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H05K2201/10378
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H
ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00
Indexing scheme relating to printed circuits covered by H05K1/00
Current Industry
H05K2201/10378
Interposers
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Patents Grants
last 30 patents
Information
Patent Grant
Interposer
Patent number
11,973,013
Issue date
Apr 30, 2024
AMOSENSE CO., LTD.
Changwoo Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board module and electronic device including the same
Patent number
11,974,397
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Seungbo Shim
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Method of producing circuit boards
Patent number
11,974,404
Issue date
Apr 30, 2024
TOPPAN INC.
Yuki Nitta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
Patent number
11,961,805
Issue date
Apr 16, 2024
Skyworks Solutions, Inc.
Howard E. Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensor interposer employing castellated through-vias
Patent number
11,950,363
Issue date
Apr 2, 2024
DexCom, Inc.
Sean Frick
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer with flexible portion
Patent number
11,942,412
Issue date
Mar 26, 2024
Intel Corporation
Bok Eng Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic assembly including a compression assembly for cable conn...
Patent number
11,943,886
Issue date
Mar 26, 2024
TE CONNECTIVITY SOLUTIONS GmbH
Christopher William Blackburn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electric compressor with inverter circuit section and filter circui...
Patent number
11,936,251
Issue date
Mar 19, 2024
SANDEN AUTOMOTIVE COMPONENTS CORPORATION
Mikio Kobayashi
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Interposer and electronic device including the same
Patent number
11,889,626
Issue date
Jan 30, 2024
Samsung Electronics Co., Ltd.
Kyungho Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Chip substrate for reducing thermal load on a chip assembly mounted...
Patent number
11,882,659
Issue date
Jan 23, 2024
Raytheon Company
Thomas Sprafke
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Z-axis interconnection with protruding component
Patent number
11,864,319
Issue date
Jan 2, 2024
AT&SAustria Technologie & Systemtechnik AG
Mario Schober
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit module and electronic device including the same
Patent number
11,832,389
Issue date
Nov 28, 2023
Samsung Electronics Co., Ltd.
Taewon Sun
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Through board via heat sink
Patent number
11,825,593
Issue date
Nov 21, 2023
Aptiv Technologies Limited
Navneet Gupta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device comprising interposer surrounding circuit element...
Patent number
11,825,639
Issue date
Nov 21, 2023
Samsung Electronics Co., Ltd.
Hyelim Yun
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic device including interposer
Patent number
11,818,843
Issue date
Nov 14, 2023
Samsung Electronics Co., Ltd.
Jungsik Park
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor module and electronic apparatus
Patent number
11,818,844
Issue date
Nov 14, 2023
Canon Kabushiki Kaisha
Yuya Karakawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Breakout structure for an integrated circuit device
Patent number
11,812,544
Issue date
Nov 7, 2023
Xilinx, Inc.
Shad Shepston
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Connection structure and method of forming the same
Patent number
11,810,849
Issue date
Nov 7, 2023
Samsung Electronics Co., Ltd.
Jongyoun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip assemblies
Patent number
11,805,602
Issue date
Oct 31, 2023
Intel Corporation
Loke Yip Foo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic circuit assembly and method for manufacturing thereof
Patent number
11,792,922
Issue date
Oct 17, 2023
Unimicron Technology Corp.
Chun-Hung Kuo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic module and electronic apparatus
Patent number
11,792,917
Issue date
Oct 17, 2023
Canon Kabushiki Kaisha
Takuya Kondo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer ceramic capacitor
Patent number
11,785,720
Issue date
Oct 10, 2023
Murata Manufacturing Co., Ltd.
Satoshi Yokomizo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate structure and electronic device including the same
Patent number
11,770,898
Issue date
Sep 26, 2023
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Seung Eun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with interface structure and method for fabric...
Patent number
11,751,334
Issue date
Sep 5, 2023
NANYA TECHNOLOGY CORPORATION
Chun-Huang Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power converter package with thermally enhanced interposers to cool...
Patent number
11,749,591
Issue date
Sep 5, 2023
Hong Kong Applied Science and Technology Research Institute Company Limited
Danting Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer and method for producing holes in an interposer
Patent number
11,744,015
Issue date
Aug 29, 2023
Schott AG
Oliver Jackl
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High density 3D interconnect configuration
Patent number
11,735,526
Issue date
Aug 22, 2023
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Platforms including microelectronic packages therein coupled to a c...
Patent number
11,716,826
Issue date
Aug 1, 2023
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for making electrical connectors with an electrical interposer
Patent number
11,715,895
Issue date
Aug 1, 2023
Seagate Technology LLC
Michael J. Peterson
G11 - INFORMATION STORAGE
Information
Patent Grant
Through-board power control arrangements for integrated circuit dev...
Patent number
11,710,726
Issue date
Jul 25, 2023
Microsoft Technology Licensing, LLC
William Paul Hovis
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC APPARATUS MINIMIZING DIFFERENTIAL THERMAL CONTRACTION FO...
