involving monitoring

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H01L2224/037

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/037involving monitoring

Industries

Patents Grantslast 30 patents

Information Patent Grant
Iterative formation of damascene interconnects
- Patent number 12,148,721
- Issue date Nov 19, 2024
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iterative formation of damascene interconnects
- Patent number 11,430,753
- Issue date Aug 30, 2022
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing connection structure of semiconductor chip...
- Patent number 11,264,339
- Issue date Mar 1, 2022
- Samsung Electronics Co., Ltd.
- Gyujin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,804,169
- Issue date Oct 13, 2020
- Mitsubishi Electric Corporation
- Seiya Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding semiconductor chips to a landing wafer
- Patent number 10,797,016
- Issue date Oct 6, 2020
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,741,650
- Issue date Aug 11, 2020
- TOSHIBA MEMORY CORPORATION
- Tsutomu Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond structures and the methods of forming the same
- Patent number 10,510,699
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond structures and the methods of forming the same
- Patent number 10,269,741
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of adaptive patterning for panelize...
- Patent number 9,978,655
- Issue date May 22, 2018
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond structures and the methods of forming the same
- Patent number 9,893,028
- Issue date Feb 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated optical inspection of unit specific patterning
- Patent number 9,401,313
- Issue date Jul 26, 2016
- Deca Technologies, Inc.
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of adaptive patterning for panelize...
- Patent number 9,397,069
- Issue date Jul 19, 2016
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with low-melting-temperature conductive reg...
- Patent number 9,318,313
- Issue date Apr 19, 2016
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered chip package and method of manufacturing same
- Patent number 8,618,646
- Issue date Dec 31, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 8,410,427
- Issue date Apr 2, 2013
- Toyota Jidosha Kabushiki Kaisha
- Yasutaka Takeuchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240234348
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240136309
- Publication date Apr 25, 2024
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming Same
- Publication number 20230040030
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ITERATIVE FORMATION OF DAMASCENE INTERCONNECTS
- Publication number 20220359437
- Publication date Nov 10, 2022
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE CIRCUIT
- Publication number 20220173000
- Publication date Jun 2, 2022
- InnoLux Corporation
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ITERATIVE FORMATION OF DAMASCENE INTERCONNECTS
- Publication number 20220013478
- Publication date Jan 13, 2022
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CONNECTION STRUCTURE OF SEMICONDUCTOR CHIP...
- Publication number 20200273817
- Publication date Aug 27, 2020
- Samsung Electronics Co., Ltd.
- Gyujin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190295907
- Publication date Sep 26, 2019
- Mitsubishi Electric Corporation
- Seiya NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Structures and the Methods of Forming the Same
- Publication number 20190252335
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Structures and the Methods of Forming the Same
- Publication number 20180166408
- Publication date Jun 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Structures and the Methods of Forming the Same
- Publication number 20170186715
- Publication date Jun 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING
- Publication number 20160141213
- Publication date May 19, 2016
- DECA TECHNOLOGIES INC
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZE...
- Publication number 20150364444
- Publication date Dec 17, 2015
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REG...
- Publication number 20130285056
- Publication date Oct 31, 2013
- STMicroelectronics S.r. I.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20120086130
- Publication date Apr 12, 2012
- SAE MAGNETICS (H. K) LTD.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20110240846
- Publication date Oct 6, 2011
- Toyota Jidosha Kabushiki Kaisha
- Yasutaka TAKEUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

involving monitoring

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Iterative formation of damascene interconnects

Iterative formation of damascene interconnects

Method of manufacturing connection structure of semiconductor chip...

Semiconductor device

Method for bonding semiconductor chips to a landing wafer

Semiconductor device and method of manufacturing the same

Bond structures and the methods of forming the same

Bond structures and the methods of forming the same

Semiconductor device and method of adaptive patterning for panelize...

Bond structures and the methods of forming the same

Automated optical inspection of unit specific patterning

Semiconductor device and method of adaptive patterning for panelize...

Semiconductor structure with low-melting-temperature conductive reg...

Layered chip package and method of manufacturing same

Semiconductor device, method for manufacturing semiconductor device...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

Semiconductor Package and Method of Forming Same

ITERATIVE FORMATION OF DAMASCENE INTERCONNECTS

MANUFACTURING METHOD OF PACKAGE CIRCUIT

ITERATIVE FORMATION OF DAMASCENE INTERCONNECTS

METHOD OF MANUFACTURING CONNECTION STRUCTURE OF SEMICONDUCTOR CHIP...

SEMICONDUCTOR DEVICE

Bond Structures and the Methods of Forming the Same

Bond Structures and the Methods of Forming the Same

Bond Structures and the Methods of Forming the Same

AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING

SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZE...

SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REG...

LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...