Interposers

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CPC
H05K2201/10378

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10378Interposers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic module, intermediate connection member, and electronic d...
- Patent number 12,327,938
- Issue date Jun 10, 2025
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for package with interposers
- Patent number 12,322,670
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, apparatuses, methods, and non-transitory computer-readable...
- Patent number 12,314,208
- Issue date May 27, 2025
- Huawei Technologies Co., Ltd.
- Davide Tonietto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device including printed circuit board structure includi...
- Patent number 12,317,407
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Kyuhwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through mold via frame
- Patent number 12,308,307
- Issue date May 20, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, sub-module, and method for manufacturi...
- Patent number 12,309,932
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Tsuyoshi Takakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board connector and module device comprising same
- Patent number 12,300,917
- Issue date May 13, 2025
- LG Innotek Co., Ltd
- Joo Young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with conductive or magnetic nanowires for localized heating...
- Patent number 12,300,591
- Issue date May 13, 2025
- Regents of The University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for active implantable medical device
- Patent number 12,302,492
- Issue date May 13, 2025
- NeuroPace, Inc.
- Joseph Vandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,278,160
- Issue date Apr 15, 2025
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate frame design for three-dimensional stacked electronic ass...
- Patent number 12,278,172
- Issue date Apr 15, 2025
- Applied Materials, Inc.
- Akash Agrawal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display module, display apparatus, and method of manufacturing the...
- Patent number 12,278,225
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Jongsu Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board assembly and electronic device comprising same
- Patent number 12,279,371
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Gyeongmin Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising interposer surrounding circuit element...
- Patent number 12,274,040
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Hyelim Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor-wire-embedded wiring board
- Patent number 12,267,962
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing component carrier and component carrier int...
- Patent number 12,262,482
- Issue date Mar 25, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including interposer
- Patent number 12,256,496
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Jungsik Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 12,250,768
- Issue date Mar 11, 2025
- DexCom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electronic device comprising interposer
- Patent number 12,245,374
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,243,802
- Issue date Mar 4, 2025
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and method of forming the same
- Patent number 12,243,813
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film package and display apparatus including the same
- Patent number 12,230,576
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,213,247
- Issue date Jan 28, 2025
- Advanced Semiconductor Engineering, Inc.
- Jung Jui Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-density interconnects for integrated circuit packages
- Patent number 12,205,902
- Issue date Jan 21, 2025
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including vertically integrated circuits a...
- Patent number 12,199,001
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board module
- Patent number 12,193,143
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya Hosotani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component carrier with embedded interposer laterally between electr...
- Patent number 12,165,964
- Issue date Dec 10, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density 3D interconnect configuration
- Patent number 12,159,835
- Issue date Dec 3, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183186
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sungoh Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250174568
- Publication date May 29, 2025
- InnoLux Corporation
- Po-Yun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE SUBSTRATE AND INTERPOSER
- Publication number 20250167091
- Publication date May 22, 2025
- NGK Insulators, Ltd.
- Yoshitsugu WAKAZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250159812
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250157910
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...
- Publication number 20250112105
- Publication date Apr 3, 2025
- Micron Technology, Inc.
- Chan H. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC INTERPOSER AND CONDUCTIVE DEVICE THEREOF
- Publication number 20250113435
- Publication date Apr 3, 2025
- XINGR TECHNOLOGIES (ZHEJIANG) LIMITED
- Choon Leong LOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES
- Publication number 20250106994
- Publication date Mar 27, 2025
- Intel Corporation
- Mukund AYALASOMAYAJULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY
- Publication number 20250107003
- Publication date Mar 27, 2025
- Intel Corporation
- Chin Mian Choong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR TROUBLESHOOTING A BALL GRID ARRAY (BGA) DEVICE AND C...
- Publication number 20250081357
- Publication date Mar 6, 2025
- Western Digital Technologies, Inc.
- Nadav Tsur
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND LAMINATED WIRING BOARD
- Publication number 20250081353
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL SWITCHING POWER DEVICE
- Publication number 20250070101
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, CIRCUIT BOARD AND METHOD
- Publication number 20250070040
- Publication date Feb 27, 2025
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Interposer Laterally Between Electr...
- Publication number 20250071907
- Publication date Feb 27, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS
- Publication number 20250063664
- Publication date Feb 20, 2025
- Teradyne, Inc.
- Daniel L. Engel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING INTERPOSER
- Publication number 20250056723
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Dohyeong PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20250046715
- Publication date Feb 6, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOICE-CONTROLLED ELECTRONIC DEVICE
- Publication number 20250044879
- Publication date Feb 6, 2025
- Apple Inc.
- Craig M. Stanley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL...
- Publication number 20250014980
- Publication date Jan 9, 2025
- Intel Corporation
- Eric ERIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, ELECTRON...
- Publication number 20250006615
- Publication date Jan 2, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yifan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD STRUCTURE CONTAINING THERMAL INTERFACE MATERI...
- Publication number 20240431016
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Joohan KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING SUPPORTING STRUCTURE FOR PRINTED CIRCUI...
- Publication number 20240422911
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Dohyeong PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240407084
- Publication date Dec 5, 2024
- HKC Corporation Limited
- Yao LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY COMPRISING SPACER HAVING SELF-ALIGNM...
- Publication number 20240407097
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Jaeheung YE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240407099
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS
- Publication number 20240388018
- Publication date Nov 21, 2024
- Intel Corporation
- Karumbu MEYYAPPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-HEALING CAP FOR LIQUID METAL CONTAINMENT IN SOCKET APPLICATIONS
- Publication number 20240363520
- Publication date Oct 31, 2024
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CAPACITANCE MODULE
- Publication number 20240357746
- Publication date Oct 24, 2024
- INNODISK CORPORATION
- CHIH-CHIEH KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20240347414
- Publication date Oct 17, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS

Interposers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic module, intermediate connection member, and electronic d...

Methods and apparatus for package with interposers

Systems, apparatuses, methods, and non-transitory computer-readable...

Electronic device including printed circuit board structure includi...

Through mold via frame

Electronic component module, sub-module, and method for manufacturi...

Printed circuit board connector and module device comprising same

Devices with conductive or magnetic nanowires for localized heating...

Interposer for active implantable medical device

Methods and heat distribution devices for thermal management of chi...

Substrate frame design for three-dimensional stacked electronic ass...

Display module, display apparatus, and method of manufacturing the...

Printed circuit board assembly and electronic device comprising same

Electronic device comprising interposer surrounding circuit element...

Capacitor-wire-embedded wiring board

Method of manufacturing component carrier and component carrier int...

Electronic device including interposer

Sensor interposer employing castellated through-vias

Electronic device comprising interposer

Methods and heat distribution devices for thermal management of chi...

Connection structure and method of forming the same

Integrated circuit structure

Circuit board with bridge chiplets

Chip-on-film package and display apparatus including the same

Electronic device

High-density interconnects for integrated circuit packages

Semiconductor assemblies including vertically integrated circuits a...

Circuit board module

Component carrier with embedded interposer laterally between electr...

High density 3D interconnect configuration

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

CORE SUBSTRATE AND INTERPOSER

INTEGRATED CIRCUIT STRUCTURE

CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...

ELASTIC INTERPOSER AND CONDUCTIVE DEVICE THEREOF

THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES

METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY

INTERPOSER FOR TROUBLESHOOTING A BALL GRID ARRAY (BGA) DEVICE AND C...

WIRING BOARD AND LAMINATED WIRING BOARD

DUAL SWITCHING POWER DEVICE

ELECTRONIC COMPONENT, CIRCUIT BOARD AND METHOD

Component Carrier With Embedded Interposer Laterally Between Electr...

CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS

ELECTRONIC DEVICE INCLUDING INTERPOSER

High Density 3D Interconnect Configuration

VOICE-CONTROLLED ELECTRONIC DEVICE

INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL...

COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, ELECTRON...

PRINTED CIRCUIT BOARD STRUCTURE CONTAINING THERMAL INTERFACE MATERI...

ELECTRONIC DEVICE INCLUDING SUPPORTING STRUCTURE FOR PRINTED CIRCUI...

ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

PRINTED CIRCUIT BOARD ASSEMBLY COMPRISING SPACER HAVING SELF-ALIGNM...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS

SELF-HEALING CAP FOR LIQUID METAL CONTAINMENT IN SOCKET APPLICATIONS

HIGH CAPACITANCE MODULE

Methods And Heat Distribution Devices For Thermal Management Of Chi...