involving a temporary auxiliary member not forming part of the bonding apparatus

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H01L2224/95001

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/95001involving a temporary auxiliary member not forming part of the bonding apparatus

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for laser drilling process for an integrated circuit package
- Patent number 12,368,053
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Shen Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Supporting InFO packages to reduce warpage
- Patent number 12,368,115
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Basin-shaped underbump plates and methods of forming the same
- Patent number 12,362,299
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing display device using semiconductor light em...
- Patent number 12,328,979
- Issue date Jun 10, 2025
- LG Electronics Inc.
- Mihee Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 12,322,730
- Issue date Jun 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High registration particles-transferring system
- Patent number 12,297,538
- Issue date May 13, 2025
- Xerox Corporation
- Yunda Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming chip packages and a chip package
- Patent number 12,293,986
- Issue date May 6, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package including sub-interpose...
- Patent number 12,278,222
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device and display device manufact...
- Patent number 12,278,223
- Issue date Apr 15, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Yosuke Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 12,272,671
- Issue date Apr 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 12,272,674
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process and package structure
- Patent number 12,266,632
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer warpage regulation epoxy functional film, and preparation met...
- Patent number 12,255,175
- Issue date Mar 18, 2025
- Wuhan Sanxuan Technology Co., Ltd
- De Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Substrate for manufacturing display device and method for manufactu...
- Patent number 12,243,759
- Issue date Mar 4, 2025
- LG Electronics Inc.
- Kisu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device
- Patent number 12,230,558
- Issue date Feb 18, 2025
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnecting method, interconnect device and method for for...
- Patent number 12,224,267
- Issue date Feb 11, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light-emitting diode display panel and manufacturing method t...
- Patent number 12,224,274
- Issue date Feb 11, 2025
- BOE Technology Group Co., Ltd.
- Yuju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method therefor
- Patent number 12,224,384
- Issue date Feb 11, 2025
- Samsung Display Co., Ltd.
- Moon Jung An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with high density interconnects
- Patent number 12,218,069
- Issue date Feb 4, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Method of producing a multi-chip assembly
- Patent number 12,191,296
- Issue date Jan 7, 2025
- Infineon Technologies AG
- Ling Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for manufacturing a semiconductor package structure
- Patent number 12,183,712
- Issue date Dec 31, 2024
- Advanced Semiconductor Engineering, Inc.
- Che-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,183,866
- Issue date Dec 31, 2024
- LG Electronics Inc.
- Hwanjoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly board for use in a display manufacturing method
- Patent number 12,176,225
- Issue date Dec 24, 2024
- LG Electronics Inc.
- Changhyun Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing die attach film, and semiconductor package using the same an...
- Patent number 12,176,314
- Issue date Dec 24, 2024
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 12,148,733
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless architecture and processing strategy for EMIB-based substr...
- Patent number 12,142,567
- Issue date Nov 12, 2024
- Intel Corporation
- Xiao Di Sun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package
- Patent number 12,132,074
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250239569
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250210440
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Minjung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE...
- Publication number 20250210400
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Taehoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
- Publication number 20250192080
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20250192086
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED ARRAY ELECTRONIC DEVICE AND ITS TRANSFER METHOD
- Publication number 20250176343
- Publication date May 29, 2025
- Seoul National University R&DB Foundation
- Yong Taek HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20250176105
- Publication date May 29, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20250167171
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRATED ANTENNAS AND A METHOD FOR FORMIN...
- Publication number 20250167168
- Publication date May 22, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20250167172
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...
- Publication number 20250167065
- Publication date May 22, 2025
- SK HYNIX INC.
- Jun Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE DEVICE
- Publication number 20250157904
- Publication date May 15, 2025
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20250157991
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Manufacturing Display Device and Display Device Manufact...
- Publication number 20250158000
- Publication date May 15, 2025
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Yosuke TSUKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250149491
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...
- Publication number 20250132286
- Publication date Apr 24, 2025
- Yibu Semiconductor Co., Ltd.
- Wenqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132214
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGING BODY
- Publication number 20250125306
- Publication date Apr 17, 2025
- SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.
- Shijie ZHONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS
- Publication number 20250125275
- Publication date Apr 17, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20250118574
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTUR...
- Publication number 20250112195
- Publication date Apr 3, 2025
- EPISTAR CORPORATION
- Wen-Chien WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250096060
- Publication date Mar 20, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER WARPAGE REGULATION EPOXY FUNCTIONAL FILM, AND PREPARATION MET...
- Publication number 20250087630
- Publication date Mar 13, 2025
- Wuhan Sanxuan Technology Co., Ltd
- De WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Device and Method of Making Face-Up Wafer-Level Packa...
- Publication number 20250079380
- Publication date Mar 6, 2025
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING TAPE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING...
- Publication number 20250079225
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Hajung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING FAN-OUT PACKAGE
- Publication number 20250079427
- Publication date Mar 6, 2025
- Yibu Semiconductor Co., Ltd.
- Wenqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20250062217
- Publication date Feb 20, 2025
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY US...
- Publication number 20250062152
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Hyungjun Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MICRODEVICE CARTRIDGE STRUCTURE
- Publication number 20250046752
- Publication date Feb 6, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS

involving a temporary auxiliary member not forming part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for laser drilling process for an integrated circuit package

Supporting InFO packages to reduce warpage

Basin-shaped underbump plates and methods of forming the same

Method of manufacturing display device using semiconductor light em...

Wafer reconstitution and die-stitching

High registration particles-transferring system

Method for forming chip packages and a chip package

Method of fabricating semiconductor package including sub-interpose...

Method for manufacturing display device and display device manufact...

Semiconductor device package and method for manufacturing the same

Stacking structure, package structure and method of fabricating the...

Integrated devices in semiconductor packages and methods of forming...

Package process and package structure

Wafer warpage regulation epoxy functional film, and preparation met...

Substrate for manufacturing display device and method for manufactu...

Package device

Chip interconnecting method, interconnect device and method for for...

Micro light-emitting diode display panel and manufacturing method t...

Display device and manufacturing method therefor

Multi-chip package with high density interconnects

Selective micro device transfer to receiver substrate

Method of producing a multi-chip assembly

Method and system for manufacturing a semiconductor package structure

Display device using micro LED, and manufacturing method therefor

Assembly board for use in a display manufacturing method

Dicing die attach film, and semiconductor package using the same an...

Single-shot encapsulation

Shift control method in manufacture of semiconductor device

Coreless architecture and processing strategy for EMIB-based substr...

Package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE...

Integrated Devices in Semiconductor Packages and Methods of Forming...

CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

MICRO LED ARRAY ELECTRONIC DEVICE AND ITS TRANSFER METHOD

SELECTIVE TRANSFER OF MICRO DEVICES

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

ELECTRONIC PACKAGE WITH INTEGRATED ANTENNAS AND A METHOD FOR FORMIN...

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...

MANUFACTURING METHOD OF PACKAGE DEVICE

WAFER RECONSTITUTION AND DIE-STITCHING

Method For Manufacturing Display Device and Display Device Manufact...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGING METHOD AND PACKAGING BODY

MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTUR...

INTEGRATED CIRCUIT DEVICE

WAFER WARPAGE REGULATION EPOXY FUNCTIONAL FILM, AND PREPARATION MET...

Semiconductor Device and Method of Making Face-Up Wafer-Level Packa...

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

DICING TAPE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING...

METHOD FOR FABRICATING FAN-OUT PACKAGE

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

DICING FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY US...

MICRODEVICE CARTRIDGE STRUCTURE