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involving a temporary auxiliary member not forming part of the bonding apparatus
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Industry
CPC
H01L2224/84001
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/84001
involving a temporary auxiliary member not forming part of the bonding apparatus
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last 30 patents
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Patent Grant
Method for die and clip attachment
Patent number
11,289,447
Issue date
Mar 29, 2022
Alpha Assembly Solutions, Inc.
Oscar Khaselev
H01 - BASIC ELECTRIC ELEMENTS