involving a soldering or an alloying process

Industry

CPC
H01L2021/60007

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60007involving a soldering or an alloying process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Reconstituted substrate for radio frequency applications
- Patent number 12,051,653
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Guan Huei See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fanout integration for stacked silicon package assembly
- Patent number 12,027,493
- Issue date Jul 2, 2024
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing implantable tissue stimulators
- Patent number 12,017,082
- Issue date Jun 25, 2024
- CURONIX LLC
- Graham Patrick Greene
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged memory device with flip chip and wire bond dies
- Patent number 12,021,061
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Rui Yuan
- G11 - INFORMATION STORAGE
Information Patent Grant
High-power die heat sink
- Patent number 11,948,853
- Issue date Apr 2, 2024
- QUALCOMM Technologies Incorporated
- Jose Moreira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power die heat sink with vertical heat path
- Patent number 11,929,299
- Issue date Mar 12, 2024
- QUALCOMM Incorporated
- Jose Moreira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land structure for semiconductor package and method therefor
- Patent number 11,908,779
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a surface-mount integrated circuit package with s...
- Patent number 11,887,864
- Issue date Jan 30, 2024
- Microchip Technology Incorporated
- Wichai Kovitsophon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication methods
- Patent number 11,887,934
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using processing oven
- Patent number 11,850,672
- Issue date Dec 26, 2023
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 11,715,700
- Issue date Aug 1, 2023
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for solder bridging elimination for bulk solder C2S intercon...
- Patent number 11,670,612
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication methods
- Patent number 11,521,935
- Issue date Dec 6, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 11,476,202
- Issue date Oct 18, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using processing oven
- Patent number 11,465,225
- Issue date Oct 11, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reconstituted substrate for radio frequency applications
- Patent number 11,417,605
- Issue date Aug 16, 2022
- Applied Materials, Inc.
- Guan Huei See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 11,398,433
- Issue date Jul 26, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 11,264,333
- Issue date Mar 1, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication methods
- Patent number 11,264,331
- Issue date Mar 1, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 11,171,099
- Issue date Nov 9, 2021
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell edge interconnects
- Patent number 11,043,606
- Issue date Jun 22, 2021
- ZHEJIANG KAIYING NEW MATERIALS CO., LTD.
- Mohamed M. Hilali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land structure for semiconductor package and method therefor
- Patent number 11,018,079
- Issue date May 25, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of surface-mounting three-dimensional package structure ele...
- Patent number 10,763,128
- Issue date Sep 1, 2020
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO, LTD.
- Haishen Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell edge interconnects
- Patent number 10,749,061
- Issue date Aug 18, 2020
- ZHEJIANG KAIYING NEW MATERIALS CO., LTD.
- Mohamed M. Hilali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe bonding device and probe bonding method using the same
- Patent number 10,641,794
- Issue date May 5, 2020
- DAWON NEXVIEW CO., LTD.
- G Jung Nam
- G01 - MEASURING TESTING
Information Patent Grant
Solar cell edge interconnects
- Patent number 10,622,502
- Issue date Apr 14, 2020
- Zhejiang Kaiying New Materials Co., Ltd.
- Mohamed M. Hilali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 10,410,988
- Issue date Sep 10, 2019
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for contactless transfer and soldering of chip...
- Patent number 10,304,709
- Issue date May 28, 2019
- Nederlandse Organisatie voor toegepast-natuurwetenschappelikj onderzoek TNO
- Rob Jacob Hendriks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Weld joint with constant overlap area
- Patent number 10,290,616
- Issue date May 14, 2019
- GALATECH, INC.
- Wenjun Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Land structure for semiconductor package and method therefor
- Patent number 9,911,685
- Issue date Mar 6, 2018
- Amkor Technology, Inc.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
- Publication number 20240194572
- Publication date Jun 13, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyoung Yeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
- Publication number 20240021533
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...
- Publication number 20230352380
- Publication date Nov 2, 2023
- Mitsubishi Electric Corporation
- Yukimasa HAYASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230298984
- Publication date Sep 21, 2023
- Mitsubishi Electric Corporation
- Atsushi MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC...
- Publication number 20230230850
- Publication date Jul 20, 2023
- ams-OSRAM International GmbH
- Karlheinz ARNDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
- Publication number 20230187370
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS
- Publication number 20220359409
- Publication date Nov 10, 2022
- Applied Materials, Inc.
- Guan Huei SEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-POWER DIE HEAT SINK
- Publication number 20220359337
- Publication date Nov 10, 2022
- QUALCOMM TECHNOLOGIES, INC.
- Jose MOREIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SURFACE-MOUNT INTEGRATED CIRCUIT PACKAGE WITH S...
- Publication number 20220344173
- Publication date Oct 27, 2022
- MICROCHIP TECHNOLOGY INCORPORATED
- Wichai Kovitsophon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MEMORY DEVICE WITH FLIP CHIP AND WIRE BOND DIES
- Publication number 20220285316
- Publication date Sep 8, 2022
- Western Digital Technologies, Inc.
- Rui Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED DIE PACKAGE WITH MOLDED INTEGRATED HEAT SPREADER
- Publication number 20220077113
- Publication date Mar 10, 2022
- Intel Corporation
- Jenny Shio Yin ONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single-Shot Encapsulation
- Publication number 20220028813
- Publication date Jan 27, 2022
- SEMTECH CORPORATION
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF
- Publication number 20210335700
- Publication date Oct 28, 2021
- DENSO CORPORATION
- Takao KASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
- Publication number 20210257306
- Publication date Aug 19, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
- Publication number 20210257307
- Publication date Aug 19, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
- Publication number 20210242113
- Publication date Aug 5, 2021
- Amkor Technology Singapore Holding Pte. Ltd
- Kyoung Yeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Solder Bridging Elimination for Bulk Solder C2S Intercon...
- Publication number 20210183802
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- BRANDON P. WIRZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FANOUT INTEGRATION FOR STACKED SILICON PACKAGE ASSEMBLY
- Publication number 20210134757
- Publication date May 6, 2021
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
- Publication number 20200395306
- Publication date Dec 17, 2020
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
- Publication number 20200395305
- Publication date Dec 17, 2020
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
- Publication number 20200395304
- Publication date Dec 17, 2020
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single-Shot Encapsulation
- Publication number 20190355689
- Publication date Nov 21, 2019
- SEMTECH CORPORATION
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF SURFACE-MOUNTING THREE-DIMENSIONAL PACKAGE STRUCTURE ELE...
- Publication number 20190333780
- Publication date Oct 31, 2019
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY., LTD.
- Haishen KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Solder Bridging Elimination for Bulk Solder C2S Intercon...
- Publication number 20190067232
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- BRANDON P. WIRZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE BONDING DEVICE AND PROBE BONDING METHOD USING THE SAME
- Publication number 20180210011
- Publication date Jul 26, 2018
- DAWON NEXVIEW CO.,LTD.
- G Jung NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR CONTACTLESS TRANSFER AND SOLDERING OF CHIP...
- Publication number 20180130683
- Publication date May 10, 2018
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Rob Jacob Hendriks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
- Publication number 20180082932
- Publication date Mar 22, 2018
- Amkor Technology, Inc.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single-Shot Encapsulation
- Publication number 20180047688
- Publication date Feb 15, 2018
- SEMTECH CORPORATION
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED SIDE-WALL AND LGA ASSEMBLY
- Publication number 20170372989
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND METHOD FOR PRODUCING MOUNTING STRUCTURE
- Publication number 20170040184
- Publication date Feb 9, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- HIROHISA HINO
- H01 - BASIC ELECTRIC ELEMENTS

involving a soldering or an alloying process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reconstituted substrate for radio frequency applications

Fanout integration for stacked silicon package assembly

Manufacturing implantable tissue stimulators

Packaged memory device with flip chip and wire bond dies

High-power die heat sink

High-power die heat sink with vertical heat path

Land structure for semiconductor package and method therefor

Method of forming a surface-mount integrated circuit package with s...

Package structure and fabrication methods

Method of using processing oven

Reconstituted substrate structure and fabrication methods for heter...

Method for solder bridging elimination for bulk solder C2S intercon...

Package structure and fabrication methods

Reconstituted substrate structure and fabrication methods for heter...

Method of using processing oven

Reconstituted substrate for radio frequency applications

Reconstituted substrate structure and fabrication methods for heter...

Reconstituted substrate structure and fabrication methods for heter...

Package structure and fabrication methods

Single-shot encapsulation

Solar cell edge interconnects

Land structure for semiconductor package and method therefor

Process of surface-mounting three-dimensional package structure ele...

Solar cell edge interconnects

Probe bonding device and probe bonding method using the same

Solar cell edge interconnects

Single-shot encapsulation

Apparatus and method for contactless transfer and soldering of chip...

Weld joint with constant overlap area

Land structure for semiconductor package and method therefor

Patents Applicationslast 30 patents

LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR

RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC...

PACKAGE STRUCTURE AND FABRICATION METHODS

RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS

HIGH-POWER DIE HEAT SINK

METHOD OF FORMING A SURFACE-MOUNT INTEGRATED CIRCUIT PACKAGE WITH S...

PACKAGED MEMORY DEVICE WITH FLIP CHIP AND WIRE BOND DIES

3D STACKED DIE PACKAGE WITH MOLDED INTEGRATED HEAT SPREADER

Single-Shot Encapsulation

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF

PACKAGE STRUCTURE AND FABRICATION METHODS

RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...

LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR

Method for Solder Bridging Elimination for Bulk Solder C2S Intercon...

FANOUT INTEGRATION FOR STACKED SILICON PACKAGE ASSEMBLY

RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...

RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...

RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...

Single-Shot Encapsulation

PROCESS OF SURFACE-MOUNTING THREE-DIMENSIONAL PACKAGE STRUCTURE ELE...

Method for Solder Bridging Elimination for Bulk Solder C2S Intercon...

PROBE BONDING DEVICE AND PROBE BONDING METHOD USING THE SAME

APPARATUS AND METHOD FOR CONTACTLESS TRANSFER AND SOLDERING OF CHIP...

LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR

Single-Shot Encapsulation

EXPOSED SIDE-WALL AND LGA ASSEMBLY

MOUNTING STRUCTURE AND METHOD FOR PRODUCING MOUNTING STRUCTURE