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H05K2201/10378
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H
ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00
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H05K2201/10378
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Patents Grants
last 30 patents
Information
Patent Grant
Component carrier with embedded interposer laterally between electr...
Patent number
12,165,964
Issue date
Dec 10, 2024
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Minwoo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density 3D interconnect configuration
Patent number
12,159,835
Issue date
Dec 3, 2024
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Platforms including microelectronic packages therein coupled to a c...
Patent number
12,150,271
Issue date
Nov 19, 2024
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Voice-controlled electronic device
Patent number
12,147,610
Issue date
Nov 19, 2024
Apple Inc.
Craig M. Stanley
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Electronic device including thermosetting bonding sheet
Patent number
12,144,115
Issue date
Nov 12, 2024
Samsung Electronics Co., Ltd.
Youngsun Lee
B32 - LAYERED PRODUCTS
Information
Patent Grant
Hermetic metallized via with improved reliability
Patent number
12,131,985
Issue date
Oct 29, 2024
Corning Incorporated
Mandakini Kanungo
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Circuit board and display device including the same
Patent number
12,130,979
Issue date
Oct 29, 2024
Samsung Display Co., Ltd.
Min-Hong Kim
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Maintaining the shape of a circuit board
Patent number
12,127,334
Issue date
Oct 22, 2024
Dis Tech America, LLC
Heng-Kit Too
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Power module with output inductors and output capacitors that are e...
Patent number
12,120,822
Issue date
Oct 15, 2024
Monolithic Power Systems, Inc.
Daocheng Huang
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Display device
Patent number
12,074,152
Issue date
Aug 27, 2024
Samsung Display Co., Ltd.
Dae Hyuk Im
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer and electronic device including the same
Patent number
12,069,803
Issue date
Aug 20, 2024
Samsung Electronics Co., Ltd.
Eunseok Hong
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor component arrangement, method for fabrication thereof...
Patent number
12,046,531
Issue date
Jul 23, 2024
Vitesco Technologies GmbH
Detlev Bagung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with stress reduction design and method for f...
Patent number
12,035,475
Issue date
Jul 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Kuei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Socket interposer for system-in-package (SIP) module qualification...
Patent number
12,025,971
Issue date
Jul 2, 2024
Intel Corporation
Navneet Singh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ambient temperature sensor which may be coupled to a printed circui...
Patent number
12,025,506
Issue date
Jul 2, 2024
STMicroelectronics S.r.l.
Massimiliano Pesaturo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interposer and electronic device including the same
Patent number
12,022,614
Issue date
Jun 25, 2024
Samsung Electronics Co., Ltd.
Bongkyu Min
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Flexible circuit board, light bar, light source and display device
Patent number
11,991,825
Issue date
May 21, 2024
Beijing BOE Optoelectronics Technology Co., Ltd
Yuanda Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power electronics unit comprising a circuit board and a power modul...
Patent number
11,990,697
Issue date
May 21, 2024
Audi AG
Andreas Apelsmeier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and heat distribution devices for thermal management of chi...
Patent number
11,990,386
Issue date
May 21, 2024
Google LLC
Madhusudan K. Iyengar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board assembly
Patent number
11,985,757
Issue date
May 14, 2024
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Won Wook So
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer
Patent number
11,973,013
Issue date
Apr 30, 2024
AMOSENSE CO., LTD.
Changwoo Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board module and electronic device including the same
Patent number
11,974,397
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Seungbo Shim
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Method of producing circuit boards
Patent number
11,974,404
Issue date
Apr 30, 2024
TOPPAN INC.
Yuki Nitta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
Patent number
11,961,805
Issue date
Apr 16, 2024
Skyworks Solutions, Inc.
Howard E. Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensor interposer employing castellated through-vias
Patent number
11,950,363
Issue date
Apr 2, 2024
DexCom, Inc.
Sean Frick
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer with flexible portion
Patent number
11,942,412
Issue date
Mar 26, 2024
Intel Corporation
Bok Eng Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic assembly including a compression assembly for cable conn...
Patent number
11,943,886
Issue date
Mar 26, 2024
TE CONNECTIVITY SOLUTIONS GmbH
Christopher William Blackburn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electric compressor with inverter circuit section and filter circui...
Patent number
11,936,251
Issue date
Mar 19, 2024
SANDEN AUTOMOTIVE COMPONENTS CORPORATION
Mikio Kobayashi
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Interposer and electronic device including the same
Patent number
11,889,626
Issue date
Jan 30, 2024
Samsung Electronics Co., Ltd.
Kyungho Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Chip substrate for reducing thermal load on a chip assembly mounted...
Patent number
11,882,659
Issue date
Jan 23, 2024
Raytheon Company
Thomas Sprafke
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC DEVICE INCLUDING SUPPORTING STRUCTURE FOR PRINTED CIRCUI...
Publication number
20240422911
Publication date
Dec 19, 2024
Samsung Electronics Co., Ltd.
Dohyeong PARK
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
Publication number
20240407084
Publication date
Dec 5, 2024
HKC Corporation Limited
Yao LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY COMPRISING SPACER HAVING SELF-ALIGNM...
Publication number
20240407097
Publication date
Dec 5, 2024
Samsung Electronics Co., Ltd.
Jaeheung YE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20240407099
Publication date
Dec 5, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Sang Hyun Jin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
Publication number
20240389240
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Company Limited
Chao-Wei Chiu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS
Publication number
20240388018
Publication date
Nov 21, 2024
Intel Corporation
Karumbu MEYYAPPAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-HEALING CAP FOR LIQUID METAL CONTAINMENT IN SOCKET APPLICATIONS
Publication number
20240363520
Publication date
Oct 31, 2024
Intel Corporation
Ziyin LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH CAPACITANCE MODULE
Publication number
20240357746
Publication date
Oct 24, 2024
INNODISK CORPORATION
CHIH-CHIEH KAO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
Publication number
20240347414
Publication date
Oct 17, 2024
Google LLC
Madhusudan K. Iyengar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...
Publication number
20240347476
Publication date
Oct 17, 2024
Skyworks Solutions, Inc.
Howard E. CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE INCLUDING INTERPOSER AND METHOD FOR MANUFACTURING...
Publication number
20240339391
Publication date
Oct 10, 2024
Samsung Electronics Co., Ltd.
Yunoh CHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR PACKAGING MUL...
Publication number
20240341029
Publication date
Oct 10, 2024
Spreadtrum Communications (Shanghai) CO., Ltd.
Li YAO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...
Publication number
20240334608
Publication date
Oct 3, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Kuei HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS, APPARATUSES, METHODS, AND NON-TRANSITORY COMPUTER-READABLE...
Publication number
20240320183
Publication date
Sep 26, 2024
Huawei Technologies Co., Ltd
DAVIDE TONIETTO
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR COMPONENT ARRANGEMENT, METHOD FOR FABRICATION THEREOF...
Publication number
20240297093
Publication date
Sep 5, 2024
Vitesco Technologies GMBH
Detlev Bagung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
Publication number
20240292529
Publication date
Aug 29, 2024
Samsung Electro-Mechanics Co., Ltd.
Inhwan Oh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD INTERCONNECT INTERPOSER AND METHOD
Publication number
20240292539
Publication date
Aug 29, 2024
Intel Corporation
Juha Paavola
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE FOR MULTILAYER...
Publication number
20240266109
Publication date
Aug 8, 2024
Murata Manufacturing Co., Ltd.
Tomoki KITAGAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION
Publication number
20240260237
Publication date
Aug 1, 2024
Western Digital Technologies, Inc.
Wei Hong Tew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC APPARATUS COMPRISING SAME
Publication number
20240244748
Publication date
Jul 18, 2024
Samsung Electronics Co., Ltd.
Jinhwan JEON
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...
Publication number
20240226565
Publication date
Jul 11, 2024
The Regents of the University of California
Shadi A. Dayeh
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Application
INTERPOSER BOARD AND CIRCUIT BOARD INCLUDING THE SAME
Publication number
20240224436
Publication date
Jul 4, 2024
Samsung Electro-Mechanics Co., Ltd.
Young Kuk Ko
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CHIP ON FILMS AND DISPLAY MODULES
Publication number
20240222252
Publication date
Jul 4, 2024
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
Yuhua YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ORTHOGONAL CIRCUIT BOARD INTERCONNECTION SYSTEMS
Publication number
20240213697
Publication date
Jun 27, 2024
Lockheed Martin Corporation
Alexander John Silverman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED INTERCONNECT FOR A BACK-FIRING MICROPHONE CIRCUIT BOARD
Publication number
20240205599
Publication date
Jun 20, 2024
Google LLC
Kliulai CHOW-YEE
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
INTERPOSER AND ELECTRONIC DEVICE COMPRISING SAME
Publication number
20240196517
Publication date
Jun 13, 2024
Samsung Electronics Co., Ltd.
Youngsun JO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
Publication number
20240196531
Publication date
Jun 13, 2024
Dexcom, Inc.
Sean Frick
G01 - MEASURING TESTING
Information
Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY WITH REDUCED TOTAL HEIGHT
Publication number
20240196539
Publication date
Jun 13, 2024
MEDIATEK INC.
Chun-Ping Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME
Publication number
20240188218
Publication date
Jun 6, 2024
Samsung Electronics Co., Ltd.
Yonglak CHO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC CIRCUIT BOARD AND ELECTRONIC DEVICE
Publication number
20240179843
Publication date
May 30, 2024
SONY GROUP CORPORATION
Yoshihiro KATO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR