TREA

involving a temporary auxiliary member not forming part of the bonding apparatus

Follow

Industry

  • CPC
  • H01L2224/84001
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/84001involving a temporary auxiliary member not forming part of the bonding apparatus
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Method for die and clip attachment
    • Patent number 11,289,447
    • Issue date Mar 29, 2022
    • Alpha Assembly Solutions, Inc.
    • Oscar Khaselev
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents