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H01L2224/81908

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81908involving monitoring

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pillars as stops for precise chip-to-chip separation
- Patent number 12,142,590
- Issue date Nov 12, 2024
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Joint structure in semiconductor package and manufacturing method t...
- Patent number 12,087,727
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillars as stops for precise chip-to-chip separation
- Patent number 11,842,973
- Issue date Dec 12, 2023
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Region-of-interest positioning for laser-assisted bonding
- Patent number 11,817,357
- Issue date Nov 14, 2023
- STATS ChipPAC Pte. Ltd.
- Wagno Alves Braganca
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor substrate, semiconductor package including semiconduc...
- Patent number 11,769,700
- Issue date Sep 26, 2023
- SK hynix Inc.
- Bok Gyu Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package interface with improved impedance continuity
- Patent number 11,756,905
- Issue date Sep 12, 2023
- CREDO TECHNOLOGY GROUP LIMITED
- Mengying Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,749,667
- Issue date Sep 5, 2023
- Kioxia Corporation
- Toshihiko Ohda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bond electrical characterization
- Patent number 11,616,187
- Issue date Mar 28, 2023
- Northrop Grumman Systems Corporation
- Aurelius L. Graninger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting system
- Patent number 11,587,804
- Issue date Feb 21, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillars as stops for precise chip-to-chip separation
- Patent number 11,574,885
- Issue date Feb 7, 2023
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Joint structure in semiconductor package and manufacturing method t...
- Patent number 11,502,056
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch processing oven and method
- Patent number 11,444,053
- Issue date Sep 13, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding with pre-deoxide process and apparatus for performing the same
- Patent number 11,342,302
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow oven for batch processing
- Patent number 11,335,662
- Issue date May 17, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser reflow apparatus and method for electronic components with mi...
- Patent number 11,276,665
- Issue date Mar 15, 2022
- LASERSSEL CO., LTD.
- Nam Seong Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method to enhance reliability in connection with arrange...
- Patent number 11,264,301
- Issue date Mar 1, 2022
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to enhance solder joint reliability
- Patent number 11,094,604
- Issue date Aug 17, 2021
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,024,619
- Issue date Jun 1, 2021
- TOSHIBA MEMORY CORPORATION
- Toshihiko Ohda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measurements of an integrated circuit chip and connected chip carri...
- Patent number 10,969,222
- Issue date Apr 6, 2021
- International Business Machines Corporation
- Elaine Cyr
- G01 - MEASURING TESTING
Information Patent Grant
Superconducting bump bond electrical characterization
- Patent number 10,950,778
- Issue date Mar 16, 2021
- Northrop Grumman Systems Corporation
- Aurelius L. Graninger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-selective sintering laser systems and methods thereof
- Patent number 10,722,947
- Issue date Jul 28, 2020
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Picking up irregular semiconductor chips
- Patent number 10,672,638
- Issue date Jun 2, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste having dilatancy, electrode connection structure i...
- Patent number 10,651,143
- Issue date May 12, 2020
- SHARP KABUSHIKI KAISHA
- Tomotoshi Satoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
System and method to enhance solder joint reliability
- Patent number 10,636,722
- Issue date Apr 28, 2020
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and processes for measuring thickness values of semiconduct...
- Patent number 10,269,758
- Issue date Apr 23, 2019
- Intel Corporation
- Zhihua Zou
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit packages with temperature sensor traces
- Patent number 10,260,961
- Issue date Apr 16, 2019
- Intel Corporation
- Shelby Ferguson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing a semiconductor device inclu...
- Patent number 10,217,676
- Issue date Feb 26, 2019
- TOSHIBA MEMORY CORPORATION
- Shinya Fukayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 10,199,349
- Issue date Feb 5, 2019
- Toray Engineering Co., Ltd.
- Katsumi Terada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and method of correcting offset amount of the same
- Patent number 10,068,872
- Issue date Sep 4, 2018
- Shinkawa Ltd.
- Makoto Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20240339432
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Wafer Oxide Removal and Reflow Treatment
- Publication number 20240282734
- Publication date Aug 22, 2024
- Air Products and Chemicals, Inc.
- Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...
- Publication number 20240194633
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
- Publication number 20240162179
- Publication date May 16, 2024
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...
- Publication number 20240128230
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Sinyeop LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240047410
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MONITORING GAS BYPRODUCTS OF A BONDING SYSTEM, AND RELAT...
- Publication number 20230260953
- Publication date Aug 17, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
- Publication number 20230187401
- Publication date Jun 15, 2023
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING SYSTEMS FOR BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES...
- Publication number 20230133526
- Publication date May 4, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Region-of-Interest Positioning for Laser-Assisted Bonding
- Publication number 20220399236
- Publication date Dec 15, 2022
- STATS ChipPAC Pte Ltd.
- Wagno Alves Braganca
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A D...
- Publication number 20220384384
- Publication date Dec 1, 2022
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20220359458
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220328436
- Publication date Oct 13, 2022
- SAMSUNG DISPLAY CO., LTD.
- Dae Ho SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
- Publication number 20220254751
- Publication date Aug 11, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser reflow apparatus and method for electronic components with mi...
- Publication number 20220157768
- Publication date May 19, 2022
- LASERSSEL CO., LTD.
- Nam Seong KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20220013492
- Publication date Jan 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Interface with Improved Impedance Continuity
- Publication number 20210375798
- Publication date Dec 2, 2021
- CREDO TECHNOLOGY GROUP LIMITED
- Mengying MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUC...
- Publication number 20210280476
- Publication date Sep 9, 2021
- SK HYNIX INC.
- Bok Gyu MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH PROCESSING OVEN AND METHOD
- Publication number 20210265301
- Publication date Aug 26, 2021
- Yield Engineering Systems, Inc.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPERCONDUCTING BUMP BOND ELECTRICAL CHARACTERIZATION
- Publication number 20210257532
- Publication date Aug 19, 2021
- Northrop Grumman Systems Corporation
- AURELIUS L. GRANINGER
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20210242191
- Publication date Aug 5, 2021
- Toshiba Memory Corporation
- Toshihiko Ohda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method to Enhance Solder Joint Reliability
- Publication number 20200219787
- Publication date Jul 9, 2020
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING BUMP BOND ELECTRICAL CHARACTERIZATION
- Publication number 20200220064
- Publication date Jul 9, 2020
- Northrop Grumman Systems Corporation
- AURELIUS L. GRANINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
- Publication number 20200176409
- Publication date Jun 4, 2020
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Laser reflow apparatus and method for electronic components with mi...
- Publication number 20200091108
- Publication date Mar 19, 2020
- LASERSSEL CO., LTD.
- Nam Seong KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...
- Publication number 20200006099
- Publication date Jan 2, 2020
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY
- Publication number 20190326194
- Publication date Oct 24, 2019
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
- Publication number 20190326251
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR MANUFACTURING APP...
- Publication number 20190296001
- Publication date Sep 26, 2019
- Toshiba Memory Corporation
- Toshihiko Ohda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CON...
- Publication number 20190157229
- Publication date May 23, 2019
- SHARP KABUSHIKI KAISHA
- Tomotoshi SATOH
- B22 - CASTING POWDER METALLURGY

