involving a temporary auxiliary member not forming part of the bonding apparatus

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H01L2224/81001

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81001involving a temporary auxiliary member not forming part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,876,053
- Issue date Jan 16, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device having TSV formed through...
- Patent number 11,854,990
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,824,008
- Issue date Nov 21, 2023
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with fan-out structures
- Patent number 11,764,159
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer with opening...
- Patent number 11,688,612
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution layers formed utilizing du...
- Patent number 11,600,582
- Issue date Mar 7, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 11,424,155
- Issue date Aug 23, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with fan-out structures
- Patent number 11,322,449
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package having redistributio...
- Patent number 11,315,802
- Issue date Apr 26, 2022
- Samsung Electronics Co., Ltd.
- Il Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with thinned substrate
- Patent number 11,094,671
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 10,923,429
- Issue date Feb 16, 2021
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked semiconductor chips and method...
- Patent number 10,923,465
- Issue date Feb 16, 2021
- Samsung Electronics Co., Ltd.
- Won-Gi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a 3D IC architecture including forming a first d...
- Patent number 10,923,431
- Issue date Feb 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of semiconductor devices using multiple LED placement cycles
- Patent number 10,878,733
- Issue date Dec 29, 2020
- Facebook Technologies, LLC
- Padraig Hughes
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Methods of fabricating semiconductor packages including reinforceme...
- Patent number 10,770,445
- Issue date Sep 8, 2020
- SK hynix Inc.
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 10,763,216
- Issue date Sep 1, 2020
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Folded semiconductor package architectures and methods of assemblin...
- Patent number 10,734,318
- Issue date Aug 4, 2020
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded-bridge substrate connectors and methods of assembling same
- Patent number 10,727,197
- Issue date Jul 28, 2020
- Intel IP Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 10,714,378
- Issue date Jul 14, 2020
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution layers formed utilizing du...
- Patent number 10,707,181
- Issue date Jul 7, 2020
- Amkor Technology Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with thinned substrate
- Patent number 10,679,968
- Issue date Jun 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having reduced internal power pad pitch
- Patent number 10,672,730
- Issue date Jun 2, 2020
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Picking up irregular semiconductor chips
- Patent number 10,672,638
- Issue date Jun 2, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a re-interconnection layer and metho...
- Patent number 10,658,338
- Issue date May 19, 2020
- TOSHIBA MEMORY CORPORATION
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of forming the same
- Patent number 10,593,658
- Issue date Mar 17, 2020
- PlayNitride Inc.
- Tzu-Yang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 10,510,669
- Issue date Dec 17, 2019
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 10,396,058
- Issue date Aug 27, 2019
- Epistar Corporation
- Min-Hsun Hsieh
- F21 - LIGHTING
Information Patent Grant
Releasable carrier method
- Patent number 10,354,907
- Issue date Jul 16, 2019
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240387393
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH FAN-OUT STRUCTURES
- Publication number 20230378078
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
- Publication number 20230207502
- Publication date Jun 29, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230040553
- Publication date Feb 9, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH FAN-OUT STRUCTURES
- Publication number 20210320069
- Publication date Oct 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Architecture with Interposer or Bonding Dies
- Publication number 20210167018
- Publication date Jun 3, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200343129
- Publication date Oct 29, 2020
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
- Publication number 20200335461
- Publication date Oct 22, 2020
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME
- Publication number 20200328182
- Publication date Oct 15, 2020
- Intel IP Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20200075493
- Publication date Mar 5, 2020
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190326161
- Publication date Oct 24, 2019
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Architecture with Interposer for Bonding Dies
- Publication number 20190273046
- Publication date Sep 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF SEMICONDUCTOR DEVICES
- Publication number 20190027075
- Publication date Jan 24, 2019
- Facebook Technologies, LLC
- Padraig HUGHES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVABLE SACRIFICIAL CONNECTIONS FOR SEMICONDUCTOR DEVICES
- Publication number 20180240719
- Publication date Aug 23, 2018
- Qorvo US, Inc.
- Alexandre Christian Volatier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER LIFT-OFF ON ISOLATED III-NITRIDE LIGHT ISLANDS FOR INTER-SUBS...
- Publication number 20180190633
- Publication date Jul 5, 2018
- GLO AB
- Daniel Bryce THOMPSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20180145031
- Publication date May 24, 2018
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrateless Integrated Circuit Packages and Methods of Forming Same
- Publication number 20180114770
- Publication date Apr 26, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lin-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVABLE SACRIFICIAL CONNECTIONS FOR SEMICONDUCTOR DEVICES
- Publication number 20170256467
- Publication date Sep 7, 2017
- Qorvo US, Inc.
- Alexandre Christian Volatier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY
- Publication number 20160329297
- Publication date Nov 10, 2016
- International Business Machines Corporation
- Thomas E. LOMBARDI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
- Publication number 20160322320
- Publication date Nov 3, 2016
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming Same
- Publication number 20160071816
- Publication date Mar 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lin-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE DEVICE ASSEMBLY
- Publication number 20140376200
- Publication date Dec 25, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OVERLAPPED LEAD TERMINALS
- Publication number 20140361444
- Publication date Dec 11, 2014
- Renesas Electronics Corporation
- Hiroaki NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR HIGH PRECISION MICROELECTRONIC DIE INTEGRATION
- Publication number 20140357020
- Publication date Dec 4, 2014
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER FILM FOR MULTI-CHIP PACKAGING
- Publication number 20140248477
- Publication date Sep 4, 2014
- DEXERIALS CORPORATION
- Akira Ishigami
- B32 - LAYERED PRODUCTS
Information Patent Application
FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY
- Publication number 20140197228
- Publication date Jul 17, 2014
- International Business Machines Corporation
- Thomas E. LOMBARDI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for Metal Bump Die Assembly
- Publication number 20140193952
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And System For A Semiconductor For Device Package With A Die...
- Publication number 20140134804
- Publication date May 15, 2014
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods For Temporary Wafer Molding For Chip-On-Wafer Assembly
- Publication number 20140134800
- Publication date May 15, 2014
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH LEAD-FREE SOLDER
- Publication number 20140070409
- Publication date Mar 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jen LAI
- H01 - BASIC ELECTRIC ELEMENTS