Publication number
20240155759
Publication date
May 9, 2024
International Business Machines Corporation
Shawn Anthony Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...
Publication number
20240147624
Publication date
May 2, 2024
Canon Kabushiki Kaisha
NORITAKE TSUBOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...
Publication number
20240131339
Publication date
Apr 25, 2024
The Regents of the University of California
Shadi A. Dayeh
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Application
THERMOPLASTIC INTERPOSER
Publication number
20240121882
Publication date
Apr 11, 2024
Meta Platforms Technologies, LLC
Brian Toleno
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENT...
Publication number
20240107726
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
Hyelim YUN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
COMPRESSION STRUCTURES FOR IC PACKAGES
Publication number
20240105639
Publication date
Mar 28, 2024
Apple Inc.
Helia Rahmani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD
Publication number
20240080982
Publication date
Mar 7, 2024
Samsung Electronics Co., Ltd.
Juho Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
HIGH DENSITY INTERPOSERS WITH MODULAR MEMORY UNITS
Publication number
20240080988
Publication date
Mar 7, 2024
Intel Corporation
Todd A. HINCK
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
TECHNOLOGIES FOR SEALING LIQUID METAL INTERCONNECT ARRAY PACKAGES
Publication number
20240074046
Publication date
Feb 29, 2024
Intel Corporation
Ziyin Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuit Board Assembly with Interposer Circuit Board and Correspond...
Publication number
20240064898
Publication date
Feb 22, 2024
Motorola Mobility LLC
Wayne G Morrison
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
Publication number
20240049388
Publication date
Feb 8, 2024
Dexcom, Inc.
Sean Frick
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Application
PHOTONIC INTEGRATED CIRCUIT EMBEDDED SUBSTRATE AND PHOTONIC INTEGRA...
Publication number
20240032202
Publication date
Jan 25, 2024
Samsung Electro-Mechanics Co., Ltd.
Kwang Yun KIM
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20240023239
Publication date
Jan 18, 2024
Advanced Semiconductor Engineering, Inc.
Jung Jui KANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DIRECT WRITE DUAL CURE GASKET
Publication number
20240002692
Publication date
Jan 4, 2024
Raytheon Company
Susan C. Trulli
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE...
Publication number
20240006391
Publication date
Jan 4, 2024
Samsung Electronics Co., Ltd.
Sangho LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME
Publication number
20240006403
Publication date
Jan 4, 2024
Molex, LLC
Victor Zaderej
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE
Publication number
20230420354
Publication date
Dec 28, 2023
Intel Corporation
Telesphor KAMGAING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE...
Publication number
20230422398
Publication date
Dec 28, 2023
Global Unichip Corporation
Chih-Chieh LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Cavity-Stacked Printed Circuit Board Assemblies
Publication number
20230413440
Publication date
Dec 21, 2023
Google LLC
Jiali Lai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
OPTICAL MODULE AND OPTICAL COMMUNICATION DEVICE
Publication number
20230400626
Publication date
Dec 14, 2023
Fujitsu Limited
Akio SUGAMA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SANDWICH STRUCTURE POWER SUPPLY MODULE
Publication number
20230396158
Publication date
Dec 7, 2023
Monolithic Power Systems, Inc.
Daocheng Huang
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
SUBSTRATE TO BOARD INTERCONNECT WITH LIQUID METAL AND SURFACE PINS
Publication number
20230395480
Publication date
Dec 7, 2023
Intel Corporation
Tin Poay Chuah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOUBLE-SIDED ARRANGEMENT TYPE ELECTRONIC COMPONENT MODULE AND ELECT...
Publication number
20230371180
Publication date
Nov 16, 2023
Samsung Electronics Co., Ltd.
Yohan MOON
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLEXIBLE CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME
Publication number
20230354511
Publication date
Nov 2, 2023
Samsung Electronics Co., Ltd.
Youngsun LEE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BOARD-LEVEL STRUCTURE AND COMMUNICATION DEVICE
Publication number
20230345638
Publication date
Oct 26, 2023
Huawei Technologies Co., Ltd
Ying LIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD WITH EMBEDDED BUMP PADS
Publication number
20230345633
Publication date
Oct 26, 2023
Kent Yang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THIN CLIENT FORM FACTOR ASSEMBLY
Publication number
20230317705
Publication date
Oct 5, 2023
Intel Corporation
Carlton Hanna
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Component Carrier
Publication number
20230319989
Publication date
Oct 5, 2023
Marco Gavagnin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CAPACITOR-WIRE-EMBEDDED WIRING BOARD
Publication number
20230319998
Publication date
Oct 5, 2023
Samsung Electronics Co., Ltd.
SOOJAE PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...
Publication number
20230307309
Publication date
Sep 28, 2023
Micron Technology, Inc.
Chan H. YOO
H01 - BASIC ELECTRIC ELEMENTS