involving forming a eutectic alloy at the bonding interface

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H01L2224/80805

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80805involving forming a eutectic alloy at the bonding interface

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Guide apparatus for transferring light-emitting devices onto a subs...
- Patent number 12,040,208
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Myunghee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method thereof
- Patent number 12,015,001
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Chuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a connection between component parts, and comp...
- Patent number 11,961,820
- Issue date Apr 16, 2024
- OSRAM OLED GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing the same
- Patent number 11,894,335
- Issue date Feb 6, 2024
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,843,085
- Issue date Dec 12, 2023
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 11,545,606
- Issue date Jan 3, 2023
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
- Patent number 11,393,967
- Issue date Jul 19, 2022
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Anhe He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 11,063,195
- Issue date Jul 13, 2021
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS devices and methods of forming the same
- Patent number 10,981,779
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
- Patent number 10,916,688
- Issue date Feb 9, 2021
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Anhe He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,910,341
- Issue date Feb 2, 2021
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 10,818,622
- Issue date Oct 27, 2020
- VueReal Inc.
- Gholamreza Chaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
MEMS devices and methods of forming the same
- Patent number 9,926,190
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 9,806,062
- Issue date Oct 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser structure
- Patent number 9,653,382
- Issue date May 16, 2017
- Industrial Technology Research Institute
- Jui-Ying Lin
- G02 - OPTICS
Information Patent Grant
Sealing structure for a bonded wafer and method of forming the seal...
- Patent number 9,653,312
- Issue date May 16, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yuankun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical coupling module
- Patent number 9,613,886
- Issue date Apr 4, 2017
- Industrial Technology Research Institute
- Jui-Ying Lin
- G02 - OPTICS
Information Patent Grant
Wafer to wafer bonding process and structures
- Patent number 9,613,926
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded processed semiconductor structures and carriers
- Patent number 9,553,014
- Issue date Jan 24, 2017
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 9,406,650
- Issue date Aug 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, method of fabricating the same, and application the same
- Patent number 9,252,079
- Issue date Feb 2, 2016
- Industrial Technology Research Institute
- Yao-Jun Tsai
- G02 - OPTICS
Information Patent Grant
Bonded processed semiconductor structures and carriers
- Patent number 9,041,214
- Issue date May 26, 2015
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding of chips on wafers
- Patent number 8,927,335
- Issue date Jan 6, 2015
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using backside passive elements for multilevel 3D wafers alignment...
- Patent number 8,921,976
- Issue date Dec 30, 2014
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit structures and hybrid bonding...
- Patent number 8,809,123
- Issue date Aug 19, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic level bonding for electronics packaging
- Patent number 8,754,512
- Issue date Jun 17, 2014
- Delphi Technologies, Inc.
- Ralph S. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS pressure sensor device and manufacturing method thereof
- Patent number 8,590,389
- Issue date Nov 26, 2013
- Metrodyne Microsystems Corporation, R.O.C.
- Chin-Fu Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20240304580
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING DISPLAY PANEL
- Publication number 20240072027
- Publication date Feb 29, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jeong Won HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240072230
- Publication date Feb 29, 2024
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, METHOD OF MANUFACTURING DISPLAY PANEL, AND DISPLAY D...
- Publication number 20240038697
- Publication date Feb 1, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Jinming Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20230299028
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS...
- Publication number 20230275076
- Publication date Aug 31, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20230253350
- Publication date Aug 10, 2023
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20230088776
- Publication date Mar 23, 2023
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUIDE APPARATUS FOR TRANSFERRING LIGHT-EMITTING DEVICES ONTO A SUBS...
- Publication number 20220384231
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Myunghee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package on Package Structure, Packaging Method Thereof, and El...
- Publication number 20220262751
- Publication date Aug 18, 2022
- Huawei Technologies Co., Ltd
- Tonglong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210398939
- Publication date Dec 23, 2021
- Japan Display Inc.
- Kazuyuki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210313501
- Publication date Oct 7, 2021
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210296551
- Publication date Sep 23, 2021
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20210126176
- Publication date Apr 29, 2021
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20210020593
- Publication date Jan 21, 2021
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...
- Publication number 20200335429
- Publication date Oct 22, 2020
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Junichi OKAUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20200313059
- Publication date Oct 1, 2020
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Connection Between Component Parts, and Comp...
- Publication number 20200294962
- Publication date Sep 17, 2020
- OSRAM OLED GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20190148321
- Publication date May 16, 2019
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS Devices and Methods of Forming the Same
- Publication number 20180194618
- Publication date Jul 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods of Packaging Semiconductor Devices and Packaged Semiconduct...
- Publication number 20160329302
- Publication date Nov 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Packaging Semiconductor Devices and Packaged Semiconduct...
- Publication number 20150221611
- Publication date Aug 6, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LEVEL BONDING FOR ELECTRONICS PACKAGING
- Publication number 20140151864
- Publication date Jun 5, 2014
- Delphi Technologies, Inc.
- Ralph S. TAYLOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional Integrated Circuit Structures and Hybrid Bonding...
- Publication number 20130320556
- Publication date Dec 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED PROCESSED SEMICONDUCTOR STRUCTURES AND CARRIERS
- Publication number 20130256907
- Publication date Oct 3, 2013
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS PRESSURE SENSOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130205908
- Publication date Aug 15, 2013
- Metrodyne Microsystem Corporation, R.O.C.
- Chin-Fu Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
USING BACKSIDE PASSIVE ELEMENTS FOR MULTILEVEL 3D WAFERS ALIGNMENT...
- Publication number 20120187530
- Publication date Jul 26, 2012
- International Business Machines Corporation
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING OF CHIPS ON WAFERS
- Publication number 20120184069
- Publication date Jul 19, 2012
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY SEMICONDUCTOR STRUCTURE BONDING METHODS AND RELATED BONDE...
- Publication number 20120013013
- Publication date Jan 19, 2012
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS

involving forming a eutectic alloy at the bonding interface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Guide apparatus for transferring light-emitting devices onto a subs...

Integration and bonding of micro-devices into system substrate

Bonding structure and method thereof

Method for producing a connection between component parts, and comp...

Display device and method for manufacturing the same

Bonding process with inhibited oxide formation

Electronic device

Electronic device and method for manufacturing the same

Bonding process with inhibited oxide formation

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

Electronic device and method for manufacturing the same

MEMS devices and methods of forming the same

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

Bonding process with inhibited oxide formation

Integration and bonding of micro-devices into system substrate

MEMS devices and methods of forming the same

Methods of packaging semiconductor devices and packaged semiconduct...

Semiconductor laser structure

Sealing structure for a bonded wafer and method of forming the seal...

Optical coupling module

Wafer to wafer bonding process and structures

Bonded processed semiconductor structures and carriers

Methods of packaging semiconductor devices and packaged semiconduct...

Substrate, method of fabricating the same, and application the same

Bonded processed semiconductor structures and carriers

Method for bonding of chips on wafers

Using backside passive elements for multilevel 3D wafers alignment...

Three dimensional integrated circuit structures and hybrid bonding...

Atomic level bonding for electronics packaging

MEMS pressure sensor device and manufacturing method thereof

Patents Applicationslast 30 patents

BONDING STRUCTURE AND METHOD THEREOF

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

METHOD OF FABRICATING DISPLAY PANEL

ELECTRONIC DEVICE

DISPLAY PANEL, METHOD OF MANUFACTURING DISPLAY PANEL, AND DISPLAY D...

BONDING STRUCTURE AND METHOD THEREOF

DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS...

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

GUIDE APPARATUS FOR TRANSFERRING LIGHT-EMITTING DEVICES ONTO A SUBS...

Chip Package on Package Structure, Packaging Method Thereof, and El...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

Method for Producing a Connection Between Component Parts, and Comp...

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

MEMS Devices and Methods of Forming the Same

Methods of Packaging Semiconductor Devices and Packaged Semiconduct...

Methods of Packaging Semiconductor Devices and Packaged Semiconduct...

ATOMIC LEVEL BONDING FOR ELECTRONICS PACKAGING

Three Dimensional Integrated Circuit Structures and Hybrid Bonding...

BONDED PROCESSED SEMICONDUCTOR STRUCTURES AND CARRIERS

MEMS PRESSURE SENSOR DEVICE AND MANUFACTURING METHOD THEREOF

USING BACKSIDE PASSIVE ELEMENTS FOR MULTILEVEL 3D WAFERS ALIGNMENT...

METHOD FOR BONDING OF CHIPS ON WAFERS

TEMPORARY SEMICONDUCTOR STRUCTURE BONDING METHODS AND RELATED BONDE...