involving forming an intermetallic compound at the bonding interface

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H01L2224/8081

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8081involving forming an intermetallic compound at the bonding interface

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Patents Grantslast 30 patents

Information Patent Grant
Printed structure with electrical contact having reflowable polymer...
- Patent number 12,170,349
- Issue date Dec 17, 2024
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid pocket post and tailored via dielectric for 3D-integrated el...
- Patent number 12,002,773
- Issue date Jun 4, 2024
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,984,417
- Issue date May 14, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring electronic device
- Patent number 11,973,054
- Issue date Apr 30, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and manufacturing method thereof
- Patent number 11,948,928
- Issue date Apr 2, 2024
- Au Optronics Corporation
- Yang-En Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for electrically connecting printed horizont...
- Patent number 11,916,179
- Issue date Feb 27, 2024
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bond pad structure
- Patent number 11,804,473
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 11,699,648
- Issue date Jul 11, 2023
- Tahoe Research, LTD.
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with through substrate via (TSV)
- Patent number 11,658,172
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding region of a carrier of light emitting package and manu...
- Patent number 11,456,405
- Issue date Sep 27, 2022
- Lite-On Opto Technology (Changzhou) Co., Ltd.
- Chen-Hsiu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,444,020
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid interconnect for laser bonding using nanoporous metal tips
- Patent number 11,424,214
- Issue date Aug 23, 2022
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire bonding interconnect for fine-pitch microelectronics
- Patent number 11,387,202
- Issue date Jul 12, 2022
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring a plurality of micro light emitting diodes t...
- Patent number 11,387,212
- Issue date Jul 12, 2022
- BOE Technology Group Co., Ltd.
- Guan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bump formation process
- Patent number 11,348,889
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,335,656
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed structures with electrical contact having reflowable polyme...
- Patent number 11,316,086
- Issue date Apr 26, 2022
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 11,309,239
- Issue date Apr 19, 2022
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with a particle roughened surface
- Patent number 11,062,982
- Issue date Jul 13, 2021
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bond pad structure
- Patent number 11,024,602
- Issue date Jun 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device production method
- Patent number 10,998,283
- Issue date May 4, 2021
- TOSHIBA MEMORY CORPORATION
- Takahiko Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process for separating logic and memory array
- Patent number 10,930,607
- Issue date Feb 23, 2021
- Western Digital Technologies, Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 10,854,541
- Issue date Dec 1, 2020
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 10,784,219
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 10,622,302
- Issue date Apr 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package to die connection system and method therefor
- Patent number 10,566,268
- Issue date Feb 18, 2020
- NXP USA, INC.
- Mark Douglas Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process for separating logic and memory array
- Patent number 10,522,489
- Issue date Dec 31, 2019
- Western Digital Technologies, Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bump formation process
- Patent number 10,522,491
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20240395766
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240363566
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FOR SEMICONDUCTOR DEVICE CONNECTION
- Publication number 20240250020
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20240213209
- Publication date Jun 27, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240063159
- Publication date Feb 22, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS
- Publication number 20230352437
- Publication date Nov 2, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE IC DIE PACKAGE INCLUDING AN ELECTRO-THERMO-MECHANICAL DIE...
- Publication number 20230207471
- Publication date Jun 29, 2023
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
- Publication number 20230105341
- Publication date Apr 6, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230005849
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via for Semiconductor Device Connection and Methods of Forming the...
- Publication number 20220359377
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20220359455
- Publication date Nov 10, 2022
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20220278063
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20220254766
- Publication date Aug 11, 2022
- AU OPTRONICS CORPORATION
- Yang-En Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS
- Publication number 20220199515
- Publication date Jun 23, 2022
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING A PLURALITY OF MICRO LIGHT EMITTING DIODES T...
- Publication number 20210335752
- Publication date Oct 28, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Guan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING PACKAGE, AND MANUFACTURING METHOD THEREOF, AND CARRIER
- Publication number 20210074896
- Publication date Mar 11, 2021
- LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD.
- CHEN-HSIU LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS
- Publication number 20210035901
- Publication date Feb 4, 2021
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20210005561
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
- Publication number 20200279821
- Publication date Sep 3, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PROCESS FOR SEPARATING LOGIC AND MEMORY ARRAY
- Publication number 20200126936
- Publication date Apr 23, 2020
- Western Digital Technologies, Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Bump Formation Process
- Publication number 20200126937
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH A PARTICLE ROUGHENED SURFACE
- Publication number 20200083149
- Publication date Mar 12, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PRODUCTION METHOD
- Publication number 20200035636
- Publication date Jan 30, 2020
- Toshiba Memory Corporation
- Takahiro KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH THROUGH SUBSTRATE VIA (TSV)
- Publication number 20200027868
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PROCESS FOR SEPARATING LOGIC AND MEMORY ARRAY
- Publication number 20200006268
- Publication date Jan 2, 2020
- Western Digital Technologies, Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS
- Publication number 20190393145
- Publication date Dec 26, 2019
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via for Semiconductor Device Connection and Methods of Forming the...
- Publication number 20190252312
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ASSEMBLY WITH SPACER ELEMENT
- Publication number 20190206821
- Publication date Jul 4, 2019
- Intel Corporation
- Huxiao XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH A PARTICLE ROUGHENED SURFACE
- Publication number 20190157195
- Publication date May 23, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH THROUGH SUBSTRATE VIA (TSV)
- Publication number 20180286846
- Publication date Oct 4, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS

involving forming an intermetallic compound at the bonding interface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed structure with electrical contact having reflowable polymer...

Hybrid pocket post and tailored via dielectric for 3D-integrated el...

Semiconductor structure and manufacturing method thereof

Method for transferring electronic device

Via for semiconductor device connection and methods of forming the...

Display apparatus and manufacturing method thereof

Semiconductor device and method of manufacturing

Structures and methods for electrically connecting printed horizont...

Hybrid bond pad structure

Electromigration resistant and profile consistent contact arrays

Hybrid bonding with through substrate via (TSV)

Chip bonding region of a carrier of light emitting package and manu...

Via for semiconductor device connection and methods of forming the...

Hybrid interconnect for laser bonding using nanoporous metal tips

Nanowire bonding interconnect for fine-pitch microelectronics

Method of transferring a plurality of micro light emitting diodes t...

Semiconductor device and bump formation process

Semiconductor device and method of manufacturing

Printed structures with electrical contact having reflowable polyme...

Electromigration resistant and profile consistent contact arrays

Packaged semiconductor device with a particle roughened surface

Hybrid bond pad structure

Semiconductor device production method

Manufacturing process for separating logic and memory array

Electromigration resistant and profile consistent contact arrays

Semiconductor device and method of manufacturing

Via for semiconductor device connection and methods of forming the...

Package to die connection system and method therefor

Manufacturing process for separating logic and memory array

Semiconductor device and bump formation process

Patents Applicationslast 30 patents

System and Method for Bonding Semiconductor Devices

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

VIA FOR SEMICONDUCTOR DEVICE CONNECTION

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME

HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS

COMPOSITE IC DIE PACKAGE INCLUDING AN ELECTRO-THERMO-MECHANICAL DIE...

NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Via for Semiconductor Device Connection and Methods of Forming the...

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

Semiconductor Device and Method of Manufacturing

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS

METHOD OF TRANSFERRING A PLURALITY OF MICRO LIGHT EMITTING DIODES T...

LIGHT EMITTING PACKAGE, AND MANUFACTURING METHOD THEREOF, AND CARRIER

ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS

Semiconductor Device and Method of Manufacturing

NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS

MANUFACTURING PROCESS FOR SEPARATING LOGIC AND MEMORY ARRAY

Semiconductor Device and Bump Formation Process

PACKAGED SEMICONDUCTOR DEVICE WITH A PARTICLE ROUGHENED SURFACE

SEMICONDUCTOR DEVICE PRODUCTION METHOD

HYBRID BONDING WITH THROUGH SUBSTRATE VIA (TSV)

MANUFACTURING PROCESS FOR SEPARATING LOGIC AND MEMORY ARRAY

ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS

Via for Semiconductor Device Connection and Methods of Forming the...

SUBSTRATE ASSEMBLY WITH SPACER ELEMENT

PACKAGED SEMICONDUCTOR DEVICE WITH A PARTICLE ROUGHENED SURFACE

HYBRID BONDING WITH THROUGH SUBSTRATE VIA (TSV)