Interposers

Industry

CPC
H05K2201/10378

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10378Interposers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device comprising interposer surrounding circuit element...
- Patent number 12,274,040
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Hyelim Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor-wire-embedded wiring board
- Patent number 12,267,962
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing component carrier and component carrier int...
- Patent number 12,262,482
- Issue date Mar 25, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including interposer
- Patent number 12,256,496
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Jungsik Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 12,250,768
- Issue date Mar 11, 2025
- DexCom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electronic device comprising interposer
- Patent number 12,245,374
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,243,802
- Issue date Mar 4, 2025
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and method of forming the same
- Patent number 12,243,813
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film package and display apparatus including the same
- Patent number 12,230,576
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,213,247
- Issue date Jan 28, 2025
- Advanced Semiconductor Engineering, Inc.
- Jung Jui Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-density interconnects for integrated circuit packages
- Patent number 12,205,902
- Issue date Jan 21, 2025
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including vertically integrated circuits a...
- Patent number 12,199,001
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board module
- Patent number 12,193,143
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya Hosotani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component carrier with embedded interposer laterally between electr...
- Patent number 12,165,964
- Issue date Dec 10, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density 3D interconnect configuration
- Patent number 12,159,835
- Issue date Dec 3, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 12,150,271
- Issue date Nov 19, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voice-controlled electronic device
- Patent number 12,147,610
- Issue date Nov 19, 2024
- Apple Inc.
- Craig M. Stanley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device including thermosetting bonding sheet
- Patent number 12,144,115
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board and display device including the same
- Patent number 12,130,979
- Issue date Oct 29, 2024
- Samsung Display Co., Ltd.
- Min-Hong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Maintaining the shape of a circuit board
- Patent number 12,127,334
- Issue date Oct 22, 2024
- Dis Tech America, LLC
- Heng-Kit Too
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module with output inductors and output capacitors that are e...
- Patent number 12,120,822
- Issue date Oct 15, 2024
- Monolithic Power Systems, Inc.
- Daocheng Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Display device
- Patent number 12,074,152
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Dae Hyuk Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and electronic device including the same
- Patent number 12,069,803
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor component arrangement, method for fabrication thereof...
- Patent number 12,046,531
- Issue date Jul 23, 2024
- Vitesco Technologies GmbH
- Detlev Bagung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stress reduction design and method for f...
- Patent number 12,035,475
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket interposer for system-in-package (SIP) module qualification...
- Patent number 12,025,971
- Issue date Jul 2, 2024
- Intel Corporation
- Navneet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ambient temperature sensor which may be coupled to a printed circui...
- Patent number 12,025,506
- Issue date Jul 2, 2024
- STMicroelectronics S.r.l.
- Massimiliano Pesaturo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...
- Publication number 20250112105
- Publication date Apr 3, 2025
- Micron Technology, Inc.
- Chan H. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC INTERPOSER AND CONDUCTIVE DEVICE THEREOF
- Publication number 20250113435
- Publication date Apr 3, 2025
- XINGR TECHNOLOGIES (ZHEJIANG) LIMITED
- Choon Leong LOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES
- Publication number 20250106994
- Publication date Mar 27, 2025
- Intel Corporation
- Mukund AYALASOMAYAJULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY
- Publication number 20250107003
- Publication date Mar 27, 2025
- Intel Corporation
- Chin Mian Choong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR TROUBLESHOOTING A BALL GRID ARRAY (BGA) DEVICE AND C...
- Publication number 20250081357
- Publication date Mar 6, 2025
- Western Digital Technologies, Inc.
- Nadav Tsur
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND LAMINATED WIRING BOARD
- Publication number 20250081353
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL SWITCHING POWER DEVICE
- Publication number 20250070101
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, CIRCUIT BOARD AND METHOD
- Publication number 20250070040
- Publication date Feb 27, 2025
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Interposer Laterally Between Electr...
- Publication number 20250071907
- Publication date Feb 27, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS
- Publication number 20250063664
- Publication date Feb 20, 2025
- Teradyne, Inc.
- Daniel L. Engel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING INTERPOSER
- Publication number 20250056723
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Dohyeong PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20250046715
- Publication date Feb 6, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOICE-CONTROLLED ELECTRONIC DEVICE
- Publication number 20250044879
- Publication date Feb 6, 2025
- Apple Inc.
- Craig M. Stanley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL...
- Publication number 20250014980
- Publication date Jan 9, 2025
- Intel Corporation
- Eric ERIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, ELECTRON...
- Publication number 20250006615
- Publication date Jan 2, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yifan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD STRUCTURE CONTAINING THERMAL INTERFACE MATERI...
- Publication number 20240431016
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Joohan KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING SUPPORTING STRUCTURE FOR PRINTED CIRCUI...
- Publication number 20240422911
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Dohyeong PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240407084
- Publication date Dec 5, 2024
- HKC Corporation Limited
- Yao LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY COMPRISING SPACER HAVING SELF-ALIGNM...
- Publication number 20240407097
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Jaeheung YE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240407099
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS
- Publication number 20240388018
- Publication date Nov 21, 2024
- Intel Corporation
- Karumbu MEYYAPPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-HEALING CAP FOR LIQUID METAL CONTAINMENT IN SOCKET APPLICATIONS
- Publication number 20240363520
- Publication date Oct 31, 2024
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CAPACITANCE MODULE
- Publication number 20240357746
- Publication date Oct 24, 2024
- INNODISK CORPORATION
- CHIH-CHIEH KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20240347414
- Publication date Oct 17, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...
- Publication number 20240347476
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING INTERPOSER AND METHOD FOR MANUFACTURING...
- Publication number 20240339391
- Publication date Oct 10, 2024
- Samsung Electronics Co., Ltd.
- Yunoh CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR PACKAGING MUL...
- Publication number 20240341029
- Publication date Oct 10, 2024
- Spreadtrum Communications (Shanghai) CO., Ltd.
- Li YAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...
- Publication number 20240334608
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, APPARATUSES, METHODS, AND NON-TRANSITORY COMPUTER-READABLE...
- Publication number 20240320183
- Publication date Sep 26, 2024
- Huawei Technologies Co., Ltd
- DAVIDE TONIETTO
- G06 - COMPUTING CALCULATING COUNTING

