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H01L2224/05001

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05001Internal layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,887,957
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus and method for producing the same
- Patent number 11,735,699
- Issue date Aug 22, 2023
- Nichia Corporation
- Shunsuke Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer test structures and methods
- Patent number 11,682,593
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,538,782
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 11,367,667
- Issue date Jun 21, 2022
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus and method for producing the same
- Patent number 11,257,996
- Issue date Feb 22, 2022
- Nichia Corporation
- Shunsuke Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices having stacked interconnect elemen...
- Patent number 11,217,556
- Issue date Jan 4, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method for semiconductor device...
- Patent number 11,205,608
- Issue date Dec 21, 2021
- ADVANCED INTERCONNECT SYSTEMS LIMITED
- Haruki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,069,591
- Issue date Jul 20, 2021
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer test structures and methods
- Patent number 10,734,295
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method for semiconductor device...
- Patent number 10,727,166
- Issue date Jul 28, 2020
- ADVANCED INTERCONNECT SYSTEMS LIMITED
- Haruki Ito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,714,415
- Issue date Jul 14, 2020
- Renesas Electronics Corporation
- Eiji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 10,593,607
- Issue date Mar 17, 2020
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus and method for producing the same
- Patent number 10,522,727
- Issue date Dec 31, 2019
- Nichia Corporation
- Shunsuke Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,476,185
- Issue date Nov 12, 2019
- Samsung Display Co., Ltd.
- Myungchul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guided acoustic wave device
- Patent number 10,469,050
- Issue date Nov 5, 2019
- Qorvo US, Inc.
- Kevin J. Gamble
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,431,516
- Issue date Oct 1, 2019
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method for semiconductor device...
- Patent number 10,424,533
- Issue date Sep 24, 2019
- ADVANCED INTERCONNECT SYSTEMS LIMITED
- Haruki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,418,319
- Issue date Sep 17, 2019
- Infineon Technologies AG
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method for semiconductor device...
- Patent number 10,361,144
- Issue date Jul 23, 2019
- ADVANCED INTERCONNECT SYSTEMS LIMITED
- Haruki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film capacitor
- Patent number 10,319,524
- Issue date Jun 11, 2019
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method for semiconductor device...
- Patent number 10,312,182
- Issue date Jun 4, 2019
- ADVANCED INTERCONNECT SYSTEMS LIMITED
- Haruki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method for semiconductor device...
- Patent number 10,283,438
- Issue date May 7, 2019
- ADVANCED INTERCONNECT SYSTEMS LIMITED
- Haruki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,283,444
- Issue date May 7, 2019
- Renesas Electronics Corporation
- Eiji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method for semiconductor device...
- Patent number 10,262,923
- Issue date Apr 16, 2019
- ADVANCED INTERCONNECT SYSTEMS LIMITED
- Haruki Ito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,199,338
- Issue date Feb 5, 2019
- Renesas Electronics Corporation
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical imaging apparatus and methods of making the same
- Patent number 10,147,750
- Issue date Dec 4, 2018
- FLIR Systems Trading Belgium BVBA
- Moshe Kriman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packaged microelectronic devices having stacked interconnect elemen...
- Patent number 10,083,931
- Issue date Sep 25, 2018
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method of manufacturing the...
- Patent number 10,074,773
- Issue date Sep 11, 2018
- Samsung Electronics Co., Ltd.
- Jae In Sim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230108516
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- JUBIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAK...
- Publication number 20230005802
- Publication date Jan 5, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME
- Publication number 20220140212
- Publication date May 5, 2022
- Nichia Corporation.
- Shunsuke Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
- Publication number 20220122938
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...
- Publication number 20220115296
- Publication date Apr 14, 2022
- Advanced Interconnect Systems Limited
- Haruki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210320077
- Publication date Oct 14, 2021
- Samsung Electronics Co., Ltd.
- JUBIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210313245
- Publication date Oct 7, 2021
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...
- Publication number 20200357724
- Publication date Nov 12, 2020
- Advanced Interconnect Systems Limited
- Haruki Ito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Interposer Test Structures and Methods
- Publication number 20200350221
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- G01 - MEASURING TESTING
Information Patent Application
NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...
- Publication number 20200286801
- Publication date Sep 10, 2020
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190393116
- Publication date Dec 26, 2019
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer Test Structures and Methods
- Publication number 20190057912
- Publication date Feb 21, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...
- Publication number 20190043786
- Publication date Feb 7, 2019
- Advanced Interconnect Systems Limited
- Haruki Ito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...
- Publication number 20180301395
- Publication date Oct 18, 2018
- Advanced Interconnect Systems Limited
- Haruki Ito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...
- Publication number 20180301394
- Publication date Oct 18, 2018
- Advanced Interconnect Systems Limited
- Haruki Ito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...
- Publication number 20180301393
- Publication date Oct 18, 2018
- Advanced Interconnect Systems Limited
- Haruki Ito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
THIN-FILM CAPACITOR
- Publication number 20180102218
- Publication date Apr 12, 2018
- TDK Corporation
- Kenichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Ceramic Substrates with Via Studs
- Publication number 20170338127
- Publication date Nov 23, 2017
- Ananda H. Kumar
- G01 - MEASURING TESTING
Information Patent Application
MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...
- Publication number 20170320154
- Publication date Nov 9, 2017
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball Height Control in Bonding Process
- Publication number 20140374921
- Publication date Dec 25, 2014
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140357075
- Publication date Dec 4, 2014
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140327137
- Publication date Nov 6, 2014
- Eiji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140291845
- Publication date Oct 2, 2014
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...
- Publication number 20140295622
- Publication date Oct 2, 2014
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...
- Publication number 20140284375
- Publication date Sep 25, 2014
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Module Having Stacked Flip-Chip and Method for Fabricating th...
- Publication number 20140273349
- Publication date Sep 18, 2014
- Fairchild Korea Semiconductor, Ltd.
- Seung-won Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140247572
- Publication date Sep 4, 2014
- IBIDEN CO., LTD.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Vertical Interconnect...
- Publication number 20140239495
- Publication date Aug 28, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20140231947
- Publication date Aug 21, 2014
- LAPIS SEMICONDUCTOR CO., LTD.
- Yoshinori SHIZUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAN TYPE LIGHT EMITTING DIODE DEVICE AND METHOD OF MANUFACTURING TH...
- Publication number 20140213003
- Publication date Jul 31, 2014
- Samsung Electronics Co., Ltd.
- Kun Yoo KO
- H01 - BASIC ELECTRIC ELEMENTS