involving monitoring

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder reflow apparatus and method of manufacturing an electronic d...

Pillars as stops for precise chip-to-chip separation

Joint structure in semiconductor package and manufacturing method t...

Pillars as stops for precise chip-to-chip separation

Region-of-interest positioning for laser-assisted bonding

Semiconductor substrate, semiconductor package including semiconduc...

Package interface with improved impedance continuity

Semiconductor manufacturing apparatus

Superconducting bump bond electrical characterization

Component mounting system

Pillars as stops for precise chip-to-chip separation

Joint structure in semiconductor package and manufacturing method t...

Batch processing oven and method

Bonding with pre-deoxide process and apparatus for performing the same

Solder reflow oven for batch processing

Laser reflow apparatus and method for electronic components with mi...

System and method to enhance reliability in connection with arrange...

System and method to enhance solder joint reliability

Semiconductor manufacturing apparatus

Measurements of an integrated circuit chip and connected chip carri...

Superconducting bump bond electrical characterization

Micro-selective sintering laser systems and methods thereof

Picking up irregular semiconductor chips

Conductive paste having dilatancy, electrode connection structure i...

System and method to enhance solder joint reliability

Systems and processes for measuring thickness values of semiconduct...

Integrated circuit packages with temperature sensor traces

Method and apparatus for manufacturing a semiconductor device inclu...

Mounting device and mounting method

Mounting apparatus and method of correcting offset amount of the same

Patents Applicationslast 30 patents

JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

Apparatus and Method for Wafer Oxide Removal and Reflow Treatment

DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...

PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION

SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

METHODS OF MONITORING GAS BYPRODUCTS OF A BONDING SYSTEM, AND RELAT...

PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION

BONDING SYSTEMS FOR BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES...

Region-of-Interest Positioning for Laser-Assisted Bonding

ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A D...

JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

Laser reflow apparatus and method for electronic components with mi...

JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

Package Interface with Improved Impedance Continuity

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUC...

BATCH PROCESSING OVEN AND METHOD

SUPERCONDUCTING BUMP BOND ELECTRICAL CHARACTERIZATION

SEMICONDUCTOR MANUFACTURING APPARATUS

System and Method to Enhance Solder Joint Reliability

SUPERCONDUCTING BUMP BOND ELECTRICAL CHARACTERIZATION

PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION

Laser reflow apparatus and method for electronic components with mi...

COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...

SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY

Bonding with Pre-Deoxide Process and Apparatus for Performing the Same

SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR MANUFACTURING APP...

CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CON...