Interposers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device comprising interposer surrounding circuit element...

Capacitor-wire-embedded wiring board

Method of manufacturing component carrier and component carrier int...

Electronic device including interposer

Sensor interposer employing castellated through-vias

Electronic device comprising interposer

Methods and heat distribution devices for thermal management of chi...

Connection structure and method of forming the same

Integrated circuit structure

Circuit board with bridge chiplets

Chip-on-film package and display apparatus including the same

Electronic device

High-density interconnects for integrated circuit packages

Semiconductor assemblies including vertically integrated circuits a...

Circuit board module

Component carrier with embedded interposer laterally between electr...

High density 3D interconnect configuration

Platforms including microelectronic packages therein coupled to a c...

Voice-controlled electronic device

Electronic device including thermosetting bonding sheet

Hermetic metallized via with improved reliability

Circuit board and display device including the same

Maintaining the shape of a circuit board

Power module with output inductors and output capacitors that are e...

Display device

Interposer and electronic device including the same

Semiconductor component arrangement, method for fabrication thereof...

Semiconductor package with stress reduction design and method for f...

Socket interposer for system-in-package (SIP) module qualification...

Ambient temperature sensor which may be coupled to a printed circui...

Patents Applicationslast 30 patents

SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...

ELASTIC INTERPOSER AND CONDUCTIVE DEVICE THEREOF

THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES

METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY

INTERPOSER FOR TROUBLESHOOTING A BALL GRID ARRAY (BGA) DEVICE AND C...

WIRING BOARD AND LAMINATED WIRING BOARD

DUAL SWITCHING POWER DEVICE

ELECTRONIC COMPONENT, CIRCUIT BOARD AND METHOD

Component Carrier With Embedded Interposer Laterally Between Electr...

CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS

ELECTRONIC DEVICE INCLUDING INTERPOSER

High Density 3D Interconnect Configuration

VOICE-CONTROLLED ELECTRONIC DEVICE

INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL...

COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, ELECTRON...

PRINTED CIRCUIT BOARD STRUCTURE CONTAINING THERMAL INTERFACE MATERI...

ELECTRONIC DEVICE INCLUDING SUPPORTING STRUCTURE FOR PRINTED CIRCUI...

ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

PRINTED CIRCUIT BOARD ASSEMBLY COMPRISING SPACER HAVING SELF-ALIGNM...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS

SELF-HEALING CAP FOR LIQUID METAL CONTAINMENT IN SOCKET APPLICATIONS

HIGH CAPACITANCE MODULE

Methods And Heat Distribution Devices For Thermal Management Of Chi...

METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...

ELECTRONIC DEVICE INCLUDING INTERPOSER AND METHOD FOR MANUFACTURING...

MULTILAYER PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR PACKAGING MUL...

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...

SYSTEMS, APPARATUSES, METHODS, AND NON-TRANSITORY COMPUTER-READABLE...