involving guiding structures

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H01L2224/81136

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81136involving guiding structures

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 11,735,575
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder member mounting system
- Patent number 11,583,948
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Soo-Hwan Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding tools for bonding machines, bonding machines for bonding se...
- Patent number 11,342,301
- Issue date May 24, 2022
- Kulicke and Soffa Industries, Inc.
- Ai Jun Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder member mounting method and system
- Patent number 11,278,979
- Issue date Mar 22, 2022
- Samsung Electronics Co., Ltd.
- Soo-Hwan Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding tools for bonding machines, bonding machines for bonding se...
- Patent number 11,049,839
- Issue date Jun 29, 2021
- Kulicke and Soffa Industries, Inc.
- Ai Jun Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,679,931
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming high routing density int...
- Patent number 10,580,749
- Issue date Mar 3, 2020
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fluxless micro-piercing of solder balls, and resulting d...
- Patent number 10,515,918
- Issue date Dec 24, 2019
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus, chip bonding method and a chip package stru...
- Patent number 10,366,965
- Issue date Jul 30, 2019
- Industrial Technology Research Institute
- Shu-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 10,340,239
- Issue date Jul 2, 2019
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,249,559
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Jae-Woong Nah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of fluxless micro-piercing of solder balls, and resulting d...
- Patent number 10,163,840
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Teck Kheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature metal direct bonding
- Patent number 10,141,218
- Issue date Nov 27, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device, electronic device fabrication method, and electr...
- Patent number 10,115,694
- Issue date Oct 30, 2018
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip attach frame
- Patent number 10,056,346
- Issue date Aug 21, 2018
- International Business Machines Corporation
- Martin Eckert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded solder bumping
- Patent number 10,037,967
- Issue date Jul 31, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and methods for producing modular stacked integrated circuits
- Patent number 9,842,784
- Issue date Dec 12, 2017
- ZGLUE, INC.
- Jawad Nasrullah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 9,754,907
- Issue date Sep 5, 2017
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 9,691,739
- Issue date Jun 27, 2017
- Tessera Advanced Technologies, Inc.
- Michihiro Kawashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for insertion bonding and device thus obtained
- Patent number 9,508,665
- Issue date Nov 29, 2016
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature metal direct bonding
- Patent number 9,385,024
- Issue date Jul 5, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 9,324,629
- Issue date Apr 26, 2016
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 9,318,418
- Issue date Apr 19, 2016
- Tessera Advanced Technologies, Inc.
- Michihiro Kawashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for housing an electronic component in a device package and...
- Patent number 9,312,212
- Issue date Apr 12, 2016
- Infineon Technologies AG
- Klaus-Guenter Oppermann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for fabricating multi-chip module with multi-level interposer
- Patent number 9,281,268
- Issue date Mar 8, 2016
- Oracle International Corporation
- Eugene M. Chow
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Packaging process tools and packaging methods for semiconductor dev...
- Patent number 9,218,999
- Issue date Dec 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Carbon nanotube-solder composite structures for interconnects, proc...
- Patent number 9,214,420
- Issue date Dec 15, 2015
- Intel Corporation
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of manufacturing a circuit substrate
- Patent number 9,185,805
- Issue date Nov 10, 2015
- Murata Manufacturing Co., Ltd.
- Yutaka Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip interconnection having narrow interconnection sites on th...
- Patent number 9,159,665
- Issue date Oct 13, 2015
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...
- Publication number 20240329125
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Moise AVOCI UGWIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20230299067
- Publication date Sep 21, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20220384412
- Publication date Dec 1, 2022
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20220077103
- Publication date Mar 10, 2022
- Fuji Electric Co., Ltd.
- Narumi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MEMBER MOUNTING METHOD AND SYSTEM
- Publication number 20200108459
- Publication date Apr 9, 2020
- Samsung Electronics Co., Ltd.
- Soo-Hwan LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING TOOLS FOR BONDING MACHINES, BONDING MACHINES FOR BONDING SE...
- Publication number 20190229084
- Publication date Jul 25, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Ai Jun Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP BONDING APPARATUS, CHIP BONDING METHOD AND A CHIP PACKAGE STRU...
- Publication number 20190131271
- Publication date May 2, 2019
- Industrial Technology Research Institute
- Shu-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20190115247
- Publication date Apr 18, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...
- Publication number 20190019774
- Publication date Jan 17, 2019
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION MOLDED SOLDER BUMPING
- Publication number 20180277509
- Publication date Sep 27, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
- Publication number 20180033754
- Publication date Feb 1, 2018
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC DEVICE FABRICATION METHOD, AND ELECTR...
- Publication number 20170186718
- Publication date Jun 29, 2017
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ATTACH FRAME
- Publication number 20170162534
- Publication date Jun 8, 2017
- International Business Machines Corporation
- Martin Eckert
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM AND METHODS FOR PRODUCING MODULAR STACKED INTEGRATED CIRCUITS
- Publication number 20170062294
- Publication date Mar 2, 2017
- zGlue, Inc.
- Jawad Nasrullah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
- Publication number 20160322320
- Publication date Nov 3, 2016
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20140370658
- Publication date Dec 18, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging Process Tools and Packaging Methods for Semiconductor Dev...
- Publication number 20140331462
- Publication date Nov 13, 2014
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming High Routing Density Int...
- Publication number 20140319692
- Publication date Oct 30, 2014
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE-SOLDER COMPOSITE STRUCTURES FOR INTERCONNECTS, PROC...
- Publication number 20130341787
- Publication date Dec 26, 2013
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Application
Method for Housing an Electronic Component in a Device Package and...
- Publication number 20130292855
- Publication date Nov 7, 2013
- Klaus-Guenter Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE MODULE ASSEMBLY
- Publication number 20130284796
- Publication date Oct 31, 2013
- Cisco Technology, Inc.
- Mohan R. Nagar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20130233473
- Publication date Sep 12, 2013
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...
- Publication number 20130234328
- Publication date Sep 12, 2013
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF STACKING FLIP-CHIP ON WIRE-BONDED CHIP
- Publication number 20130147025
- Publication date Jun 13, 2013
- Marvell World Trade Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Performing Reflow in Bonding Processes
- Publication number 20130122652
- Publication date May 16, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES WITH DUAL OR MULTIPLE-ETCHED FLIP-CHIP CON...
- Publication number 20130099376
- Publication date Apr 25, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Process Tools and Packaging Methods for Semiconductor Dev...
- Publication number 20130089952
- Publication date Apr 11, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip Interconnection having Narrow Interconnection Sites on th...
- Publication number 20130026628
- Publication date Jan 31, 2013
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE, CIRCUIT MODULE AND METHOD FOR MANUFACTURING THE...
- Publication number 20130008586
- Publication date Jan 10, 2013
- Murata Manufacturing Co., Ltd.
- Yutaka FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER
- Publication number 20120266464
- Publication date Oct 25, 2012
- ORACLE INTERNATIONAL CORPORATION
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS

involving guiding structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding of bridge to multiple semiconductor chips

Bonding of bridge to multiple semiconductor chips

Solder member mounting system

Bonding tools for bonding machines, bonding machines for bonding se...

Solder member mounting method and system

Bonding tools for bonding machines, bonding machines for bonding se...

Ball grid array and land grid array assemblies fabricated using tem...

Semiconductor device and method of forming high routing density int...

Methods of fluxless micro-piercing of solder balls, and resulting d...

Chip bonding apparatus, chip bonding method and a chip package stru...

Tooling for coupling multiple electronic chips

Ball grid array and land grid array assemblies fabricated using tem...

Methods of fluxless micro-piercing of solder balls, and resulting d...

Room temperature metal direct bonding

Electronic device, electronic device fabrication method, and electr...

Chip attach frame

Injection molded solder bumping

System and methods for producing modular stacked integrated circuits

Tooling for coupling multiple electronic chips

Semiconductor device and method of manufacturing same

Method for insertion bonding and device thus obtained

Room temperature metal direct bonding

Tooling for coupling multiple electronic chips

Semiconductor device and method of manufacturing same

Method for housing an electronic component in a device package and...

Method for fabricating multi-chip module with multi-level interposer

Packaging process tools and packaging methods for semiconductor dev...

Carbon nanotube-solder composite structures for interconnects, proc...

Method of manufacturing a circuit substrate

Flip chip interconnection having narrow interconnection sites on th...

Patents Applicationslast 30 patents

METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SOLDER MEMBER MOUNTING METHOD AND SYSTEM

BONDING TOOLS FOR BONDING MACHINES, BONDING MACHINES FOR BONDING SE...

CHIP BONDING APPARATUS, CHIP BONDING METHOD AND A CHIP PACKAGE STRU...

ROOM TEMPERATURE METAL DIRECT BONDING

METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...

INJECTION MOLDED SOLDER BUMPING

TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS

ELECTRONIC DEVICE, ELECTRONIC DEVICE FABRICATION METHOD, AND ELECTR...

CHIP ATTACH FRAME

SYSTEM AND METHODS FOR PRODUCING MODULAR STACKED INTEGRATED CIRCUITS

TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS

ROOM TEMPERATURE METAL DIRECT BONDING

Packaging Process Tools and Packaging Methods for Semiconductor Dev...

Semiconductor Device and Method of Forming High Routing Density Int...

CARBON NANOTUBE-SOLDER COMPOSITE STRUCTURES FOR INTERCONNECTS, PROC...

Method for Housing an Electronic Component in a Device Package and...

SYSTEM IN PACKAGE MODULE ASSEMBLY

ROOM TEMPERATURE METAL DIRECT BONDING

METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...

METHOD OF STACKING FLIP-CHIP ON WIRE-BONDED CHIP

Methods for Performing Reflow in Bonding Processes

MICROELECTRONIC PACKAGES WITH DUAL OR MULTIPLE-ETCHED FLIP-CHIP CON...

Packaging Process Tools and Packaging Methods for Semiconductor Dev...

Flip Chip Interconnection having Narrow Interconnection Sites on th...

CIRCUIT SUBSTRATE, CIRCUIT MODULE AND METHOD FOR MANUFACTURING THE...

MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER