involving a rotary work-table

Industry

CPC
B24B7/04

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces Accessories therefor

Current Industry

B24B7/04involving a rotary work-table

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Machine for finishing a work piece, and having a highly controllabl...
- Patent number 12,122,012
- Issue date Oct 22, 2024
- II-VI DELAWARE, INC.
- Edward J. Gratrix
- B24 - GRINDING POLISHING
Information Patent Grant
Elastic membrane, substrate holding device, and polishing apparatus
- Patent number 12,068,189
- Issue date Aug 20, 2024
- Ebara Corporation
- Satoru Yamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of workpiece
- Patent number 12,064,847
- Issue date Aug 20, 2024
- Disco Corporation
- Yoshikazu Suzuki
- B24 - GRINDING POLISHING
Information Patent Grant
Textured glass-based articles with multiple haze levels and process...
- Patent number 12,043,567
- Issue date Jul 23, 2024
- Corning Incorporated
- Shunda Denise Cannon Wilson
- B24 - GRINDING POLISHING
Information Patent Grant
Planar grinder
- Patent number 12,000,764
- Issue date Jun 4, 2024
- Illinois Tool Works Inc.
- Kurt G. Adair
- G01 - MEASURING TESTING
Information Patent Grant
Method of grinding workpiece
- Patent number 11,980,993
- Issue date May 14, 2024
- Disco Corporation
- Yoshikazu Suzuki
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer production method
- Patent number 11,948,789
- Issue date Apr 2, 2024
- Sumco Corporation
- Toshiyuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding apparatus
- Patent number 11,904,432
- Issue date Feb 20, 2024
- Disco Corporation
- Satoru Fujimura
- B24 - GRINDING POLISHING
Information Patent Grant
Cover to vacuum debris while grinding
- Patent number 11,872,669
- Issue date Jan 16, 2024
- Disco Corporation
- Toshiyuki Moriya
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing system, substrate processing method and comput...
- Patent number 11,858,092
- Issue date Jan 2, 2024
- Tokyo Electron Limited
- Munehisa Kodama
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding apparatus
- Patent number 11,858,087
- Issue date Jan 2, 2024
- Disco Corporation
- Jiro Genozono
- B24 - GRINDING POLISHING
Information Patent Grant
Workpiece grinding method
- Patent number 11,717,927
- Issue date Aug 8, 2023
- Disco Corporation
- Yoshikazu Suzuki
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding apparatus
- Patent number 11,654,525
- Issue date May 23, 2023
- Disco Corporation
- Jiro Genozono
- B24 - GRINDING POLISHING
Information Patent Grant
Machine for finishing a work piece, and having a highly controllabl...
- Patent number 11,623,319
- Issue date Apr 11, 2023
- II-VI DELAWARE, INC.
- Edward J. Gratrix
- B24 - GRINDING POLISHING
Information Patent Grant
Turbomachine component with surface repair
- Patent number 11,506,058
- Issue date Nov 22, 2022
- General Electric Company
- Andrew Joseph Colletti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grinding wheel and grinding apparatus
- Patent number 11,273,534
- Issue date Mar 15, 2022
- Disco Corporation
- Dejan Pekija
- B24 - GRINDING POLISHING
Information Patent Grant
Method for setting processing device
- Patent number 11,141,830
- Issue date Oct 12, 2021
- Tokyo Seimitsu Co., Ltd.
- Makoto Shimoda
- B24 - GRINDING POLISHING
Information Patent Grant
Elastic membrane, substrate holding device, and polishing apparatus
- Patent number 11,088,011
- Issue date Aug 10, 2021
- Ebara Corporation
- Satoru Yamaki
- B24 - GRINDING POLISHING
Information Patent Grant
Pulley for continuously variable transmission and method of produci...
- Patent number 10,876,615
- Issue date Dec 29, 2020
- Honda Motor Co., Ltd.
- Toru Yagasaki
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing a wafer from a hexagonal single crystal ingot...
- Patent number 10,755,946
- Issue date Aug 25, 2020
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Machine for finishing a work piece, and having a highly controllabl...
- Patent number 10,702,968
- Issue date Jul 7, 2020
- M Cubed Technologies, Inc.
- Edward J. Gratrix
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding apparatus
- Patent number 10,639,764
- Issue date May 5, 2020
- Disco Corporation
- Mamoru Kawana
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grinding wheel and grinding apparatus
- Patent number 10,639,761
- Issue date May 5, 2020
- Disco Corporation
- Xiaoming Qiu
- B24 - GRINDING POLISHING
Information Patent Grant
Friction adjustment mechanisms for optimizing friction between a pa...
- Patent number 10,510,375
- Issue date Dec 17, 2019
- Venmill Industries Incorporated
- William Olszta
- B24 - GRINDING POLISHING
Information Patent Grant
Processing device
- Patent number 10,421,172
- Issue date Sep 24, 2019
- Tokyo Seimitsu Co. Ltd.
- Makoto Shimoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment of turbomachinery
- Patent number 10,384,326
- Issue date Aug 20, 2019
- General Electric Company
- Andrew Joseph Colletti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing hub ring and method for manufacturing vehi...
- Patent number 10,207,537
- Issue date Feb 19, 2019
- JTEKT Corporation
- Kenichi Morita
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Sample carrier and method for processing a sample
- Patent number 10,197,478
- Issue date Feb 5, 2019
- Technische Universitat Berlin
- Sören Selve
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grinding machine
- Patent number 10,173,296
- Issue date Jan 8, 2019
- Tokyo Seimitsu Co., Ltd.
- Masaki Kanazawa
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding wheel and grinding method
- Patent number 10,112,285
- Issue date Oct 30, 2018
- Disco Corporation
- Ryoko Fujiya
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
POLISHING APPARATUS, POLISHING METHOD, AND SEMICONDUCTOR DEVICE MAN...
- Publication number 20240308027
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Takeshi ARAKAWA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING DEVICE FOR DELAYERING
- Publication number 20240246194
- Publication date Jul 25, 2024
- INTEC CORPORATION CO., LTD.
- Heyoung Cheol HEYOUNG
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING APPARATUS
- Publication number 20240217050
- Publication date Jul 4, 2024
- EBARA CORPORATION
- Toshio MIZUNO
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING APPARATUS
- Publication number 20240149393
- Publication date May 9, 2024
- Disco Corporation
- Makoto MAEJIMA
- B24 - GRINDING POLISHING
Information Patent Application
WORKPIECE GRINDING METHOD
- Publication number 20240042575
- Publication date Feb 8, 2024
- Disco Corporation
- Keishi SHINTANI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
- Publication number 20240017375
- Publication date Jan 18, 2024
- TOKYO ELECTRON LIMITED
- Takeshi TAMURA
- B24 - GRINDING POLISHING
Information Patent Application
HIGH-PRECISION SUBSTRATE POLISHING SYSTEM
- Publication number 20230339070
- Publication date Oct 26, 2023
- KCTECH CO., LTD.
- Ki Hyuk YANG
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING APPARATUS
- Publication number 20230330811
- Publication date Oct 19, 2023
- TOKYO ELECTRON LIMITED
- Takayoshi WAKAMATSU
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF PROCESSING WORKPIECE
- Publication number 20230234183
- Publication date Jul 27, 2023
- Disco Corporation
- Daichi SHUTO
- B24 - GRINDING POLISHING
Information Patent Application
MACHINE FOR FINISHING A WORK PIECE, AND HAVING A HIGHLY CONTROLLABL...
- Publication number 20230211453
- Publication date Jul 6, 2023
- II-VI Delaware, Inc.
- Edward J. GRATRIX
- B24 - GRINDING POLISHING
Information Patent Application
Laboratory Disk Grinder, Replacement Grinding Disk and Use of a Gri...
- Publication number 20230182256
- Publication date Jun 15, 2023
- ATM Qness GmbH
- Robert Höll
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF GRINDING WORKPIECE
- Publication number 20230173638
- Publication date Jun 8, 2023
- Disco Corporation
- Makoto SAITO
- B24 - GRINDING POLISHING
Information Patent Application
REMOVING APPARATUS
- Publication number 20230105522
- Publication date Apr 6, 2023
- TOKYO ELECTRON LIMITED
- Takahiro SAKAMOTO
- B24 - GRINDING POLISHING
Information Patent Application
PROBE GRINDING DEVICE BY ACOUSTIC POSITIONING
- Publication number 20230095121
- Publication date Mar 30, 2023
- GLTTEK CO., LTD
- HSUN HAO CHAN
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE GRINDING DEVICE AND SUBSTRATE GRINDING METHOD
- Publication number 20230079520
- Publication date Mar 16, 2023
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Satoru IDE
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS FOR GRINDING SURFACE OF STEEL SHEET
- Publication number 20230070836
- Publication date Mar 9, 2023
- DMS KOREA CO., LTD.
- Won Goo KANG
- B24 - GRINDING POLISHING
Information Patent Application
HARD WAFER GRINDING METHOD
- Publication number 20230025120
- Publication date Jan 26, 2023
- Disco Corporation
- Daisuke AKITA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20220402087
- Publication date Dec 22, 2022
- TOKYO ELECTRON LIMITED
- Nobutaka FUKUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRINDING APPARATUS
- Publication number 20220402093
- Publication date Dec 22, 2022
- Disco Corporation
- Satoru FUJIMURA
- B24 - GRINDING POLISHING
Information Patent Application
WORKPIECE GRINDING METHOD
- Publication number 20220362900
- Publication date Nov 17, 2022
- Disco Corporation
- Yoshikazu SUZUKI
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING METHOD OF WORKPIECE
- Publication number 20220324082
- Publication date Oct 13, 2022
- Disco Corporation
- Yoshikazu SUZUKI
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF GRINDING WORKPIECE
- Publication number 20220314393
- Publication date Oct 6, 2022
- Disco Corporation
- Yoshikazu SUZUKI
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING APPARATUS
- Publication number 20220281063
- Publication date Sep 8, 2022
- Disco Corporation
- Jiro GENOZONO
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING APPARATUS
- Publication number 20220274222
- Publication date Sep 1, 2022
- Disco Corporation
- Yohei WAKABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRINDING METHOD AND GRINDING APPARATUS
- Publication number 20220266419
- Publication date Aug 25, 2022
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Tsubasa BANDO
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING MACHINE
- Publication number 20220143772
- Publication date May 12, 2022
- Disco Corporation
- Toshiyuki MORIYA
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING METHOD OF WORKPIECE
- Publication number 20220134509
- Publication date May 5, 2022
- Disco Corporation
- Daisuke AKITA
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING APPARATUS
- Publication number 20220063051
- Publication date Mar 3, 2022
- Disco Corporation
- Jiro GENOZONO
- B24 - GRINDING POLISHING
Information Patent Application
ELASTIC MEMBRANE, SUBSTRATE HOLDING DEVICE, AND POLISHING APPARATUS
- Publication number 20210335650
- Publication date Oct 28, 2021
- EBARA CORPORATION
- Satoru YAMAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLDING PLATE AND POLISHING METHOD OF SUBSTRATE
- Publication number 20210078131
- Publication date Mar 18, 2021
- Kabushiki Kaisha Toshiba
- Chisato FURUKAWA
- H01 - BASIC ELECTRIC ELEMENTS

involving a rotary work-table

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Machine for finishing a work piece, and having a highly controllabl...

Elastic membrane, substrate holding device, and polishing apparatus

Processing method of workpiece

Textured glass-based articles with multiple haze levels and process...

Planar grinder

Method of grinding workpiece

Wafer production method

Grinding apparatus

Cover to vacuum debris while grinding

Substrate processing system, substrate processing method and comput...

Grinding apparatus

Workpiece grinding method

Grinding apparatus

Machine for finishing a work piece, and having a highly controllabl...

Turbomachine component with surface repair

Grinding wheel and grinding apparatus

Method for setting processing device

Elastic membrane, substrate holding device, and polishing apparatus

Pulley for continuously variable transmission and method of produci...

Method for producing a wafer from a hexagonal single crystal ingot...

Machine for finishing a work piece, and having a highly controllabl...

Grinding apparatus

Grinding wheel and grinding apparatus

Friction adjustment mechanisms for optimizing friction between a pa...

Processing device

Surface treatment of turbomachinery

Method for manufacturing hub ring and method for manufacturing vehi...

Sample carrier and method for processing a sample

Grinding machine

Grinding wheel and grinding method

Patents Applicationslast 30 patents

POLISHING APPARATUS, POLISHING METHOD, AND SEMICONDUCTOR DEVICE MAN...

POLISHING DEVICE FOR DELAYERING

PROCESSING APPARATUS

PROCESSING APPARATUS

WORKPIECE GRINDING METHOD

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

HIGH-PRECISION SUBSTRATE POLISHING SYSTEM

GRINDING APPARATUS

METHOD OF PROCESSING WORKPIECE

MACHINE FOR FINISHING A WORK PIECE, AND HAVING A HIGHLY CONTROLLABL...

Laboratory Disk Grinder, Replacement Grinding Disk and Use of a Gri...

METHOD OF GRINDING WORKPIECE

REMOVING APPARATUS

PROBE GRINDING DEVICE BY ACOUSTIC POSITIONING

SUBSTRATE GRINDING DEVICE AND SUBSTRATE GRINDING METHOD

APPARATUS FOR GRINDING SURFACE OF STEEL SHEET

HARD WAFER GRINDING METHOD

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

GRINDING APPARATUS

WORKPIECE GRINDING METHOD

PROCESSING METHOD OF WORKPIECE

METHOD OF GRINDING WORKPIECE

GRINDING APPARATUS

GRINDING APPARATUS

GRINDING METHOD AND GRINDING APPARATUS

PROCESSING MACHINE

GRINDING METHOD OF WORKPIECE

GRINDING APPARATUS

ELASTIC MEMBRANE, SUBSTRATE HOLDING DEVICE, AND POLISHING APPARATUS

HOLDING PLATE AND POLISHING METHOD OF SUBSTRATE