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H01L2224/277
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/277
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Patents Grants
last 30 patents
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Patent Grant
Method of measuring underfill profile of underfill cavity having so...
Patent number
11,355,361
Issue date
Jun 7, 2022
Coretech System Co., Ltd.
Yu-En Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
Patent number
10,707,184
Issue date
Jul 7, 2020
Nitto Denko Corporation
Yuki Sugo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
SINTERING FILM FRAMES AND RELATED METHODS
Publication number
20240304596
Publication date
Sep 12, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Dukyong LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS INCLUDING TRANSPARENT MATERIAL FOR TRANSPARENT PROCESS PE...
Publication number
20230260852
Publication date
Aug 17, 2023
Intel Corporation
Huynh Hai Phuong NGUYEN
G01 - MEASURING TESTING
Information
Patent Application
METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET
Publication number
20180331063
Publication date
Nov 15, 2018
DOWA ELECTRONICS MATERIALS CO., LTD.
Satoru KURITA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Thermal Bonding Sheet and Thermal Bonding Sheet with Dicing Tape
Publication number
20180269175
Publication date
Sep 20, 2018
NITTO DENKO CORPORATION
Yuki Sugo
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR...
Publication number
20160254243
Publication date
Sep 1, 2016
DOWA ELECTRONICS MATERIALS CO., LTD.
Satoru KURITA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR