involving forming an intermetallic compound at the bonding interface

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CPC
H01L2224/8281

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8281involving forming an intermetallic compound at the bonding interface

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Fan out structure for light-emitting diode (LED) device and lightin...
- Patent number 11,631,594
- Issue date Apr 18, 2023
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out structure for light-emitting diode (LED) device and lightin...
- Patent number 11,621,173
- Issue date Apr 4, 2023
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making multi-die package with bridge layer
- Patent number 10,643,861
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remapped packaged extracted die with 3D printed bond connections
- Patent number 10,147,660
- Issue date Dec 4, 2018
- Global Circuits Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed hermetic package assembly and method
- Patent number 10,128,161
- Issue date Nov 13, 2018
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for printing integrated circuit bond connections
- Patent number 9,935,028
- Issue date Apr 3, 2018
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with printed bond connections
- Patent number 9,824,948
- Issue date Nov 21, 2017
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer and method for making the same
- Patent number 9,640,521
- Issue date May 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for metalizing blind vias
- Patent number 9,003,654
- Issue date Apr 14, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Fabrice Jacquet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for filling a contact hole in a chip package arrangement an...
- Patent number 8,728,873
- Issue date May 20, 2014
- Infineon Technologies AG
- Benjamin Alles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package unit and stacking structure thereof
- Patent number 8,502,378
- Issue date Aug 6, 2013
- Industrial Technology Research Institute
- Yin-Po Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a low temperature metal bond for use in the trans...
- Patent number 6,335,263
- Issue date Jan 1, 2002
- The Regents of the University of California
- Nathan W. Cheung
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140284795
- Publication date Sep 25, 2014
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for printing integrated circuit bond connections
- Publication number 20140252584
- Publication date Sep 11, 2014
- GLOBAL CIRCUIT INNOVATIONS INCORPORATED
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE UNIT AND STACKING STRUCTURE THEREOF
- Publication number 20120091581
- Publication date Apr 19, 2012
- Industrial Technology Research Institute
- Yin-Po Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for filling a contact hole in a chip package arrangement an...
- Publication number 20120061845
- Publication date Mar 15, 2012
- INFINEON TECHNOLOGIES AG
- Benjamin Alles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR METALIZING BLIND VIAS
- Publication number 20110219612
- Publication date Sep 15, 2011
- Comm. á I'éner. atom. et aux énergies alter.
- Fabrice JACQUET
- H01 - BASIC ELECTRIC ELEMENTS

involving forming an intermetallic compound at the bonding interface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fan out structure for light-emitting diode (LED) device and lightin...

Fan out structure for light-emitting diode (LED) device and lightin...

Multi-die package with bridge layer

Methods for making multi-die package with bridge layer

Remapped packaged extracted die with 3D printed bond connections

3D printed hermetic package assembly and method

Method and apparatus for printing integrated circuit bond connections

Integrated circuit with printed bond connections

Multi-die package with bridge layer and method for making the same

Method for metalizing blind vias

Methods for filling a contact hole in a chip package arrangement an...

Package unit and stacking structure thereof

Method of forming a low temperature metal bond for use in the trans...

Patents Applicationslast 30 patents

Methods for Making Multi-Die Package With Bridge Layer

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Method and apparatus for printing integrated circuit bond connections

PACKAGE UNIT AND STACKING STRUCTURE THEREOF

Methods for filling a contact hole in a chip package arrangement an...

METHOD FOR METALIZING BLIND VIAS