Internal layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device

Light emitting apparatus and method for producing the same

Interposer test structures and methods

Semiconductor device

Build-up package for integrated circuit devices, and methods of mak...

Light emitting apparatus and method for producing the same

Packaged microelectronic devices having stacked interconnect elemen...

Semiconductor device, manufacturing method for semiconductor device...

Semiconductor device and method for manufacturing semiconductor device

Interposer test structures and methods

Semiconductor device, manufacturing method for semiconductor device...

Semiconductor device and method of manufacturing the same

Build-up package for integrated circuit devices, and methods of mak...

Light emitting apparatus and method for producing the same

Display device

Guided acoustic wave device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device, manufacturing method for semiconductor device...

Method of manufacturing a semiconductor device

Semiconductor device, manufacturing method for semiconductor device...

Thin-film capacitor

Semiconductor device, manufacturing method for semiconductor device...

Semiconductor device, manufacturing method for semiconductor device...

Semiconductor device and method of manufacturing the same

Semiconductor device, manufacturing method for semiconductor device...

Semiconductor device and a method of manufacturing the same

Optical imaging apparatus and methods of making the same

Packaged microelectronic devices having stacked interconnect elemen...

Semiconductor light emitting device and method of manufacturing the...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAK...

LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME

PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...

Interposer Test Structures and Methods

NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Interposer Test Structures and Methods

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...

THIN-FILM CAPACITOR

Methods for Forming Ceramic Substrates with Via Studs

MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...

Ball Height Control in Bonding Process

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...

MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...

Power Module Having Stacked Flip-Chip and Method for Fabricating th...

PRINTED CIRCUIT BOARD

Semiconductor Device and Method of Forming a Vertical Interconnect...

SEMICONDUCTOR MODULE

GAN TYPE LIGHT EMITTING DIODE DEVICE AND METHOD OF MANUFACTURING TH...