involving a permanent auxiliary member being left in the finished device

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H01L2224/84007

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/84007involving a permanent auxiliary member being left in the finished device

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Patents Grantslast 30 patents

Information Patent Grant
Multi-clip structure for die bonding
- Patent number 11,189,592
- Issue date Nov 30, 2021
- Infineon Technologies Austria AG
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Coated electrical assembly
- Patent number 9,992,875
- Issue date Jun 5, 2018
- Semblant Limited
- Elizabeth Williams-Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module package and method of manufacturing the same
- Patent number 9,524,929
- Issue date Dec 20, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240355774
- Publication date Oct 24, 2024
- Mitsubishi Electric Corporation
- Nozomi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER C...
- Publication number 20240312880
- Publication date Sep 19, 2024
- Mitsubishi Electric Corporation
- Yusuke KUSAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...
- Publication number 20230290765
- Publication date Sep 14, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Clip Structure for Die Bonding
- Publication number 20200105707
- Publication date Apr 2, 2020
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS