01 - MEASURING TESTING
Information Patent Grant
Current measuring circuit
- Patent number 12,292,469
- Issue date May 6, 2025
- Infineon Technologies AG
- Christian Djelassi-Tscheck
- G01 - MEASURING TESTING
Information Patent Grant
Circuit test structure and method of using
- Patent number 12,253,558
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and test method of the same
- Patent number 12,248,018
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Yeon Ho Jung
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
System and method of measuring capacitance of device-under-test
- Patent number 12,228,598
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Mao-Hsuan Chou
- G01 - MEASURING TESTING
Information Patent Grant
On-die aging measurements for dynamic timing modeling
- Patent number 12,216,150
- Issue date Feb 4, 2025
- Altera Corporation
- Dheeraj Subbareddy
- G01 - MEASURING TESTING
Information Patent Grant
Monitoring semiconductor reliability and predicting device failure...
- Patent number 12,203,973
- Issue date Jan 21, 2025
- Tartan Silicon Systems, Inc.
- Alan Paul Aronoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for regulating plasma dicing rates
- Patent number 12,142,527
- Issue date Nov 12, 2024
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package with board level reliability
- Patent number 12,131,967
- Issue date Oct 29, 2024
- Texas Instruments Incorporated
- Naweed Anjum
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Latch-up test structure
- Patent number 12,119,274
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qian Xu
- G01 - MEASURING TESTING
Information Patent Grant
Spark gap structures for detection and protection against electrica...
- Patent number 12,055,569
- Issue date Aug 6, 2024
- Analog Devices International Unlimited Company
- David J. Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated test circuit, test assembly and method for testing an in...
- Patent number 12,055,587
- Issue date Aug 6, 2024
- Infineon Technologies AG
- Tobias Kilian
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Circuit for temperature stress test for memory chips
- Patent number 12,044,723
- Issue date Jul 23, 2024
- Shanghai Huali Integrated Circuit Corporation
- Zhenan Lai
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component and system with integrated self-test functiona...
- Patent number 12,032,016
- Issue date Jul 9, 2024
- Volkswagen Aktiengesellschaft
- Andreas Aal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced direct current (DC) built-in-self-test (BIST) coverage for...
- Patent number 12,007,432
- Issue date Jun 11, 2024
- Cisco Technology, Inc.
- Sanjay Sunder
- G01 - MEASURING TESTING
Information Patent Grant
Test method
- Patent number 12,007,437
- Issue date Jun 11, 2024
- Fuji Electric Co., Ltd.
- Kenichi Ishii
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit and associated method
- Patent number 11,971,445
- Issue date Apr 30, 2024
- NXP B.V.
- Anton Salfelner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip providing on-chip self-testing of an ana-log-to-...
- Patent number 11,962,320
- Issue date Apr 16, 2024
- Intel Corporation
- Kameran Azadet
- G01 - MEASURING TESTING
Information Patent Grant
Gyroscope with self-test
- Patent number 11,920,931
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Heikki Kuisma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Test method for control chip and related device
- Patent number 11,867,758
- Issue date Jan 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chuanqi Shi
- G11 - INFORMATION STORAGE
Information Patent Grant
Failure detection system for integrated circuit components
- Patent number 11,867,746
- Issue date Jan 9, 2024
- Hamilton Sundstrand Corporation
- Thomas P. Joyce
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit with reference sub-system for testing and replac...
- Patent number 11,852,676
- Issue date Dec 26, 2023
- STMicroelectronics S.r.l.
- Carlo Caimi
- G01 - MEASURING TESTING
Information Patent Grant
Circuit containing a transformer and corresponding method
- Patent number 11,841,394
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Marcus Nuebling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device die with wafer/package detection circuit
- Patent number 11,842,934
- Issue date Dec 12, 2023
- NXP B.V.
- Jan-Peter Schat
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit test structure and method of using
- Patent number 11,828,790
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Real-time, in-situ reliability monitoring in an integrated circuit
- Patent number 11,774,490
- Issue date Oct 3, 2023
- MARVELL ASIA PTE. LTD.
- Runzi Chang
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for determining jitter, storage medium and ele...
- Patent number 11,733,293
- Issue date Aug 22, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tianchen Lu
- G01 - MEASURING TESTING
Information Patent Grant
Complementary ring oscillators to monitor in-situ stress within int...
- Patent number 11,719,584
- Issue date Aug 8, 2023
- Huawei Technologies Co., Ltd.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for regulating plasma dicing rates
- Patent number 11,721,586
- Issue date Aug 8, 2023
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuitry for electrical redundancy in bonded structures
- Patent number 11,721,653
- Issue date Aug 8, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLACruz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CURRENT AND VOLTAGE SENSING BASED VOLTAGE-STANDING-WAVE-RATIO IMPED...
- Publication number 20250180636
- Publication date Jun 5, 2025