involving a temporary auxiliary member not forming part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package and manufacturing method thereof

Multi-chip package and method of providing die-to-die interconnects...

Multi-chip package and method of providing die-to-die interconnects...

Method for forming a semiconductor device having TSV formed through...

Multi-chip package and method of providing die-to-die interconnects...

Package with fan-out structures

Semiconductor device and method of forming interposer with opening...

Semiconductor device with redistribution layers formed utilizing du...

Semiconductor device package and manufacturing method thereof

Package with fan-out structures

Method for manufacturing semiconductor package having redistributio...

Package with thinned substrate

Multi-chip package and method of providing die-to-die interconnects...

Semiconductor device having stacked semiconductor chips and method...

Method for forming a 3D IC architecture including forming a first d...

Assembly of semiconductor devices using multiple LED placement cycles

Methods of fabricating semiconductor packages including reinforceme...

Multi-chip package and method of providing die-to-die interconnects...

Folded semiconductor package architectures and methods of assemblin...

Embedded-bridge substrate connectors and methods of assembling same

Semiconductor device package and manufacturing method thereof

Semiconductor device with redistribution layers formed utilizing du...

Package with thinned substrate

Semiconductor package having reduced internal power pad pitch

Picking up irregular semiconductor chips

Semiconductor device including a re-interconnection layer and metho...

Light emitting device and method of forming the same

Multi-chip package and method of providing die-to-die interconnects...

Light-emitting device

Releasable carrier method

Patents Applicationslast 30 patents

Method for Forming a Semiconductor Device Having TSV Formed Through...

PACKAGE WITH FAN-OUT STRUCTURES

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE WITH FAN-OUT STRUCTURES

3DIC Architecture with Interposer or Bonding Dies

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...

EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

3DIC Architecture with Interposer for Bonding Dies

ASSEMBLY OF SEMICONDUCTOR DEVICES

REMOVABLE SACRIFICIAL CONNECTIONS FOR SEMICONDUCTOR DEVICES

LASER LIFT-OFF ON ISOLATED III-NITRIDE LIGHT ISLANDS FOR INTER-SUBS...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

Substrateless Integrated Circuit Packages and Methods of Forming Same

REMOVABLE SACRIFICIAL CONNECTIONS FOR SEMICONDUCTOR DEVICES

FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY

TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS

Integrated Circuit Packages and Methods of Forming Same

RELIABLE DEVICE ASSEMBLY

SEMICONDUCTOR DEVICE WITH OVERLAPPED LEAD TERMINALS

METHODS FOR HIGH PRECISION MICROELECTRONIC DIE INTEGRATION

BUFFER FILM FOR MULTI-CHIP PACKAGING

FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY

Methods for Metal Bump Die Assembly

Method And System For A Semiconductor For Device Package With A Die...

Methods For Temporary Wafer Molding For Chip-On-Wafer Assembly

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH LEAD-FREE SOLDER