TREA

involving movement of a part of the bonding apparatus

Follow

Industry

  • CPC
  • H01L2224/83148
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83148involving movement of a part of the bonding apparatus
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Pressurized underfill cure
    • Patent number 8,008,122
    • Issue date Aug 30, 2011
    • International Business Machines Corporation
    • Michael A. Gaynes
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents