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3713006
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Information
Patent Grant
3713006
References
Source
Patent Number
3,713,006
Date Filed
Not available
Date Issued
Tuesday, January 23, 1973
52 years ago
CPC
H01L24/85 - using a wire connector
H01L23/15 - Ceramic or glass substrates
H01L23/58 - Structural electrical arrangements for semiconductor devices not otherwise provided for
H01L23/66 - High-frequency adaptations
H01L24/48 - of an individual wire connector
H01L24/49 - of a plurality of wire connectors
H01L25/16 - the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 and H01L51/00
H03F3/211 - using a combination of several amplifiers
H03F3/602 - Combinations of several amplifiers
H01L2223/6644 - Packaging aspects of high-frequency amplifiers
H01L2224/48091 - Arched
H01L2224/48227 - connecting the wire to a bond pad of the item
H01L2224/48465 - the other connecting portion not on the bonding area being a wedge bond
H01L2224/4899 - Auxiliary members for wire connectors
H01L2224/49175 - Parallel arrangements
H01L2224/73265 - Layer and wire connectors
H01L2224/85007 - involving a permanent auxiliary member being left in the finished device
H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
H01L2924/01005 - Boron [B]
H01L2924/01006 - Carbon [C]
H01L2924/01013 - Aluminum [Al]
H01L2924/01019 - Potassium [K]
H01L2924/01023 - Vanadium [V]
H01L2924/01029 - Copper [Cu]
H01L2924/01033 - Arsenic [As]
H01L2924/01037 - Rubidium [Rb]
H01L2924/01075 - Rhenium [Re]
H01L2924/01079 - Gold [Au]
H01L2924/01082 - Lead [Pb]
H01L2924/01322 - Eutectic Alloys
H01L2924/014 - Solder alloys
H01L2924/10253 - Silicon [Si]
H01L2924/12044 - OLED
H01L2924/14 - Integrated circuits
H01L2924/30107 - Inductance
H01L2924/3011 - Impedance
H01L2924/30111 - matching
US Classifications
257 - Active solid-state devices
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