involving a permanent auxiliary member being left in the finished device

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H01L2224/85007

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85007involving a permanent auxiliary member being left in the finished device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Light-emitting substrate, method of manufacturing light-emitting su...
- Patent number 12,046,591
- Issue date Jul 23, 2024
- BOE Technology Group Co., Ltd.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Straight wirebonding of silicon dies
- Patent number 11,456,272
- Issue date Sep 27, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfluidic manufactured mesoscopic microelectronics interconnect
- Patent number 11,233,030
- Issue date Jan 25, 2022
- Rockwell Collins, Inc.
- Brandon C. Hamilton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond wire support systems and methods
- Patent number 11,049,836
- Issue date Jun 29, 2021
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with supported stacked die
- Patent number 10,796,975
- Issue date Oct 6, 2020
- Intel Corporation
- Guo Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,468,376
- Issue date Nov 5, 2019
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and processing methods
- Patent number 10,103,123
- Issue date Oct 16, 2018
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,090,375
- Issue date Oct 2, 2018
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated electrical assembly
- Patent number 9,992,875
- Issue date Jun 5, 2018
- Semblant Limited
- Elizabeth Williams-Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding a hermetic module to an electrode array
- Patent number 9,984,994
- Issue date May 29, 2018
- The Charles Stark Draper Laboratory, Inc.
- Tirunelveli Sriram
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Assembly structure for connecting multiple dies into a system-in-pa...
- Patent number 9,349,610
- Issue date May 24, 2016
- Global Unichip Corp.
- Tsung Chuan Whang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale technique for interconnecting vertically stacked dies
- Patent number 9,331,051
- Issue date May 3, 2016
- Technische Universiteit Eindhoven
- Pinxiang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 9,214,452
- Issue date Dec 15, 2015
- SK Hynix Inc.
- Tae Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device stack with bonding layer and wire retaining me...
- Patent number 8,970,052
- Issue date Mar 3, 2015
- PS4 Luxco S.A.R.L.
- Yu Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling at least one chip with a wire element, electr...
- Patent number 8,654,540
- Issue date Feb 18, 2014
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device stack with bonding layer and wire retaining me...
- Patent number 8,581,417
- Issue date Nov 12, 2013
- Elpida Memory, Inc.
- Yu Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device provided with wire that electrically connects...
- Patent number 8,217,517
- Issue date Jul 10, 2012
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of protecting bond wires during molding and handling
- Patent number 5,736,792
- Issue date Apr 7, 1998
- Texas Instruments Incorporated
- John W. Orcutt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of connecting electronic microcomponents
- Patent number 3,981,076
- Issue date Sep 21, 1976
- Commissariat a l'Energie Atomique
- Gerard Nicolas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3713006
- Patent number 3,713,006
- Issue date Jan 23, 1973
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...
- Publication number 20240339444
- Publication date Oct 10, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATING METHOD THEREOF, AND ME...
- Publication number 20240304509
- Publication date Sep 12, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND WIRE RELIABILITY AND PROCESS WITH HIGH TEHRMAL PERFORMANCE IN...
- Publication number 20240170359
- Publication date May 23, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240023346
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Younghun CHEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON...
- Publication number 20240014168
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SUPPORTER AGAINST WHICH BONDING WIRE IS D...
- Publication number 20230395557
- Publication date Dec 7, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Wire and Method for Manufacturing the Same
- Publication number 20230125151
- Publication date Apr 27, 2023
- Nippon Telegraph and Telephone Corporation
- Toshiki Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20220336402
- Publication date Oct 20, 2022
- Mitsubishi Electric Corporation
- Haruko HITOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...
- Publication number 20220320056
- Publication date Oct 6, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAIGHT WIREBONDING OF SILICON DIES
- Publication number 20220084979
- Publication date Mar 17, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND WIRE SUPPORT SYSTEMS AND METHODS
- Publication number 20190326247
- Publication date Oct 24, 2019
- TEXAS INSTRUMENTS INCORPORATED
- MATTHEW DAVID ROMIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180269179
- Publication date Sep 20, 2018
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PROCESSING METHODS
- Publication number 20170236801
- Publication date Aug 17, 2017
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20170179055
- Publication date Jun 22, 2017
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING A HERMETIC MODULE TO AN ELECTRODE ARRAY
- Publication number 20170154867
- Publication date Jun 1, 2017
- The Charles Stark Draper Laboratory, Inc.
- Tirunelveli Sriram
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ASSEMBLY STRUCTURE FOR CONNECTING MULTIPLE DIES INTO A SYSTEM-IN-PA...
- Publication number 20150311094
- Publication date Oct 29, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- Tsung Chuan Whang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20150303175
- Publication date Oct 22, 2015
- SK HYNIX INC.
- Tae Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer scale technique for interconnecting vertically stacked dies
- Publication number 20140300008
- Publication date Oct 9, 2014
- Pinxiang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STACK WITH BONDING LAYER AND WIRE RETAINING ME...
- Publication number 20140035166
- Publication date Feb 6, 2014
- Elpida Memory, Inc.
- Yu HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING AT LEAST ONE CHIP WITH A WIRE ELEMENT, ELECTR...
- Publication number 20110149540
- Publication date Jun 23, 2011
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean BRUN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE PROVIDED WITH WIRE THAT ELECTRICALLY CONNECTS...
- Publication number 20110006418
- Publication date Jan 13, 2011
- ELPIDA MEMORY, INC.
- Mitsuhisa Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20100193933
- Publication date Aug 5, 2010
- ELPIDA MEMORY, INC.
- Yu HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS

involving a permanent auxiliary member being left in the finished device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light-emitting substrate, method of manufacturing light-emitting su...

Straight wirebonding of silicon dies

Microfluidic manufactured mesoscopic microelectronics interconnect

Bond wire support systems and methods

Semiconductor package with supported stacked die

Semiconductor device and method for manufacturing the same

Semiconductor devices and processing methods

Semiconductor structure

Coated electrical assembly

Method for bonding a hermetic module to an electrode array

Assembly structure for connecting multiple dies into a system-in-pa...

Wafer scale technique for interconnecting vertically stacked dies

Semiconductor package and method for fabricating the same

Semiconductor device stack with bonding layer and wire retaining me...

Method for assembling at least one chip with a wire element, electr...

Semiconductor device stack with bonding layer and wire retaining me...

Semiconductor device provided with wire that electrically connects...

Method of protecting bond wires during molding and handling

Method of connecting electronic microcomponents

3713006

Patents Applicationslast 30 patents

LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...

SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATING METHOD THEREOF, AND ME...

BOND WIRE RELIABILITY AND PROCESS WITH HIGH TEHRMAL PERFORMANCE IN...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON...

SEMICONDUCTOR DEVICE WITH SUPPORTER AGAINST WHICH BONDING WIRE IS D...

Bonding Wire and Method for Manufacturing the Same

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...

STRAIGHT WIREBONDING OF SILICON DIES

BOND WIRE SUPPORT SYSTEMS AND METHODS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES AND PROCESSING METHODS

SEMICONDUCTOR STRUCTURE

METHOD FOR BONDING A HERMETIC MODULE TO AN ELECTRODE ARRAY

ASSEMBLY STRUCTURE FOR CONNECTING MULTIPLE DIES INTO A SYSTEM-IN-PA...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Wafer scale technique for interconnecting vertically stacked dies

SEMICONDUCTOR DEVICE STACK WITH BONDING LAYER AND WIRE RETAINING ME...

METHOD FOR ASSEMBLING AT LEAST ONE CHIP WITH A WIRE ELEMENT, ELECTR...

SEMICONDUCTOR DEVICE PROVIDED WITH WIRE THAT ELECTRICALLY CONNECTS...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...