involving guiding structures

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CPC
H01L2224/80136

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80136involving guiding structures

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Guide apparatus for transferring light-emitting devices onto a subs...
- Patent number 12,040,208
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Myunghee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembly by direct bonding between two elements, each ele...
- Patent number 11,305,372
- Issue date Apr 19, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Lea Di Cioccio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for self-assembling microelectronic components
- Patent number 11,121,117
- Issue date Sep 14, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Lea Di Cioccio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for mounting components in semiconductor fabricat...
- Patent number 10,438,922
- Issue date Oct 8, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,354,972
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,103,122
- Issue date Oct 16, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 9,991,242
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 9,748,198
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM OF PERFORMING COLLECTIVE DIE-TO-WAFER BONDING
- Publication number 20250022839
- Publication date Jan 16, 2025
- IHP GmbH-Innovations for High Performance Microelectronics/Leibniz-Instit. fu...
- Sebastian SCHULZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INORGANIC LIGHT EMITTING DIODE, DISPLAY MODULE AND MANUFACTURING ME...
- Publication number 20230006098
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Myunghee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUIDE APPARATUS FOR TRANSFERRING LIGHT-EMITTING DEVICES ONTO A SUBS...
- Publication number 20220384231
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Myunghee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELF-ASSEMBLING MICROELECTRONIC COMPONENTS
- Publication number 20200020665
- Publication date Jan 16, 2020
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Lea DI CIOCCIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20190051628
- Publication date Feb 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180254267
- Publication date Sep 6, 2018
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20170358551
- Publication date Dec 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR MOUNTING COMPONENTS IN SEMICONDUCTOR FABRICAT...
- Publication number 20170352641
- Publication date Dec 7, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20150287694
- Publication date Oct 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...
- Publication number 20150255444
- Publication date Sep 10, 2015
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20140011324
- Publication date Jan 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS

involving guiding structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Guide apparatus for transferring light-emitting devices onto a subs...

Method of assembly by direct bonding between two elements, each ele...

Method for self-assembling microelectronic components

Method and system for mounting components in semiconductor fabricat...

Method of manufacturing a semiconductor device

Hybrid bonding systems and methods for semiconductor wafers

Hybrid bonding systems and methods for semiconductor wafers

Semiconductor device, method of manufacturing a semiconductor devic...

Hybrid bonding systems and methods for semiconductor wafers

Patents Applicationslast 30 patents

METHOD AND SYSTEM OF PERFORMING COLLECTIVE DIE-TO-WAFER BONDING

INORGANIC LIGHT EMITTING DIODE, DISPLAY MODULE AND MANUFACTURING ME...

GUIDE APPARATUS FOR TRANSFERRING LIGHT-EMITTING DEVICES ONTO A SUBS...

METHOD FOR SELF-ASSEMBLING MICROELECTRONIC COMPONENTS

Hybrid Bonding Systems and Methods for Semiconductor Wafers

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Hybrid Bonding Systems and Methods for Semiconductor Wafers

METHOD AND SYSTEM FOR MOUNTING COMPONENTS IN SEMICONDUCTOR FABRICAT...

Hybrid Bonding Systems and Methods for Semiconductor Wafers

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...

Hybrid Bonding Systems and Methods for Semiconductor Wafers