- Georgia Tech Research Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF USING CIRCUIT TEST STRUCTURE
- Publication number 20250164548
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ACCEPTANCE TEST TOOL AND TEST METHOD USING THEREOF
- Publication number 20250155491
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jin YAO
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM AND METHOD OF MEASURING CAPACITANCE OF DEVICE-UNDER-TEST
- Publication number 20250147086
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MAO-HSUAN CHOU
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT FOR DETECTING DEFECTS
- Publication number 20250085340
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Takuya FAUTATSUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250076368
- Publication date Mar 6, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhiguo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE WITH BOARD LEVEL RELIABILITY
- Publication number 20250022761
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Naweed Anjum
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TEST SIGNAL CIRCUIT FOR TESTING A RADIO FREQUENCY RECEIVER CIRCUIT,...
- Publication number 20240426898
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Faisal AHMED
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, VEHICLE-MOUNTED APPLIANCE,...
- Publication number 20240426899
- Publication date Dec 26, 2024
- Rohm Co., Ltd.
- Takumi YAMADA
- G01 - MEASURING TESTING
Information Patent Application
CHIP TESTING STRUCTURE AND CHIP TESTING METHOD
- Publication number 20240418771
- Publication date Dec 19, 2024
- HYGON INFORMATION TECHNOLOGY CO., LTD.
- Xiaodi Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IDENTIFYING FAILURES IN DEVICE CORES
- Publication number 20240319261
- Publication date Sep 26, 2024
- Teradyne, Inc.
- Howard Lin
- G01 - MEASURING TESTING
Information Patent Application
CHIP TESTING DEVICE AND PACKAGE TESTING MACHINE
- Publication number 20240295600
- Publication date Sep 5, 2024
- SEMIGHT INSTRUMENTS CO., LTD
- Zhe LIAN
- G01 - MEASURING TESTING
Information Patent Application
ENHANCED DIRECT CURRENT (DC) BUILT-IN-SELF-TEST (BIST) COVERAGE FOR...
- Publication number 20240280630
- Publication date Aug 22, 2024
- Cisco Technology, Inc.
- Sanjay SUNDER
- G01 - MEASURING TESTING
Information Patent Application
A CIRCUIT FOR TEMPERATURE STRESS TEST FOR MEMORY CHIPS
- Publication number 20240264222
- Publication date Aug 8, 2024
- Shanghai Huali Integrated Circuit Corporation
- Zhenan Lai
- G01 - MEASURING TESTING
Information Patent Application
ELECTRIC POWER MEASUREMENT CIRCUIT
- Publication number 20240255568
- Publication date Aug 1, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Kazuhito TANAKA
- G01 - MEASURING TESTING
Information Patent Application
WAFER SCALE ACTIVE THERMAL INTERPOSER WITH THERMAL ISOLATION STRUCT...
- Publication number 20240183897
- Publication date Jun 6, 2024
- ADVANTEST TEST SOLUTIONS, INC.
- Karthik Ranganathan
- G01 - MEASURING TESTING
Information Patent Application
SELF-DIAGNOSIS CIRCUIT AND SEMICONDUCTOR DEVICE
- Publication number 20240175922
- Publication date May 30, 2024
- Rohm Co., Ltd.
- Ryosuke SUMII
- G01 - MEASURING TESTING
Information Patent Application
CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES
- Publication number 20240162178
- Publication date May 16, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE DEVICE WITH ENERGY HARVESTING
- Publication number 20240159804
- Publication date May 16, 2024
- Analog Devices International Unlimited Company
- David J. Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT TEST STRUCTURE AND METHOD OF USING
- Publication number 20240094282
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED DIRECT CURRENT (DC) BUILT-IN-SELF-TEST (BIST) COVERAGE FOR...
- Publication number 20240019485
- Publication date Jan 18, 2024
- Cisco Technology, Inc.
- Sanjay SUNDER
- G01 - MEASURING TESTING
Information Patent Application
CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES
- Publication number 20230395544
- Publication date Dec 7, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPARK GAP STRUCTURES FOR DETECTION AND PROTECTION AGAINST ELECTRICA...
- Publication number 20230375600
- Publication date Nov 23, 2023
- Analog Devices International Unlimited Company
- David J. Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR REGULATING PLASMA DICING RATES
- Publication number 20230326796
- Publication date Oct 12, 2023
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Monitoring Semiconductor Reliability and Predicting Device Failure...
- Publication number 20230280392
- Publication date Sep 7, 2023
- Alan Paul Aronoff
- G01 - MEASURING TESTING
Information Patent Application
COUPLER SENSING BASED VOLTAGE-STANDING-WAVE-RATIO IMPEDANCE AND POW...
- Publication number 20230280395
- Publication date Sep 7, 2023
- Georgia Tech Research Corporation
- David J. Munzer
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT WITH RESILIENT SYSTEM
- Publication number 20230258709
- Publication date Aug 17, 2023
- STMicroelectronics S.r.l.
- Carlo CAIMI
- G01 - MEASURING TESTING
Information Patent Application
Current Measuring Circuit
- Publication number 20230194595
- Publication date Jun 22, 2023
- INFINEON TECHNOLOGIES AG
- Christian Djelassi-Tscheck
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR CHIP AND TEST METHOD OF THE SAME
- Publication number 20230176112
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Yeon Ho Jung
- G01 - MEASURING TESTING
Information Patent Application
On-Die Aging Measurements for Dynamic Timing Modeling
- Publication number 20230129176
- Publication date Apr 27, 2023
- Intel Corporation
- Dheeraj Subbareddy
- G01 - MEASURING TESTING

Internal circuit aspects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuitry for electrical redundancy in bonded structures

Current measuring circuit

Circuit test structure and method of using

Semiconductor chip and test method of the same

System and method of measuring capacitance of device-under-test

On-die aging measurements for dynamic timing modeling

Monitoring semiconductor reliability and predicting device failure...

Method and system for regulating plasma dicing rates

Electronic device package with board level reliability

Latch-up test structure

Spark gap structures for detection and protection against electrica...

Integrated test circuit, test assembly and method for testing an in...

Circuit for temperature stress test for memory chips

Electronic component and system with integrated self-test functiona...

Enhanced direct current (DC) built-in-self-test (BIST) coverage for...

Test method

Integrated circuit and associated method

Semiconductor chip providing on-chip self-testing of an ana-log-to-...

Gyroscope with self-test

Test method for control chip and related device

Failure detection system for integrated circuit components

Integrated circuit with reference sub-system for testing and replac...

Circuit containing a transformer and corresponding method

Integrated circuit device die with wafer/package detection circuit

Circuit test structure and method of using

Real-time, in-situ reliability monitoring in an integrated circuit

Method and apparatus for determining jitter, storage medium and ele...

Complementary ring oscillators to monitor in-situ stress within int...

Method and system for regulating plasma dicing rates

Circuitry for electrical redundancy in bonded structures

Patents Applicationslast 30 patents

CURRENT AND VOLTAGE SENSING BASED VOLTAGE-STANDING-WAVE-RATIO IMPED...

METHOD OF USING CIRCUIT TEST STRUCTURE

WAFER ACCEPTANCE TEST TOOL AND TEST METHOD USING THEREOF

SYSTEM AND METHOD OF MEASURING CAPACITANCE OF DEVICE-UNDER-TEST

CIRCUIT FOR DETECTING DEFECTS

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE PACKAGE WITH BOARD LEVEL RELIABILITY

TEST SIGNAL CIRCUIT FOR TESTING A RADIO FREQUENCY RECEIVER CIRCUIT,...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, VEHICLE-MOUNTED APPLIANCE,...

CHIP TESTING STRUCTURE AND CHIP TESTING METHOD

IDENTIFYING FAILURES IN DEVICE CORES

CHIP TESTING DEVICE AND PACKAGE TESTING MACHINE

ENHANCED DIRECT CURRENT (DC) BUILT-IN-SELF-TEST (BIST) COVERAGE FOR...

A CIRCUIT FOR TEMPERATURE STRESS TEST FOR MEMORY CHIPS

ELECTRIC POWER MEASUREMENT CIRCUIT

WAFER SCALE ACTIVE THERMAL INTERPOSER WITH THERMAL ISOLATION STRUCT...

SELF-DIAGNOSIS CIRCUIT AND SEMICONDUCTOR DEVICE

CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES

WEARABLE DEVICE WITH ENERGY HARVESTING

CIRCUIT TEST STRUCTURE AND METHOD OF USING

ENHANCED DIRECT CURRENT (DC) BUILT-IN-SELF-TEST (BIST) COVERAGE FOR...

CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES

SPARK GAP STRUCTURES FOR DETECTION AND PROTECTION AGAINST ELECTRICA...

METHOD AND SYSTEM FOR REGULATING PLASMA DICING RATES

Monitoring Semiconductor Reliability and Predicting Device Failure...

COUPLER SENSING BASED VOLTAGE-STANDING-WAVE-RATIO IMPEDANCE AND POW...

INTEGRATED CIRCUIT WITH RESILIENT SYSTEM

Current Measuring Circuit

SEMICONDUCTOR CHIP AND TEST METHOD OF THE SAME

On-Die Aging Measurements for Dynamic Timing Modeling