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involving a temporary auxiliary member not forming part of the bonding apparatus
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H01L2224/95001
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/95001
involving a temporary auxiliary member not forming part of the bonding apparatus
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last 30 patents
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Patent Grant
Display apparatus and manufacturing method thereof
Patent number
11,948,928
Issue date
Apr 2, 2024
Au Optronics Corporation
Yang-En Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,923,315
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chung-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Electronic device
Patent number
11,916,059
Issue date
Feb 27, 2024
Infineon Technologies AG
Andre Schmenn
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Stretchable display module and manufacturing method thereof
Patent number
11,916,052
Issue date
Feb 27, 2024
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
Li Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package with high density interconnects
Patent number
11,908,802
Issue date
Feb 20, 2024
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for manufacturing a wafer level chip scale package (WLCSP)
Patent number
11,908,831
Issue date
Feb 20, 2024
STMicroelectronics Pte Ltd
Chun Yi Teng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Micro device arrangement in donor substrate
Patent number
11,892,497
Issue date
Feb 6, 2024
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,881,471
Issue date
Jan 23, 2024
Amkor Technology Singapore Holding Pte Ltd.
Ronald Huemoeller
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure
Patent number
11,874,513
Issue date
Jan 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Lun Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Micro-transfer printing with selective component removal
Patent number
11,854,855
Issue date
Dec 26, 2023
X Display Company Technology Limited
Erich Radauscher
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for manufacturing electronic device
Patent number
11,848,215
Issue date
Dec 19, 2023
Mitsui Chemicals Tohcello, Inc.
Kouji Igarashi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device package and a method of manufacturing the same
Patent number
11,837,557
Issue date
Dec 5, 2023
Advanced Semiconductor Engineering, Inc.
Peng Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,824,017
Issue date
Nov 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Kang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Device coupon and method of fabrication thereof
Patent number
11,808,979
Issue date
Nov 7, 2023
Rockley Photonics Limited
Guomin Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Methods and structures for die-to-die bonding
Patent number
11,798,914
Issue date
Oct 24, 2023
Yangtze Memory Technologies Co., Ltd.
Jun Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging structure
Patent number
11,791,310
Issue date
Oct 17, 2023
TONGFU MICROELECTRONICS CO., LTD.
Lei Shi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Mass transfer device and mass transfer method
Patent number
11,784,159
Issue date
Oct 10, 2023
CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
Jan-hsiang Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Stacking structure, package structure and method of fabricating the...
Patent number
11,784,163
Issue date
Oct 10, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Supporting InFO packages to reduce warpage
Patent number
11,764,165
Issue date
Sep 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated devices in semiconductor packages and methods of forming...
Patent number
11,749,626
Issue date
Sep 5, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Wafer reconstitution and die-stitching
Patent number
11,735,567
Issue date
Aug 22, 2023
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,735,545
Issue date
Aug 22, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,735,547
Issue date
Aug 22, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
High registration particles-transferring system
Patent number
11,732,362
Issue date
Aug 22, 2023
Xerox Corporation
Yunda Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,735,546
Issue date
Aug 22, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,728,302
Issue date
Aug 15, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,728,306
Issue date
Aug 15, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Light emitting device and fluidic manufacture thereof
Patent number
11,721,792
Issue date
Aug 8, 2023
eLux Inc.
Kenji Alexander Sasaki
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Wafer level chip scale semiconductor package
Patent number
11,721,665
Issue date
Aug 8, 2023
ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
Yan Xun Xue
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and method of fabricating the same
Patent number
11,721,679
Issue date
Aug 8, 2023
Samsung Electronics Co., Ltd.
Yanggyoo Jung
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
Publication number
20240136297
Publication date
Apr 25, 2024
Institute of Semiconductors, Guangdong Academy of Sciences
Yingqiang YAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE
Publication number
20240133940
Publication date
Apr 25, 2024
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Semiconductor Package and Method of Manufacturing the Same
Publication number
20240128157
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chin-Chuan Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20240128206
Publication date
Apr 18, 2024
Advanced Semiconductor Engineering, Inc.
Peng YANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
Publication number
20240128208
Publication date
Apr 18, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
Publication number
20240128227
Publication date
Apr 18, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Perceval COUDRAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240113089
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tian Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates with...
Publication number
20240105630
Publication date
Mar 28, 2024
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE
Publication number
20240096771
Publication date
Mar 21, 2024
TEXAS INSTRUMENTS INCORPORATED
Osvaldo Lopez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240079356
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...
Publication number
20240071998
Publication date
Feb 29, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Li-Hsien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TWO-PIECE TYPE STIFFENER STRUCTURE WITH BEVELED SURFACE FOR DELAMIN...
Publication number
20240071949
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Company Limited
Chia-Kuei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING DISPLAY PANEL
Publication number
20240072027
Publication date
Feb 29, 2024
SAMSUNG DISPLAY CO., LTD.
Jeong Won HAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
Publication number
20240063208
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Tsung-Yen Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SPACER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES
Publication number
20240055366
Publication date
Feb 15, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF DISPLAY PANEL, AND DETECTION AND BONDING AP...
Publication number
20240047280
Publication date
Feb 8, 2024
TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) CO., LTD.
Kerui XI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20240047301
Publication date
Feb 8, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Sang Hyoun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
Publication number
20240047389
Publication date
Feb 8, 2024
Samsung Electronics Co., Ltd.
Hyeonmin Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
Publication number
20240047446
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240030121
Publication date
Jan 25, 2024
Powertech Technology Inc.
Shang-Yu Chang Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240030183
Publication date
Jan 25, 2024
Resonac Corporation
Hiroaki MATSUBARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF
Publication number
20240021558
Publication date
Jan 18, 2024
Powertech Technology Inc.
Shang-Yu CHANG-CHIEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CURABLE RESIN FILM, FILM MATERIAL FOR SEMICONDUCTOR DEVICE PRODUCTI...
Publication number
20240021443
Publication date
Jan 18, 2024
Resonac Corporation
Shogo SOBUE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
Publication number
20240014178
Publication date
Jan 11, 2024
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Bonding Structure with Stress Buffer Zone and Method of Forming Same
Publication number
20240006352
Publication date
Jan 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
SyuFong LI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
Publication number
20230420352
Publication date
Dec 28, 2023
Samsung Electronics Co., Ltd.
Yeongbeom KO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MICRO CHIP AND DISPLAY APPARATUS INCLUDING THE SAME
Publication number
20230402439
Publication date
Dec 14, 2023
Samsung Electronics Co., Ltd.
Kyungwook Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230395452
Publication date
Dec 7, 2023
InnoLux Corporation
Cheng-Chi WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230378098
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Kang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH REGISTRATION PARTICLES-TRANSFERRING SYSTEM
Publication number
20230366093
Publication date
Nov 16, 2023
Xerox Corporation
Yunda Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY