involving monitoring

Follow

Industry

CPC
H01L2224/277

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/277involving monitoring

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method of measuring underfill profile of underfill cavity having so...
- Patent number 11,355,361
- Issue date Jun 7, 2022
- Coretech System Co., Ltd.
- Yu-En Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
- Patent number 10,707,184
- Issue date Jul 7, 2020
- Nitto Denko Corporation
- Yuki Sugo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINTERING FILM FRAMES AND RELATED METHODS
- Publication number 20240304596
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Dukyong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING TRANSPARENT MATERIAL FOR TRANSPARENT PROCESS PE...
- Publication number 20230260852
- Publication date Aug 17, 2023
- Intel Corporation
- Huynh Hai Phuong NGUYEN
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET
- Publication number 20180331063
- Publication date Nov 15, 2018
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru KURITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Bonding Sheet and Thermal Bonding Sheet with Dicing Tape
- Publication number 20180269175
- Publication date Sep 20, 2018
- NITTO DENKO CORPORATION
- Yuki Sugo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR...
- Publication number 20160254243
- Publication date Sep 1, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru KURITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR