involving monitoring

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H01L2224/83908

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83908involving monitoring

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,074,152
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Dae Hyuk Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage curing methodology by inducing curvature
- Patent number 11,929,260
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Fang Jie Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing a light-emitting device and a method for manuf...
- Patent number 11,916,041
- Issue date Feb 27, 2024
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and manufacturing method for same
- Patent number 11,776,943
- Issue date Oct 3, 2023
- Samsung Display Co., Ltd.
- Hyun A Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 11,742,321
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for reel-to-reel laser reflow
- Patent number 11,515,287
- Issue date Nov 29, 2022
- LASERSSEL CO., LTD.
- Byung Rock Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating high-power module
- Patent number 11,426,793
- Issue date Aug 30, 2022
- National Cheng Kung University
- In-Gann Chen
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for bonding substrates
- Patent number 11,315,901
- Issue date Apr 26, 2022
- EV Group E. Thallner GmbH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for reel-to-reel laser reflow
- Patent number 11,257,783
- Issue date Feb 22, 2022
- LASERSSEL CO., LTD.
- Byung Rock Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for setting conditions for heating semiconductor chip during...
- Patent number 11,201,132
- Issue date Dec 14, 2021
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method
- Patent number 11,201,133
- Issue date Dec 14, 2021
- Samsung Display Co., Ltd.
- Joo Nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus incorporating variable force distribution
- Patent number 11,121,113
- Issue date Sep 14, 2021
- ASM Technology Singapore Pte. Ltd.
- Ming Yeung Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element bonding apparatus and semiconductor element b...
- Patent number 11,037,901
- Issue date Jun 15, 2021
- Toyota Jidosha Kabushiki Kaisha
- Hideyuki Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 11,031,369
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method inspecting bonded semiconductor dice
- Patent number 11,011,435
- Issue date May 18, 2021
- ASM Technology Singapore Pte. Ltd.
- Wui Fung Sze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,985,132
- Issue date Apr 20, 2021
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermal interface material on package
- Patent number 10,896,862
- Issue date Jan 19, 2021
- International Business Machines Corporation
- Isabel De Sousa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of determining thermal impedance of a sintering layer and a...
- Patent number 10,847,494
- Issue date Nov 24, 2020
- AGILE POWER SWITCH 3D—INTEGRATION APSI3D
- Jacques Pierre Henri Favre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond chucks having individually-controllable regions, and associate...
- Patent number 10,770,422
- Issue date Sep 8, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond chucks having individually-controllable regions, and associate...
- Patent number 10,770,421
- Issue date Sep 8, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,756,046
- Issue date Aug 25, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods for improved die bonding
- Patent number 10,756,048
- Issue date Aug 25, 2020
- Skyworks Solutions, Inc.
- José Manuel Flores
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-selective sintering laser systems and methods thereof
- Patent number 10,722,947
- Issue date Jul 28, 2020
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of determining curing conditions, method of producing circui...
- Patent number 10,658,329
- Issue date May 19, 2020
- Sony Corporation
- Takeshi Ichimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatuses for high temperature bonding controlled pro...
- Patent number 10,500,661
- Issue date Dec 10, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Hannes Martin Hinrich Greve
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for detecting and removing defective integrate...
- Patent number 10,504,801
- Issue date Dec 10, 2019
- Texas Instruments Incorporated
- Zheng Qing Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 10,497,667
- Issue date Dec 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,438,920
- Issue date Oct 8, 2019
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEV...
- Publication number 20240313153
- Publication date Sep 19, 2024
- SAMSUNG DISPLAY CO., LTD.
- Futoshi YOSHIDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MOUNTING AN ELECTRONIC COMPONENT ONTO A SUBSTRATE BY MEA...
- Publication number 20240170450
- Publication date May 23, 2024
- SAFRAN ELECTRONICS & DEFENSE
- Jean-Christophe RIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL
- Publication number 20240038716
- Publication date Feb 1, 2024
- Western Digital Technologies, Inc.
- Choo Par Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF
- Publication number 20230420406
- Publication date Dec 28, 2023
- KULICKE AND SOFFA HI-TECH CO., LTD.
- Lu-Min Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES AND APPLICATIONS FOR CATALYST INFLUENCED CHEMICAL ETCHING
- Publication number 20230230954
- Publication date Jul 20, 2023
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...
- Publication number 20230163094
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Euisun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220406747
- Publication date Dec 22, 2022
- SHINKAWA LTD.
- Hideharu NIHEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REPAIRING A LIGHT-EMITTING DEVICE AND A METHOD FOR MANUF...
- Publication number 20220181293
- Publication date Jun 9, 2022
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20220173068
- Publication date Jun 2, 2022
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD FOR SAME
- Publication number 20220013517
- Publication date Jan 13, 2022
- SAMSUNG DISPLAY CO., LTD.
- HYUN A LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SHINGLED SOLAR MODULE AND THE SHINGLED SOLA...
- Publication number 20210343887
- Publication date Nov 4, 2021
- Chengdu Yefan Science and Technology Co., Ltd.
- Erliang DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BOND WAVE PROPAGATION CONTROL
- Publication number 20210272928
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS INCORPORATING VARIABLE FORCE DISTRIBUTION
- Publication number 20210225800
- Publication date Jul 22, 2021
- ASM Technology Singapore Pte Ltd
- Ming Yeung WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SETTING CONDITIONS FOR HEATING SEMICONDUCTOR CHIP DURING...
- Publication number 20200286854
- Publication date Sep 10, 2020
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT BONDING APPARATUS AND SEMICONDUCTOR ELEMENT B...
- Publication number 20200235071
- Publication date Jul 23, 2020
- Toyota Jidosha Kabushiki Kaisha
- Hideyuki MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...
- Publication number 20200212002
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- B32 - LAYERED PRODUCTS
Information Patent Application
BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...
- Publication number 20200212003
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of Fabricating High-Power Module
- Publication number 20200171578
- Publication date Jun 4, 2020
- National Cheng Kung University
- In-Gann Chen
- B22 - CASTING POWDER METALLURGY
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20200168580
- Publication date May 28, 2020
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD
- Publication number 20200168581
- Publication date May 28, 2020
- SAMSUNG DISPLAY CO., LTD.
- Joo Nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BOND WAVE PROPAGATION CONTROL
- Publication number 20200051950
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
A METHOD OF DETERMINING THERMAL IMPEDANCE OF A SINTERING LAYER AND...
- Publication number 20200043885
- Publication date Feb 6, 2020
- IRT SAINT EXUPERY (AESE)
- Jacques Pierre Henri FAVRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR IMPROVED DIE BONDING
- Publication number 20200006283
- Publication date Jan 2, 2020
- SKYWORKS SOLUTIONS, INC.
- José Manuel FLORES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL ON PACKAGE
- Publication number 20180190565
- Publication date Jul 5, 2018
- International Business Machines Corporation
- Isabel DE SOUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM
- Publication number 20180158796
- Publication date Jun 7, 2018
- TOKYO ELECTRON LIMITED
- Yoshitaka OTSUKA
- B32 - LAYERED PRODUCTS
Information Patent Application
MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF
- Publication number 20180065186
- Publication date Mar 8, 2018
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
THERMAL INTERFACE MATERIAL ON PACKAGE
- Publication number 20180047655
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Isabel DE SOUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MEASURING PHYSICAL CHARACTERISTICS OF SEMIC...
- Publication number 20180038806
- Publication date Feb 8, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Deepak Sood
- G01 - MEASURING TESTING
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20180019223
- Publication date Jan 18, 2018
- TORAY ENGINEERING CO., LTD.
- Katsumi TERADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20180012833
- Publication date Jan 11, 2018
- Kabushiki Kaisha Toyota Jidoshokki
- Naoki KATO
- H01 - BASIC ELECTRIC ELEMENTS

involving monitoring

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding apparatus and bonding method

Display device

Low warpage curing methodology by inducing curvature

Method for repairing a light-emitting device and a method for manuf...

Display panel and manufacturing method for same

Apparatus for bond wave propagation control

Device and method for reel-to-reel laser reflow

Method of fabricating high-power module

Method for bonding substrates

Device and method for reel-to-reel laser reflow

Method for setting conditions for heating semiconductor chip during...

Bonding apparatus and method

Bonding apparatus incorporating variable force distribution

Semiconductor element bonding apparatus and semiconductor element b...

Apparatus for bond wave propagation control

Apparatus and method inspecting bonded semiconductor dice

Bonding apparatus, bonding system, bonding method and storage medium

Thermal interface material on package

Method of determining thermal impedance of a sintering layer and a...

Bond chucks having individually-controllable regions, and associate...

Bond chucks having individually-controllable regions, and associate...

Bonding apparatus, bonding system, bonding method and storage medium

Methods for improved die bonding

Micro-selective sintering laser systems and methods thereof

Method of determining curing conditions, method of producing circui...

Method for bonding substrates together, and substrate bonding device

Methods and apparatuses for high temperature bonding controlled pro...

Method and apparatus for detecting and removing defective integrate...

Apparatus for bond wave propagation control

Bonding apparatus, bonding system, bonding method and storage medium

Patents Applicationslast 30 patents

PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEV...

METHOD FOR MOUNTING AN ELECTRONIC COMPONENT ONTO A SUBSTRATE BY MEA...

SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL

INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF

PROCESSES AND APPLICATIONS FOR CATALYST INFLUENCED CHEMICAL ETCHING

APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...

BONDING APPARATUS AND BONDING METHOD

METHOD FOR REPAIRING A LIGHT-EMITTING DEVICE AND A METHOD FOR MANUF...

APPARATUS AND METHOD FOR BONDING SUBSTRATES

DISPLAY PANEL AND MANUFACTURING METHOD FOR SAME

METHOD OF MANUFACTURING SHINGLED SOLAR MODULE AND THE SHINGLED SOLA...

APPARATUS FOR BOND WAVE PROPAGATION CONTROL

BONDING APPARATUS INCORPORATING VARIABLE FORCE DISTRIBUTION

METHOD FOR SETTING CONDITIONS FOR HEATING SEMICONDUCTOR CHIP DURING...

SEMICONDUCTOR ELEMENT BONDING APPARATUS AND SEMICONDUCTOR ELEMENT B...

BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...

BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...

Method of Fabricating High-Power Module

APPARATUS AND METHOD FOR BONDING SUBSTRATES

BONDING APPARATUS AND METHOD

APPARATUS FOR BOND WAVE PROPAGATION CONTROL

A METHOD OF DETERMINING THERMAL IMPEDANCE OF A SINTERING LAYER AND...

METHODS FOR IMPROVED DIE BONDING

THERMAL INTERFACE MATERIAL ON PACKAGE

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM

MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF

THERMAL INTERFACE MATERIAL ON PACKAGE

SYSTEMS AND METHODS FOR MEASURING PHYSICAL CHARACTERISTICS OF SEMIC...

MOUNTING DEVICE AND MOUNTING METHOD

SEMICONDUCTOR MODULE